Specification |
Metal Coating: Tin;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
PCBA-Testing: X-ray, Aoi;
Processing: Electrolytic Foil;
SMT Capacity: >2 Million Points/Day;
DIP Capacity: >100K Parts/Day;
Min. Space of BGA: +/- 0.3mm;
Min.Pin Space of IC: 0.3mm;
Max.Precision of IC Assembly: 0.03mm;
Surface Finishing: Lead-Free HASL;
Number of Layers: 4-10 Layer;
Board Thickness: 1.6mm;
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Metal Coating: Tin;
Mode of Production: SMT;
Layers: 1-22 Layers;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Solder Resist Color: Green;Red;Yellow;Black;White;
Order Qty: No Limited;
Shape: Retangular, Round, Slots, Cutouts, Complex, Irreg;
Surface Finished: HASL, Gold Finger, OSP, Enig, Peelable Mask;
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Metal Coating: Tin;
Mode of Production: SMT;
Layers: 1-22 Layers;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Solder Resist Color: Green;Red;Yellow;Black;White;
Order Qty: No Limited;
Shape: Retangular, Round, Slots, Cutouts, Complex, Irreg;
Surface Finished: HASL, Gold Finger, OSP, Enig, Peelable Mask;
|
Metal Coating: Tin;
Mode of Production: SMT;
Layers: 1-22 Layers;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Solder Resist Color: Green;Red;Yellow;Black;White;
Order Qty: No Limited;
Shape: Retangular, Round, Slots, Cutouts, Complex, Irreg;
Surface Finished: HASL, Gold Finger, OSP, Enig, Peelable Mask;
|
Metal Coating: Tin;
Mode of Production: SMT;
Layers: 1-22 Layers;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Solder Resist Color: Green;Red;Yellow;Black;White;
Order Qty: No Limited;
Shape: Retangular, Round, Slots, Cutouts, Complex, Irreg;
Surface Finished: HASL, Gold Finger, OSP, Enig, Peelable Mask;
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