OEM Service 94vo Multilayer PCBA Assembly Electrical Fire Alarm Monitoring Equipment PCB Assembling Circuit Board

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

10000 pieces US$0.20-0.50 / pieces

Sepcifications

  • Metal Coating 1
  • Mode of Production 1
  • Layers 1
  • Base Material 1
  • Customized 1
  • Condition 1
  • Specification 1
  • Trademark 1
  • Origin China

Product Description

Product Description Dear Customer We can help you customize different circuit boards for electric products depend on your requirements, which can support lead-acid batteries or lithium batteries, etc., welcome to send inquiry to us now. 1. PCB/PCBA ODM &OEM Service 2.THREE SMT LInes, TWO DIP ...

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Fire Alarm Panel PCB Comparison
Transaction Info
Price US $ 0.20-0.50/ pieces US $ 2.4/ Piece US $ 2.4/ Piece US $ 2.4/ Piece US $ 2.4/ Piece
Min Order 10000 pieces 10 Pieces 10 Pieces 10 Pieces 10 Pieces
Payment Terms L/C, T/T, D/P T/T, Paypal T/T, Paypal T/T, Paypal T/T, Paypal
Quality Control
Product Certification - RoHS, CCC, ISO RoHS, CCC, ISO RoHS, CCC, ISO RoHS, CCC, ISO
Management System Certification ISO 9001, BSCI ISO 9001, IATF16949, ISO 13485 ISO 9001, IATF16949, ISO 13485 ISO 9001, IATF16949, ISO 13485 ISO 9001, IATF16949, ISO 13485
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, Eastern Europe, Southeast Asia, Africa, Oceania, Eastern Asia, Western Europe North America, Eastern Europe, Southeast Asia, Africa, Oceania, Eastern Asia, Western Europe North America, Eastern Europe, Southeast Asia, Africa, Oceania, Eastern Asia, Western Europe North America, Eastern Europe, Southeast Asia, Africa, Oceania, Eastern Asia, Western Europe
Annual Export Revenue US$10 Million - US$50 Million US$10 Million - US$50 Million US$10 Million - US$50 Million US$10 Million - US$50 Million US$10 Million - US$50 Million
Business Model OEM, ODM, Own Brand(FRANKEVER), FROGBRO OEM, ODM OEM, ODM OEM, ODM OEM, ODM
Average Lead Time Off Season Lead Time: one month
Peak Season Lead Time: 1-3 months
Off Season Lead Time: one month
Peak Season Lead Time: 1-3 months
Off Season Lead Time: one month
Peak Season Lead Time: 1-3 months
Off Season Lead Time: one month
Peak Season Lead Time: 1-3 months
Off Season Lead Time: one month
Peak Season Lead Time: 1-3 months
Product Attributes
Specification
Metal Coating: 1;
Mode of Production: 1;
Layers: 1;
Base Material: 1;
Customized: 1;
Condition: 1;
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: Used;
Product Name: Original PCBA Shenzhen Manufacturer with SMT for E;
Shipment Way: by Air by Sea;
Payment Way: Tt;
Min.Pin Space of IC: 0.3mm;
Min. Space of BGA: +/- 0.3mm;
Max.Precision of IC Assembly: 0.03mm;
SMT Capacity: >2 Million Points/Day;
DIP Capacity: >100K Parts/Day;
Electronic: 100kmonth;
Test : 100% Aoi Testing;
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: Used;
Product Name: One-Stop OEM Service PCBA Assembly for Smart Andr;
Shipment Way: by Air by Sea;
Payment Way: Tt;
Min.Pin Space of IC: 0.3mm;
Min. Space of BGA: +/- 0.3mm;
Max.Precision of IC Assembly: 0.03mm;
SMT Capacity: >2 Million Points/Day;
DIP Capacity: >100K Parts/Day;
Electronic: 100kmonth;
Test : 100% Aoi Testing;
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: Used;
Product Name: Multilayer PCBA Design Printed Printing for Elect;
Shipment Way: by Air by Sea;
Payment Way: Tt;
Min.Pin Space of IC: 0.3mm;
Min. Space of BGA: +/- 0.3mm;
Max.Precision of IC Assembly: 0.03mm;
SMT Capacity: >2 Million Points/Day;
DIP Capacity: >100K Parts/Day;
Electronic: 100kmonth;
Test : 100% Aoi Testing;
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: Used;
Product Name: OEM ODM Multi Layer PCBA Assembly with High Qualit;
Shipment Way: by Air by Sea;
Payment Way: Tt;
Min.Pin Space of IC: 0.3mm;
Min. Space of BGA: +/- 0.3mm;
Max.Precision of IC Assembly: 0.03mm;
SMT Capacity: >2 Million Points/Day;
DIP Capacity: >100K Parts/Day;
Electronic: 100kmonth;
Test : 100% Aoi Testing;
Supplier Name

Hangzhou FrankEver Imp. & Exp. Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Hongzhou Smart Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Hongzhou Smart Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Hongzhou Smart Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Hongzhou Smart Technology Co., Ltd.

Diamond Member Audited Supplier