PCBA EMS Supplier 94V0 Circuitboard SMT&DIP PCBA Board Assembly Video

Name: PCBA EMS Supplier 94V0 Circuitboard SMT&DIP PCBA Board Assembly
Uploaded: 2024-03-13T17:59:20+08:00
Description: PCBA EMS Supplier 94v0 CircuitBoard SMT&DIP PCBA Board Assembly Specification PCB capability and services: 1. Single-sided, double side & multi-layer PCB. FPC. Flex Rigid PCB with competitive pric

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Price

Purchase Qty. Reference FOB Price

10-999 Pieces US$5.00

1,000-4,999 Pieces US$2.10

5,000+ Pieces US$0.87

Sepcifications

Type Flexible Circuit Board
Dielectric FR-4
Material Aluminum Covered Copper Foil Layer
Application Communication
Flame Retardant Properties V0
Mechanical Rigid Fexible
Processing Technology Customized
Base Material Aluminum
Insulation Materials Epoxy Resin
Brand OEM/ODM
Transport Package Antistatic Package+Plastic Box and Carton Box
Specification Customized
Trademark Customized
Origin Shenzhen China
PCBA-Testing X-ray, Aoi
Processing Electrolytic Foil
SMT Capacity >2 Million Points/Day
DIP Capacity >100K Parts/Day
Certification RoHS, CCC, ISO
Min. Space of BGA +/- 0.3mm
Min.Pin Space of IC 0.3mm
Max.Precision of IC Assembly 0.03mm
Surface Finishing Lead-Free HASL
Number of Layers 4-10 Layer
Board Thickness 1.6mm

Product Description

PCBA EMS Supplier 94v0 CircuitBoard SMT&DIP PCBA Board Assembly Specification PCB capability and services: 1. Single-sided, double side &multi-layer PCB. FPC. Flex Rigid PCB with competitive price, good quality and excellent service. 2. CEM-1, CEM-3 FR-4, FR-4 High TG, Aluminum base ...

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Shenzhen Hongzhou Smart Technology Co., Ltd.

Diamond Member Since 2020

Audited Supplier

Business Type Manufacturer/Factory & Trading Company
Main Products Self Service KIOSK
Registered Capital 147802.18 USD
Plant Area 3200 square meters
Management System Certification ISO9001:2015
OEM/ODM Availability Yes

SMT&DIP Comparison

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Transaction Info
	Quick View PCBA EMS Supplier 94V0 Circuitboard SMT&DIP PCBA Board Assembly Contact Now	Quick View Ensure Reliable and Seamless Aircraft Connectivity and Communication with Aviation Communication Pcbs. Contact Now	Quick View Streamline Prototype Development and Fast Manufacturing for Efficiency with Quick-Turn Pcbs. Contact Now	Quick View Feature Enhanced Security for Comprehensive Electronics Protection and Defense with Secure Pcbs. Contact Now	Quick View Power-Optimized PCB for Enhanced Energy Efficiency Contact Now
Price	US $ 0.87-5.00/ Piece	US $ 0.15-9.98/ Piece	US $ 0.15-9.98/ Piece	US $ 0.15-9.98/ Piece	US $ 0.15-9.98/ Piece
Min Order	10 Pieces	1 Pieces	1 Pieces	1 Pieces	1 Pieces
Trade Terms	-	-	-	-	-
Payment Terms	T/T, D/P, Paypal, Money Gram	L/C, T/T, D/P, Western Union, Paypal, Money Gram	L/C, T/T, D/P, Western Union, Paypal, Money Gram	L/C, T/T, D/P, Western Union, Paypal, Money Gram	L/C, T/T, D/P, Western Union, Paypal, Money Gram
Quality Control
Product Certification	RoHS, CCC, ISO	-	-	-	-
Management System Certification	ISO 9001, IATF16949, ISO 13485	-	-	-	-
Trade Capacity
Export Markets	Domestic	-	-	-	-
Annual Export Revenue	-	-	-	-	-
Business Model	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM
Average Lead Time	Off-season: 1 Month(s) Peak-season: 1-3 Month(s)	-	-	-	-
Product Attributes
Specification	Type: Flexible Circuit Board; Dielectric: FR-4; Material: Aluminum Covered Copper Foil Layer; Application: Communication; Flame Retardant Properties: V0; Mechanical Rigid: Fexible; Processing Technology: Customized; Base Material: Aluminum; Insulation Materials: Epoxy Resin; Brand: OEM/ODM; PCBA-Testing: X-ray, Aoi; Processing: Electrolytic Foil; SMT Capacity: >2 Million Points/Day; DIP Capacity: >100K Parts/Day; Min. Space of BGA: +/- 0.3mm; Min.Pin Space of IC: 0.3mm; Max.Precision of IC Assembly: 0.03mm; Surface Finishing: Lead-Free HASL; Number of Layers: 4-10 Layer; Board Thickness: 1.6mm;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Aluminum; Insulation Materials: Organic Resin; Brand: Chenlu; HASL/Lf Hal: 2.5um; Layer Counts: 1L-40L; Copper Weight: 0.5--6 Oz; Hole Position Tol: ±0.075mm;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Aluminum; Insulation Materials: Organic Resin; Brand: Chenlu; HASL/Lf Hal: 2.5um; Layer Counts: 1L-40L; Copper Weight: 0.5--6 Oz; Hole Position Tol: ±0.075mm;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Aluminum; Insulation Materials: Organic Resin; Brand: Chenlu; HASL/Lf Hal: 2.5um; Layer Counts: 1L-40L; Copper Weight: 0.5--6 Oz; Hole Position Tol: ±0.075mm;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Aluminum; Insulation Materials: Organic Resin; Brand: Chenlu; HASL/Lf Hal: 2.5um; Layer Counts: 1L-40L; Copper Weight: 0.5--6 Oz; Hole Position Tol: ±0.075mm;
Supplier Name	Shenzhen Hongzhou Smart Technology Co., Ltd.	Dongguan Chenlu Electronics Co., Ltd.	Dongguan Chenlu Electronics Co., Ltd.	Dongguan Chenlu Electronics Co., Ltd.	Dongguan Chenlu Electronics Co., Ltd.
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