Android Control Board
US$2.06-6.00 / Piece
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Factory Superior Quality 12 Layer PCB Board Electronics PCBA Assembled Circuit Board in China Video

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

10-99 Pieces US$6.00

100-499 Pieces US$3.78

500+ Pieces US$2.06

Sepcifications

  • Type Customized
  • Dielectric FR-4
  • Material Aluminum Covered Copper Foil Layer
  • Application Consumer Electronics
  • Flame Retardant Properties V0
  • Mechanical Rigid Customized
  • Processing Technology Customized
  • Base Material Aluminum
  • Insulation Materials Organic Resin
  • Brand OEM/ODM
  • Transport Package Antistatic Package+Plastic Box and Carton Box
  • Specification Customized
  • Trademark Customized
  • Origin Shenzhen China
  • PCBA-Testing X-ray, Aoi
  • Processing Electrolytic Foil
  • SMT Capacity >2 Million Points/Day
  • DIP Capacity >100K Parts/Day
  • Certification RoHS, CCC, ISO
  • Min. Space of BGA +/- 0.3mm
  • Min.Pin Space of IC 0.3mm
  • Max.Precision of IC Assembly 0.03mm
  • Surface Finishing Lead-Free HASL
  • Number of Layers 4-10 Layer
  • Board Thickness 1.6mm

Product Description

Factory Superior Quality 12 Layer PCB Board Electronics PCBA Assembled Circuit Board In China Files and Requirment for PCB,PCBA quotation: A BOM (Bill of Materials) with reference designators: component description, manufacturer's name and part number. PCB Gerber files. A PCB fabrication drawing ...

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Android Control Board Comparison
Transaction Info
Price US $ 2.06-6.00/ Piece US $ 1.56-2.16/ Piece US $ 0.68-1.23/ PCS US $ 0.98-1.36/ PCS US $ 2.03-2.20/ Piece
Min Order 10 Pieces 1 Pieces 1 PCS 1 PCS 10 Pieces
Payment Terms T/T L/C, T/T, Paypal L/C, T/T, Western Union L/C, T/T, Western Union L/C, T/T, Paypal
Quality Control
Product Certification RoHS, CCC, ISO - ISO,UL,RoHS ISO,UL,RoHS -
Management System Certification ISO 9001, IATF16949, ISO 13485 ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, IATF16949 ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, IATF16949 ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, IATF16949 ISO 9001
Trade Capacity
Export Markets North America, Eastern Europe, Southeast Asia, Africa, Oceania, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe North America, South America, Eastern Europe, Southeast Asia, Mid East, Western Europe
Annual Export Revenue US$10 Million - US$50 Million Above US$100 Million Above US$100 Million Above US$100 Million US$5 Million - US$10 Million
Business Model OEM, ODM OEM OEM OEM OEM
Average Lead Time Off Season Lead Time: one month
Peak Season Lead Time: 1-3 months
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: one month
Product Attributes
Specification
Type: Customized;
Dielectric: FR-4;
Material: Aluminum Covered Copper Foil Layer;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Customized;
Processing Technology: Customized;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: OEM/ODM;
PCBA-Testing: X-ray, Aoi;
Processing: Electrolytic Foil;
SMT Capacity: >2 Million Points/Day;
DIP Capacity: >100K Parts/Day;
Min. Space of BGA: +/- 0.3mm;
Min.Pin Space of IC: 0.3mm;
Max.Precision of IC Assembly: 0.03mm;
Surface Finishing: Lead-Free HASL;
Number of Layers: 4-10 Layer;
Board Thickness: 1.6mm;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Computer;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: UC;
Layer: 8;
Via: 1+6+1;
Copper: 1/3 Oz;
Surface: Enig;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Immersional Gold;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Ucreate PCB;
Board Thickness: 1.2~2.0mm;
Surface Finihsing: Immersional Gold;
Lead Time: 6-8 Working Days;
PCB Testing: E-Testing; Flying Probe Testing;
Mask Ink Color: White/Black/Green/Red/Yellow/Blue;
Color: Green Blue Red;
Number of Layers: 2 Layer;
Copper Thickness: 1oz;
Condition: Original Made;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Immersional Gold;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Ucreate PCB;
Board Thickness: 1.2~2.0mm;
Surface Finihsing: Immersional Gold;
Lead Time: 6-8 Working Days;
PCB Testing: E-Testing; Flying Probe Testing;
Mask Ink Color: White/Black/Green/Red/Yellow/Blue;
Color: Green Blue Red;
Number of Layers: Multilayer;
Copper Thickness: 2oz;
Condition: Original Made;
Supplier Name

Shenzhen Hongzhou Smart Technology Co., Ltd.

Diamond Member Audited Supplier

Ucreate PCB Co., Ltd.

Diamond Member Audited Supplier

Ucreate PCB Co., Ltd.

Diamond Member Audited Supplier

Ucreate PCB Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Wonderwing Electronics., Ltd.

Gold Member Audited Supplier