Air Condition PCB
US$1.00-20.00 / Piece
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What is OEM and ODM Electronics Multilayer Printed Circuit Board PCB and PCBA Manufacturer

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1000 Pieces US$1.00-20.00 / Piece

Sepcifications

  • Structure Multilayer Rigid PCB
  • Dielectric FR-4
  • Material Polyester Glass Fiber Mat Laminate
  • Application Consumer Electronics
  • Flame Retardant Properties HB
  • Processing Technology Electrolytic Foil
  • Production Process Semi-Additive Process
  • Base Material Copper
  • Insulation Materials Organic Resin
  • Brand Huishine
  • Transport Package Packed in Bubble Bag and Cartons
  • Origin China
  • Product Name Control Board PCBA for Air Condition
  • Size as Customers′ Request
  • Functions Control The Fireplace
  • Color Customized Request
  • Certificationn RoHS, CCC, ISO, Ts 16949

Product Description

Products Description: Product Name PCBA for air conditioning Base Material FR-4/CEM-1/CEM-3/FR1/aluminum Layers 1-12 Surface Treatment HASL\HASL Lead Free\ENIG\GOLD Finger material FR4/CEM-1/CEM-3/FR1/aluminum Application Home Appliances Service OEM Services Provided Certificate ...

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Air Condition PCB Comparison
Transaction Info
Price US $ 1.00-20.00/ Piece US $ 2.80-3.00/ Piece US $ 0.48-0.50/ Piece US $ 2.00-5.00/ Piece US $ 11.50-12.00/ Piece
Min Order 1000 Pieces 10 Pieces 10 Pieces 1 Pieces 10 Pieces
Trade Terms - - - - -
Payment Terms L/C, T/T, D/P, Western Union, Paypal, Money Gram T/T T/T T/T, Western Union, Paypal T/T
Quality Control
Management System Certification - ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 - ISO 9001, ISO 14001, IATF16949
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Eastern Asia, Western Europe - - North America, Europe, East Asia(Japan/ South Korea) -
Annual Export Revenue - - - - -
Business Model OEM, ODM, Own Brand OEM, ODM OEM, ODM - OEM, ODM
Average Lead Time Off-season: within 15 Day(s)
Peak-season: 1 Month(s)
- - - -
Product Attributes
Specification
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: HB;
Processing Technology: Electrolytic Foil;
Production Process: Semi-Additive Process;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Huishine;
Product Name: Control Board PCBA for Air Condition;
Size: as Customers' Request;
Functions: Control The Fireplace;
Color: Customized Request;
Certificationn: RoHS, CCC, ISO, Ts 16949;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Computer;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Shengyi, Kb, Nanya, Ilm;
Criteria: Aql II 0.65;
Hole Sizes: 0.25mm;
Bevel Edge: Yes;
Impedance: 50/90/100 Ohm;
Trace Width(Min.): 4mil;
Surfaec Treatment: HASL;
Structure: Double-Sided Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Computer;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Criteria: Aql II 0.65;
Hole Sizes: 0.25mm;
Bevel Edge: Yes;
Impedance: 50/90/100 Ohm;
Trace Width(Min.): 4mil;
Surfaec Treatment: HASL;
Dielectric: FR-4;
Application: Communication;
Flame Retardant Properties: 94V-0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Finestpcb;
Service: One-Step PCB Service;
Solder Mask Color: Blue.Green.Red.Black.White;
Layer: 1-40layers;
Min BGA Ball Pitch: 0.4mm;
Surface Finishing: HASL\OSP\Immersion Gold;
HASL\OSP\Immersion Gold: Fr4/Rogers/Aluminum/High Tg;
Copper Thickness: 0.5-5oz;
Board Thickness: 1.6 ±0.1mm;
Minimum Hole: Minimum;
Minimum Width: 3/3mil;
Minimum Line: 3/3mil;
Product Name: OEM PCB PCBA Board Assembly;
Dielectric: FR-4;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Shengyi, Kb, Nanya, Ilm;
Criteria: Aql II 0.65;
Hole Sizes: 0.25mm;
Bevel Edge: Yes;
Impedance: 50/90/100 Ohm;
Trace Width(Min.): 4mil;
Surfaec Treatment: HASL;
Supplier Name

Zhongshan Huishine PCBA.Co.,Ltd

China Supplier - Diamond Member Audited Supplier

Shenzhen Xinmanda Printed Circuit Board Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen Xinmanda Printed Circuit Board Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Finest Pcb Assembly Limited

China Supplier - Diamond Member Audited Supplier

Shenzhen Xinmanda Printed Circuit Board Co., Ltd.

China Supplier - Diamond Member Audited Supplier