20 Years Experience Custom PCBA Manufacturing PCB PCBA Assembly Service OEM PCBA Board Factory Video

Name: 20 Years Experience Custom PCBA Manufacturing PCB PCBA Assembly Service OEM PCBA Board Factory
Uploaded: 2024-04-17T14:39:33+08:00
Description: 20 Years Experience Custom PCBA Manufacturing PCB PCBA Assembly Service OEM PCBA Board Factory Specification PCB capability and services: 1. Single-sided, double side & multi-layer PCB. FPC. Flex R

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Price

Purchase Qty. Reference FOB Price

10-99 Pieces US$5.00

100-999 Pieces US$2.30

1,000+ Pieces US$0.87

Sepcifications

Type Customized
Dielectric FR-4
Material Aluminum Covered Copper Foil Layer
Application Consumer Electronics
Flame Retardant Properties V0
Mechanical Rigid Customized
Processing Technology Customized
Base Material Aluminum
Insulation Materials Organic Resin
Brand OEM/ODM
Transport Package Antistatic Package+Plastic Box and Carton Box
Specification Customized
Trademark Customized
Origin Shenzhen China
PCBA-Testing X-ray, Aoi
Processing Electrolytic Foil
SMT Capacity >2 Million Points/Day
DIP Capacity >100K Parts/Day
Certification RoHS, CCC, ISO
Min. Space of BGA +/- 0.3mm
Min.Pin Space of IC 0.3mm
Max.Precision of IC Assembly 0.03mm
Surface Finishing Lead-Free HASL
Number of Layers 4-10 Layer
Board Thickness 1.6mm

Product Description

20 Years Experience Custom PCBA Manufacturing PCB PCBA Assembly Service OEM PCBA Board Factory Specification PCB capability and services: 1. Single-sided, double side &multi-layer PCB. FPC. Flex Rigid PCB with competitive price, good quality and excellent service. 2. CEM-1, CEM-3 FR-4, ...

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Shenzhen Hongzhou Smart Technology Co., Ltd.

Diamond Member Since 2020

Audited Supplier

Business Type Manufacturer/Factory & Trading Company
Main Products Self Service KIOSK
Registered Capital 147802.18 USD
Plant Area 3200 square meters
Management System Certification ISO9001:2015
OEM/ODM Availability Yes

PCB Assembly Service Comparison

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Transaction Info
	Quick View 20 Years Experience Custom PCBA Manufacturing PCB PCBA Assembly Service OEM PCBA Board Factory Contact Now	Quick View Power Bank OEM Power Supply PCBA PCB Assembly Circuit Board Design Contact Now	Quick View Intel Chipset - Socket P LGA-3647-1 X Retail Pack Computer Motherboard OEM Manufacturing PCBA Contact Now	Quick View Slim Type Mini PCI-E Msata SSD Hard Disk Manufacturing PCBA OEM Contact Now	Quick View Can-Bus Shield V2 Compatible Arduino Controller Transceiver Single Board Computer OEM manufacturer PCBA Contact Now
Price	US $ 0.87-5.00/ Piece	US $ 2.00-9.00/ Piece	US $ 0.03-10.00/ Piece	US $ 0.88-20.00/ Piece	US $ 0.03-10.00/ Piece
Min Order	10 Pieces	1 Pieces	1 Pieces	1 Pieces	1 Pieces
Trade Terms	-	-	-	-	-
Payment Terms	T/T	T/T	T/T, D/P, Western Union, Paypal	T/T, D/P, Western Union	T/T, D/P, Western Union, Paypal
Quality Control
Product Certification	RoHS, CCC, ISO	-	-	-	-
Management System Certification	ISO 9001, IATF16949, ISO 13485	ISO 9001, ISO 14000, IATF16949, GMP	ISO 9001, IATF16949	ISO 9001, IATF16949	ISO 9001, IATF16949
Trade Capacity
Export Markets	Domestic	North America, Eastern Europe, Africa, Mid East, Western Europe	North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia	North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia	North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia
Annual Export Revenue	-	-	-	-	-
Business Model	OEM, ODM	OEM, ODM, Others	OEM, ODM	OEM, ODM	OEM, ODM
Average Lead Time	Off-season: 1 Month(s) Peak-season: 1-3 Month(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	-	-	-
Product Attributes
Specification	Type: Customized; Dielectric: FR-4; Material: Aluminum Covered Copper Foil Layer; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Customized; Processing Technology: Customized; Base Material: Aluminum; Insulation Materials: Organic Resin; Brand: OEM/ODM; PCBA-Testing: X-ray, Aoi; Processing: Electrolytic Foil; SMT Capacity: >2 Million Points/Day; DIP Capacity: >100K Parts/Day; Min. Space of BGA: +/- 0.3mm; Min.Pin Space of IC: 0.3mm; Max.Precision of IC Assembly: 0.03mm; Surface Finishing: Lead-Free HASL; Number of Layers: 4-10 Layer; Board Thickness: 1.6mm;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Medical Instruments; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Organic Resin; Brand: Jingxin;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy Resin + Polyimide Resin; Application: Consumer Electronics; Flame Retardant Properties: V2; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: New Chip; Capacity: 1000000; OEM/ODM: Available; Sample: Available; Surface Treatment: OSP, Enig, HASL, AG Immersion; Certificate Gurantee: Yes; Test: 100%E-Testing; Min Bonding Pad Diameter: 10mil; Min Thickness of Soldermask: 10um; Color of Silk-Screen: White, Yellow, Black; Data File Format: Gerber File and Drilling File, Protel Series,...; Material for PCB: Fr-4, High Tg Fr$, Halogen Free,Rogers, Cem-1, Ari; Layer Count: 1-20 Layers; Shipping: DHL/UPS/FedEx/Air/Sea;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Complex; Application: Computer; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Organic Resin; Brand: New Chip; Layer: 1-32 Layers; Service: OEM/ODM; OEM/ODM: Available; Test: 100%E-Testing; Layer Count: 1-20 Layers; Shipping: DHL/UPS/FedEx/Air/Sea; Surface Treatmen: OSP, Enig, HASL, AG Immersion; Certificate Gurantee: Yes;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy Resin + Polyimide Resin; Application: Consumer Electronics; Flame Retardant Properties: V2; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: New Chip; Capacity: 1000000; OEM/ODM: Available; Sample: Available; Surface Treatment: OSP, Enig, HASL, AG Immersion; Certificate Gurantee: Yes; Test: 100%E-Testing; Min Bonding Pad Diameter: 10mil; Min Thickness of Soldermask: 10um; Color of Silk-Screen: White, Yellow, Black; Data File Format: Gerber File and Drilling File, Protel Series,...; Material for PCB: Fr-4, High Tg Fr$, Halogen Free,Rogers, Cem-1, Ari; Layer Count: 1-20 Layers; Shipping: DHL/UPS/FedEx/Air/Sea;
Supplier Name	Shenzhen Hongzhou Smart Technology Co., Ltd.	Shenzhen Jingxin Electronic Technology Co., Ltd.	Shenzhen New Chip international Ltd	Shenzhen New Chip international Ltd	Shenzhen New Chip international Ltd
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