PCB Assembly Services
US$0.53-5.00 / Piece

China OEM PCBA Control Board PCB Assembly with RoHS Complaint Video

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

10-99 Pieces US$5.00

100-499 Pieces US$2.10

500+ Pieces US$0.53

Sepcifications

  • Type Flexible Circuit Board
  • Dielectric FR-4
  • Material Aluminum Covered Copper Foil Layer
  • Application Communication
  • Flame Retardant Properties V0
  • Mechanical Rigid Fexible
  • Processing Technology Customized
  • Base Material Aluminum
  • Insulation Materials Epoxy Resin
  • Brand OEM/ODM
  • Transport Package Antistatic Package+Plastic Box and Carton Box
  • Specification Customized
  • Trademark Customized
  • Origin Shenzhen China
  • PCBA-Testing X-ray, Aoi
  • Processing Electrolytic Foil
  • SMT Capacity >2 Million Points/Day
  • DIP Capacity >100K Parts/Day
  • Certification RoHS, CCC, ISO
  • Min. Space of BGA +/- 0.3mm
  • Min.Pin Space of IC 0.3mm
  • Max.Precision of IC Assembly 0.03mm
  • Surface Finishing Lead-Free HASL
  • Number of Layers 4-10 Layer
  • Board Thickness 1.6mm

Product Description

China OEM PCBA Control Board PCB Assembly with RoHS Complaint Specification PCB capability and services: 1. Single-sided, double side &multi-layer PCB. FPC. Flex Rigid PCB with competitive price, good quality and excellent service. 2. CEM-1, CEM-3 FR-4, FR-4 High TG, Aluminum base ...

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PCB Assembly Services Comparison
Transaction Info
Price US $ 0.53-5.00/ Piece US $ 31/ Piece US $ 4.6/ Piece US $ 2.00-5.00/ Piece US $ 2.00-5.00/ Piece
Min Order 10 Pieces 500 Pieces 500 Pieces 1 Pieces 1 Pieces
Payment Terms T/T T/T, D/P, Western Union, Paypal T/T, D/P, Western Union, Paypal T/T, Western Union, Paypal T/T, Western Union, Paypal
Quality Control
Product Certification RoHS, CCC, ISO - - - -
Management System Certification ISO 9001, IATF16949, ISO 13485 ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, HSE ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, HSE - -
Trade Capacity
Export Markets North America, Eastern Europe, Southeast Asia, Africa, Oceania, Eastern Asia, Western Europe North America, South America, Southeast Asia North America, South America, Southeast Asia - -
Annual Export Revenue US$10 Million - US$50 Million Above US$100 Million Above US$100 Million US$50 Million - US$100 Million US$50 Million - US$100 Million
Business Model OEM, ODM OEM, ODM OEM, ODM - -
Average Lead Time Off Season Lead Time: one month
Peak Season Lead Time: 1-3 months
Off Season Lead Time: 3-6 months
Peak Season Lead Time: 1-3 months
Off Season Lead Time: 3-6 months
Peak Season Lead Time: 1-3 months
- -
Product Attributes
Specification
Type: Flexible Circuit Board;
Dielectric: FR-4;
Material: Aluminum Covered Copper Foil Layer;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Fexible;
Processing Technology: Customized;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Brand: OEM/ODM;
PCBA-Testing: X-ray, Aoi;
Processing: Electrolytic Foil;
SMT Capacity: >2 Million Points/Day;
DIP Capacity: >100K Parts/Day;
Min. Space of BGA: +/- 0.3mm;
Min.Pin Space of IC: 0.3mm;
Max.Precision of IC Assembly: 0.03mm;
Surface Finishing: Lead-Free HASL;
Number of Layers: 4-10 Layer;
Board Thickness: 1.6mm;
Type: Combining Rigid Circuit Board;
Dielectric: CEM-3;
Material: Complex;
Application: Communication;
Flame Retardant Properties: HB;
Mechanical Rigid: Fexible;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: Cookermore;
Weight(Kg): 1.14;
Type: Combining Rigid Circuit Board;
Dielectric: CEM-3;
Material: Complex;
Application: Communication;
Flame Retardant Properties: HB;
Mechanical Rigid: Fexible;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: Cookermore;
Weight(Kg): 0.1;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Communication;
Flame Retardant Properties: 94V-0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Finestpcb;
Service: One-Step PCB Service;
Solder Mask Color: Blue.Green.Red.Black.White;
Layer: 1-40layers;
Min BGA Ball Pitch: 0.4mm;
Surface Finishing: HASL\OSP\Immersion Gold;
HASL\OSP\Immersion Gold: Fr4/Rogers/Aluminum/High Tg;
Copper Thickness: 0.5-5oz;
Board Thickness: 1.6 ±0.1mm;
Minimum Hole: Minimum;
Minimum Width: 3/3mil;
Minimum Line: 3/3mil;
Product Name: OEM PCB PCBA Board Assembly;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Communication;
Flame Retardant Properties: 94V-0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Finestpcb;
Service: One-Step PCB Service;
Solder Mask Color: Blue.Green.Red.Black.White;
Layer: 1-40layers;
Min BGA Ball Pitch: 0.4mm;
Surface Finishing: HASL\OSP\Immersion Gold;
HASL\OSP\Immersion Gold: Fr4/Rogers/Aluminum/High Tg;
Copper Thickness: 0.5-5oz;
Board Thickness: 1.6 ±0.1mm;
Minimum Hole: Minimum;
Minimum Width: 3/3mil;
Minimum Line: 3/3mil;
Product Name: OEM PCB PCBA Board Assembly;
Supplier Name

Shenzhen Hongzhou Smart Technology Co., Ltd.

Diamond Member Audited Supplier

Guangdong Cookermore CO., Ltd

Diamond Member Audited Supplier

Guangdong Cookermore CO., Ltd

Diamond Member Audited Supplier

Finest Printed Circuit Board Ltd.

Diamond Member Audited Supplier

Finest Printed Circuit Board Ltd.

Diamond Member Audited Supplier