Circuit-Board
US$1.60-3.80 / Piece
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How does Advanced Multilayer PCB for Tdcs Devices WiFi Solar Heater Controller with Multilayer PCB Technology Work

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

100-499 Pieces US$3.80

500-999 Pieces US$3.40

1,000-1,999 Pieces US$2.40

2,000+ Pieces US$1.60

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Fiberglass Epoxy
  • Application Aerospace
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Copper
  • Insulation Materials Organic Resin
  • Brand Customers Brand
  • Transport Package Customized, ESD Bag/Vacuum Packaging+Bubble Bag,
  • Specification 10cm*10cm
  • Trademark SNC
  • Origin China
  • Certification IATF16949, UL, ISO
  • Surface Treatment Gold Finger/Hard Gold
  • Test 100% E-Test
  • Layers 1-36 Layers
  • Copper Thickness 0.5-12oz(18-420um)
  • Hole Diameter Min0.05mm
  • Min. Line Spacing 0.10mm(4mil)
  • One Stop Service PCB Assembly, Component Sourcing, Box Building
  • Board Thickness 0.2-6mm
  • Solder Mask Color Green/Black/White/Red/Blue/Yellow
  • Min. Line Width 0.10mm(4mil)
  • Max. Finished Board Side 1020mm*1000mm
  • Delivery 7 Days

Product Description

Detailed Photos Our Service 1. PCB design ,PCB clone and copy ,ODM service. 2. Schematic design and Layout 3. Fast PCB&PCBA prototype and Mass Production 4. Electronic Components Sourcing Services 5. PCB Assembly Services:SMT,DIP&THT,BGA repair and reballing 6. ICT, Constant ...

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Circuit-Board Comparison
Transaction Info
Price US $ 1.60-3.80/ Piece US $ 5.00-50.00/ pcs US $ 5.00-50.00/ pcs US $ 3.20-15.00/ Piece US $ 2.60-12.00/ Piece
Min Order 100 Pieces 1 pcs 1 pcs 100 Pieces 100 Pieces
Payment Terms L/C, T/T, Western Union, Paypal T/T, Western Union, Paypal, Money Gram T/T, Western Union, Paypal, Money Gram T/T, Western Union, Paypal T/T, Western Union, Paypal
Quality Control
Product Certification IATF16949, UL, ISO CE, RoHS, UL, SGS, ISO9001: 2015, 94V0 CE, RoHS, UL, SGS, ISO9001: 2015, 94V0 - -
Management System Certification - ISO 9001, ISO 14001, ISO 14000, IATF16949, QC 080000, ISO 13485 ISO 9001, ISO 14001, ISO 14000, IATF16949, QC 080000, ISO 13485 ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE, GMP ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE, GMP
Trade Capacity
Export Markets - North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue US$2.5 Million - US$5 Million US$10 Million - US$50 Million US$10 Million - US$50 Million US$50 Million - US$100 Million US$50 Million - US$100 Million
Business Model - OEM, ODM OEM, ODM OEM, ODM OEM, ODM
Average Lead Time - Off Season Lead Time: within 15 workdays
Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Customers Brand;
Surface Treatment: Gold Finger/Hard Gold;
Test: 100% E-Test;
Layers: 1-36 Layers;
Copper Thickness: 0.5-12oz(18-420um);
Hole Diameter: Min0.05mm;
Min. Line Spacing: 0.10mm(4mil);
One Stop Service: PCB Assembly, Component Sourcing, Box Building;
Board Thickness: 0.2-6mm;
Solder Mask Color: Green/Black/White/Red/Blue/Yellow;
Min. Line Width: 0.10mm(4mil);
Max. Finished Board Side: 1020mm*1000mm;
Delivery: 7 Days;
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: OEM/ODM PCB Assembly;
MOQ: 1 PCS;
Layer: 1-18 Layers;
Surface Finishing: HASL, Enig, OSP, Immersion Au, AG, Sn;
Min.Hole Size: 0.1mm (4 Mil);
Board Thickness: 0.2mm-4mm;
Min.Line Spacing: 0.1mm (4 Mil);
Copper Thickness: 0.5 Oz-3oz (18 Um-385 Um);
Specialised: LED, Medical, Industrial, Control Board;
Service: PCB/PCBA/Circuit Board/SMT/DIP;
Other Service: PCBA Layout and Design, Engineering Support;
PCBA QC: X-ray, Aoi Test, Function Test(100% Test);
Delivery: PCB, 7-10 Days;PCBA, 2-3weeks;
Products Name: PCBA Assembly AC/DC Power Supply UPS Battery PCB;
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: OEM/ODM PCB Assembly;
MOQ: 1 PCS;
Layer: 1-18 Layers;
Surface Finishing: HASL, Enig, OSP, Immersion Au, AG, Sn;
Min.Hole Size: 0.1mm (4 Mil);
Board Thickness: 0.2mm-4mm;
Min.Line Spacing: 0.1mm (4 Mil);
Copper Thickness: 0.5 Oz-3oz (18 Um-385 Um);
Specialised: LED, Medical, Industrial, Control Board;
Service: PCB/PCBA/Circuit Board/SMT/DIP;
Other Service: PCBA Layout and Design, Engineering Support;
PCBA QC: X-ray, Aoi Test, Function Test(100% Test);
Delivery: PCB, 7-10 Days;PCBA, 2-3weeks;
Products Name: AC/DC Power Supply UPS Battery PCB 94V0;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Paper Phenolic Copper Foil Substrate;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4 Shengyi Material;
Insulation Materials: Epoxy Resin;
Layer Count: 28layer Backplane;
Surface Finish: Immersion Gold;
Hole Wall Cu: Min. 25um;
Standard: Ipc II;
Certificates: RoHS CCC ISO;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Paper Phenolic Copper Foil Substrate;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4 Shengyi Material;
Insulation Materials: Epoxy Resin;
Layer Count: 16layer Through Hole Board;
Surface Finish: Immersion Gold;
Hole Wall Cu: Min. 25um;
Standard: Ipc II;
Certificates: RoHS CCC ISO;
Supplier Name

Kunshan Huaruika Electronics Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen STHL Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen STHL Technology Co., Ltd.

Diamond Member Audited Supplier

Shanghai Gawin Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

Shanghai Gawin Electronic Technology Co., Ltd.

Diamond Member Audited Supplier