Automatic Printed Circuit Board Assembly PCBA
US$0.39-0.99 / Piece
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What is Professional PCB Assembly Manufacturer for Automatic Printing Solder Paste Reflow Soldering

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

10-99 Pieces US$0.39

100-999 Pieces US$0.59

1,000+ Pieces US$0.99

Sepcifications

  • Metal Coating Tin
  • Layers Multilayer
  • Base Material FR-4
  • Certification RoHS, ISO
  • Customized Customized
  • Condition New
  • Transport Package Anti-Static Bag + Foam Protective Cotton + Cardboa
  • Trademark Hongzhou
  • Origin Shenzhen, Guangdong, China
  • Testing Spi,Aoi,Ict,Fct,X-ray,RoHS and Aging.
  • Min. Component 01005
  • Max. PCB Mulitylayer up to 64 Layers
  • Max PCB Dimension 740*400mm
  • MOQ Custom
  • Production Line 5 SMT
  • Employees 200+
  • Application Scenario Medical, Industrial, Automotive, POS Terminal
  • Production Equipments Printing, SMT, Board Dividing, Spi, X-ray Machine

Product Description

Hongzhou Electronics, a member of Hongzhou Group, we are ISO9001, ISO13485, IATF16949 certified factory. We specialize in high-quality PCBA and electronic manufacturing services. Our product includes Self Service Kiosk, Smart POS, and Conferencing System such as PTZ camera, HD Video Conference ...

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Automatic Printed Circuit Board Assembly PCBA Comparison
Transaction Info
Price US $ 0.39-0.99/ Piece US $ 1.00-20.00/ Piece US $ 1.00-20.00/ Piece US $ 1.00-20.00/ Piece US $ 1.00-20.00/ Piece
Min Order 10 Pieces 1 Pieces 1 Pieces 1 Pieces 1 Pieces
Trade Terms - - - - -
Payment Terms L/C, T/T, D/P, Western Union, Paypal, Money Gram L/C, T/T, Paypal L/C, T/T, Paypal L/C, T/T, Paypal L/C, T/T, Paypal
Quality Control
Product Certification RoHS, ISO RoHS, ISO RoHS, ISO RoHS, ISO RoHS, ISO
Management System Certification ISO 9001, ISO 14001, IATF16949, ISO 13485 ISO 9001, ISO 9000, ISO 14001, IATF16949, ISO 13485, ISO 17025 ISO 9001, ISO 9000, ISO 14001, IATF16949, ISO 13485, ISO 17025 ISO 9001, ISO 9000, ISO 14001, IATF16949, ISO 13485, ISO 17025 ISO 9001, ISO 9000, ISO 14001, IATF16949, ISO 13485, ISO 17025
Trade Capacity
Export Markets North America, South America, Eastern Europe, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model OEM, ODM OEM, ODM OEM, ODM OEM, ODM OEM, ODM
Average Lead Time Off-season: within 15 Day(s)
Peak-season: 1 Month(s)
Off-season: 1 Month(s)
Peak-season: 1 Month(s)
Off-season: 1 Month(s)
Peak-season: 1 Month(s)
Off-season: 1 Month(s)
Peak-season: 1 Month(s)
Off-season: 1 Month(s)
Peak-season: 1 Month(s)
Product Attributes
Specification
Metal Coating: Tin;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Testing: Spi,Aoi,Ict,Fct,X-ray,RoHS and Aging.;
Min. Component: 01005;
Max. PCB Mulitylayer: up to 64 Layers;
Max PCB Dimension: 740*400mm;
MOQ: Custom;
Production Line: 5 SMT;
Employees: 200+;
Application Scenario: Medical, Industrial, Automotive, POS Terminal;
Production Equipments: Printing, SMT, Board Dividing, Spi, X-ray Machine;
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
PCBA-Testing: X-ray, Aoi;
Small Order: Acceptable;
Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Insulation Materials: Organic Resin;
Material: Complex;
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
PCBA-Testing: X-ray, Aoi;
Small Order: Acceptable;
Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Insulation Materials: Organic Resin;
Material: Complex;
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
PCBA-Testing: X-ray, Aoi;
Small Order: Acceptable;
Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Insulation Materials: Organic Resin;
Material: Complex;
Applications: Motherboard;
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
PCBA-Testing: X-ray, Aoi;
Small Order: Acceptable;
Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Insulation Materials: Organic Resin;
Material: Complex;
Supplier Name

Shenzhen Hongzhou Technology Co., Ltd.

China Supplier - Gold Member Audited Supplier

Shenzhen Grandtop Electronics Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen Grandtop Electronics Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen Grandtop Electronics Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen Grandtop Electronics Co., Ltd.

China Supplier - Diamond Member Audited Supplier