PCB
US$1.20-3.10 / Piece
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What is Mobile Phone FPC Circuit Board Manufacturer for Customized Rigid-Flex PCB Electronic Components Arduino Uno Printed Circuit Board PCB Fabrication PCB FPC

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

100-599 Pieces US$3.10

600-999 Pieces US$2.80

1,000-1,999 Pieces US$1.90

2,000+ Pieces US$1.20

Sepcifications

  • Structure Double-Sided FPC
  • Material Polyimide
  • Combination Mode Adhesive Flexible Plate
  • Application Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace
  • Conductive Adhesive Conductive Silver Paste
  • Flame Retardant Properties V0
  • Processing Technology Electrolytic Foil
  • Base Material Copper
  • Insulation Materials Organic Resin
  • Brand Customers Brand
  • Transport Package Customized, ESD Bag/Vacuum Packaging+Bubble Bag,
  • Specification 10cm*10cm
  • Trademark SNC
  • Origin China
  • Certification IATF16949, UL, ISO
  • Surface Treatment Gold Finger/Hard Gold
  • Test 100% E-Test
  • Layers 1-36 Layers
  • Copper Thickness 0.5-12oz(18-420um)
  • Hole Diameter Min0.05mm
  • Min. Line Spacing 0.10mm(4mil)
  • One Stop Service PCB Assembly, Component Sourcing, Box Building
  • Board Thickness 0.2-6mm
  • Solder Mask Color Green/Black/White/Red/Blue/Yellow
  • Min. Line Width 0.10mm(4mil)
  • Max. Finished Board Side 1020mm*1000mm
  • Delivery 7 Days

Product Description

Detailed Photos Our Service 1. PCB design ,PCB clone and copy ,ODM service. 2. Schematic design and Layout 3. Fast PCB&PCBA prototype and Mass Production 4. Electronic Components Sourcing Services 5. PCB Assembly Services:SMT,DIP&THT,BGA repair and reballing 6. ICT, Constant ...

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PCB Comparison
Transaction Info
Price US $ 1.20-3.10/ Piece US $ 0.10-1.00/ Piece US $ 0.50-5.50/ Piece US $ 2.50-3.00/ Piece US $ 0.50-5.50/ Piece
Min Order 100 Pieces 1 Pieces 1 Pieces 1 Pieces 1 Pieces
Payment Terms L/C, T/T, Western Union, Paypal L/C, T/T, D/P, Western Union, Paypal, Money Gram L/C, T/T, D/P, Western Union, Paypal L/C, T/T, D/P, Western Union, Paypal, Money Gram L/C, T/T, D/P, Western Union, Paypal
Quality Control
Product Certification IATF16949, UL, ISO ISO9001,ISO14001,ISO13485,Ts-16949,etc - - -
Management System Certification - ISO 9001, ISO 14001 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949
Trade Capacity
Export Markets - North America, South America, Eastern Europe, Southeast Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue US$2.5 Million - US$5 Million Above US$100 Million US$10 Million - US$50 Million US$10 Million - US$50 Million US$10 Million - US$50 Million
Business Model - OEM, ODM OEM, ODM, Own Brand(KMC) OEM, ODM, Own Brand(KMC) OEM, ODM, Own Brand(KMC)
Average Lead Time - Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Product Attributes
Specification
Structure: Double-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Customers Brand;
Surface Treatment: Gold Finger/Hard Gold;
Test: 100% E-Test;
Layers: 1-36 Layers;
Copper Thickness: 0.5-12oz(18-420um);
Hole Diameter: Min0.05mm;
Min. Line Spacing: 0.10mm(4mil);
One Stop Service: PCB Assembly, Component Sourcing, Box Building;
Board Thickness: 0.2-6mm;
Solder Mask Color: Green/Black/White/Red/Blue/Yellow;
Min. Line Width: 0.10mm(4mil);
Max. Finished Board Side: 1020mm*1000mm;
Delivery: 7 Days;
Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Kevis;
Products Name: Flexible FPC Electronics Board;
Layer: Single / Double Sided / Multilayer;
Service: PCB/PCBA/PCB Assembly/Electronic Parts;
Other Service: Layout Design,Engineering Support,Testing;
Specialised: Medical,Industrial,Communication,Controlboard,LED;
PCBA QC: X-ray, Aoi Test, Function Test(100% Test),40X Om;
Surface Finishing: HASL, Enig, OSP, Lmmersion Au, AG,Sn;
Copper Thickness: 0.5oz/1oz/2oz/3oz/4oz;
Min.Hole Size: 0.1mm (4 Mil);
Board Thickness: 0.2mm-7mm;
Min.Line Spacing: 0.1mm (4 Mil);
Solder Color: Green, Red, White, Black,Yellow,Blue;
SMT Assembly Line: 10 Lines;
Delivery: PCB: 1-5 Days; PCB Assembly: 1-10 Days;
Structure: Double-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V2;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Material: Polyimide;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: UC;
Type: 6 Layer FPCB;
Surface Finihsing: HASL-Lf;
Board Thickness: 1.0mm;
Lead Time: 6-8 Working Days;
Structure: Double-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V2;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Supplier Name

Kunshan Huaruika Electronics Technology Co., Ltd.

Diamond Member Audited Supplier

Guangzhou Kevis Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

Keep Moving Circuits Co., Ltd.

Diamond Member Audited Supplier

Keep Moving Circuits Co., Ltd.

Diamond Member Audited Supplier

Keep Moving Circuits Co., Ltd.

Diamond Member Audited Supplier