Specification |
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: Used;
Product Name: OEM Reverse PCBA Engineering for Mobile Phone;
Shipment Way: by Air by Sea;
Payment Way: Tt;
Min.Pin Space of IC: 0.3mm;
Min. Space of BGA: +/- 0.3mm;
Max.Precision of IC Assembly: 0.03mm;
SMT Capacity: >2 Million Points/Day;
DIP Capacity: >100K Parts/Day;
Electronic: 100kmonth;
Test : 100% Aoi Testing;
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Metal Coating: Copper;
Mode of Production: SMT+DIP;
Layers: Double-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Product Name: Milk Frother PCBA Control Board;
Advantage: R & D Team,Automation Equipment;
Service: OEM/ODM;
Application: Home Appliances;
Certificate: ISO9001/ISO14001/CE/RoHS;
Testing: Aoi Testing, Fuctional Testing,Aging Test;
Brand Name: Huishine;
Material: Fr-4/Cem-1/Cem-3/Fr1/Aluminum;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: Used;
Insulation Materials: Organic Resin;
Functional Testing: Spi, X-ray, Aoi, Ict, Fct, RoHS and Aging;
Processing Technology: Electrolytic Foil;
Type: Rigid PCB;
PCBA Min.IC Pitch: 0.30mm(12mil);
BGA Minimum Dia: 01015;
PCBA Foot Pin: So, Sop, Soj, Tsop, Tssop, Qfp, BGA and U-BGA;
Small Order: Acceptable;
IP Protection: Strong Believe in IP Protection with Proven Record;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Double-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Product Name: Bladeless Fan PCBA Control Board;
Advantage: R & D Team,Automation Equipment;
Service: OEM/ODM;
Application: Home Appliances;
Certificate: ISO9001/ISO14001/CE/RoHS;
Testing: Aoi Testing, Fuctional Testing,Aging Test;
Brand Name: Huishine;
Material: Fr-4/Cem-1/Cem-3/Fr1/Aluminum;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: Used;
Insulation Materials: Organic Resin;
Functional Testing: Spi, X-ray, Aoi, Ict, Fct, RoHS and Aging;
Processing Technology: Electrolytic Foil;
Type: Rigid PCB;
PCBA Min.IC Pitch: 0.30mm(12mil);
BGA Minimum Dia: 01015;
PCBA Foot Pin: So, Sop, Soj, Tsop, Tssop, Qfp, BGA and U-BGA;
Small Order: Acceptable;
IP Protection: Strong Believe in IP Protection with Proven Record;
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