PCB Assembly
US$0.76-5.00 / Piece
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What is PCBA PCB Bom Gerber Files 14 Years Professional OEM Custom PCBA Manufacturer PCB Board Assembly Service

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

10-999 Pieces US$5.00

1,000-4,999 Pieces US$2.10

5,000+ Pieces US$0.76

Sepcifications

  • Type Customized
  • Dielectric FR-4
  • Material Aluminum Covered Copper Foil Layer
  • Application Communication
  • Flame Retardant Properties V0
  • Mechanical Rigid Customized
  • Processing Technology Customized
  • Base Material Aluminum
  • Insulation Materials Epoxy Resin
  • Brand OEM/ODM
  • Transport Package Antistatic Package+Plastic Box and Carton Box
  • Specification Customized
  • Trademark Customized
  • Origin Shenzhen China
  • PCBA-Testing X-ray, Aoi
  • Processing Electrolytic Foil
  • SMT Capacity >2 Million Points/Day
  • DIP Capacity >100K Parts/Day
  • Certification RoHS, CCC, ISO
  • Min. Space of BGA +/- 0.3mm
  • Min.Pin Space of IC 0.3mm
  • Max.Precision of IC Assembly 0.03mm
  • Surface Finishing Lead-Free HASL
  • Number of Layers 4-10 Layer
  • Board Thickness 1.6mm

Product Description

Pcba Pcb Bom Gerber Files 14 Years Professional OEM Custom Pcba Manufacturer Pcb Board Assembly Service Files and Requirment for PCB,PCBA quotation: A BOM (Bill of Materials) with reference designators: component description, manufacturer's name and part number. PCB Gerber files. A PCB ...

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PCB Assembly Comparison
Transaction Info
Price US $ 0.76-5.00/ Piece US $ 0.10-0.30/ Piece US $ 0.1/ PCS US $ 0.10-0.65/ PCS US $ 0.1/ PCS
Min Order 10 Pieces 1 Pieces 1 PCS 1 PCS 1 PCS
Trade Terms - FOB, CIF, DDP, DAP, CIP, EXW FOB, DAT, DDP, EXW FOB, DAT, DDP, EXW FOB, DAT, DDP, CPT, FCA
Payment Terms T/T L/C, T/T, Western Union, Paypal L/C, T/T, Western Union L/C, T/T, Western Union L/C, T/T, D/P, Western Union
Quality Control
Product Certification RoHS, CCC, ISO - - - -
Management System Certification ISO 9001, IATF16949, ISO 13485 ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, IATF16949 ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, IATF16949 ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, IATF16949 ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, IATF16949
Trade Capacity
Export Markets Domestic North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe
Annual Export Revenue - - - - -
Business Model OEM, ODM OEM OEM OEM OEM
Average Lead Time Off-season: 1 Month(s)
Peak-season: 1-3 Month(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Product Attributes
Specification
Type: Customized;
Dielectric: FR-4;
Material: Aluminum Covered Copper Foil Layer;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Customized;
Processing Technology: Customized;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Brand: OEM/ODM;
PCBA-Testing: X-ray, Aoi;
Processing: Electrolytic Foil;
SMT Capacity: >2 Million Points/Day;
DIP Capacity: >100K Parts/Day;
Min. Space of BGA: +/- 0.3mm;
Min.Pin Space of IC: 0.3mm;
Max.Precision of IC Assembly: 0.03mm;
Surface Finishing: Lead-Free HASL;
Number of Layers: 4-10 Layer;
Board Thickness: 1.6mm;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Uc;
Layer Count: 4layer;
Board Thickness: 1.6mm;
Board Material: Fr4;
Surface Finish: Enig/1u'';
Soldermask Color: Black;
Cooper Thickness: 1oz;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Immersional Gold;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Ucreate PCB;
Board Thickness: 1.6mm;
Surface Finihsing: Immersional Gold;
Lead Time: 6-8 Working Days;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Immersional Gold;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Ucreate PCB;
Board Thickness: 1.2~2.0mm;
Surface Finihsing: Immersional Gold;
Lead Time: 6-8 Working Days;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Uc;
Layer: 1-24;
Board Thickness: 2.0mm;
Copper Thickness: 2oz;
Surface Finihsing: Immersion Gold;
Solder Mask Color: Red;
Ink Color: White;
Special: Gold Fingers;
Condition: Original Made;
PCB Testing: E-Testing; Flying Probe Testing;
Lead Time: 6-8 Working Days;
Supplier Name

Shenzhen Hongzhou Smart Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Ucreate PCB Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Ucreate PCB Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Ucreate PCB Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Ucreate PCB Co., Ltd.

China Supplier - Diamond Member Audited Supplier