Smart PCB Assembly for Round and Rectangular Circuit Board Designs

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$0.01 / Piece

Sepcifications

  • Metal Coating Tin
  • Mode of Production SMT
  • Layers 1-22 Layers
  • Base Material FR-4
  • Certification RoHS, CCC, ISO
  • Customized Customized
  • Condition New
  • Transport Package Inner Vacuum Packing Outer Carton Box
  • Specification FR 4, 0.8mm, 1 Layer, 1OZ Copper Thickness
  • Trademark OEM, ODM
  • Origin China
  • Solder Resist Color Green;Red;Yellow;Black;White
  • Order Qty No Limited
  • Shape Retangular, Round, Slots, Cutouts, Complex, Irreg
  • Surface Finished HASL, Gold Finger, OSP, Enig, Peelable Mask

Product Description

PCBA Production Capacity: Unleash the full potential of technological excellence with our unrivaled Printed Circuit Board Assembly (PCBA) production capabilities. At Hangzhou Fonieto Technology Co., Ltd., we pride ourselves on possessing state-of-the-art facilities designed to meet the unique ...

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Smart PCB Assembly Comparison
Transaction Info
Price US $ 0.01/ Piece US $ 0.50-1.00/ Piece US $ 2.00-2.80/ PCS US $ 2.00-2.80/ PCS US $ 0.50-1.00/ Piece
Min Order 1 Pieces 10 Pieces 1 PCS 1 PCS 10 Pieces
Payment Terms T/T, Paypal T/T, Western Union, Paypal L/C, T/T, Paypal L/C, T/T, Paypal T/T, Western Union, Paypal
Quality Control
Product Certification RoHS, CCC, ISO RoHS, CCC, ISO RoHS, ISO RoHS, ISO RoHS, CCC, ISO
Management System Certification ISO 9001 ISO 9001, ISO 14001, IATF16949, ISO 13485 ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, IATF16949 ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, IATF16949 ISO 9001, ISO 14001, IATF16949, ISO 13485
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe - North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe -
Annual Export Revenue US$5 Million - US$10 Million Above US$100 Million Above US$100 Million Above US$100 Million Above US$100 Million
Business Model OEM, ODM OEM, ODM OEM OEM OEM, ODM
Average Lead Time Off Season Lead Time: within 15 workdays
Peak Season Lead Time: one month
- Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
-
Product Attributes
Specification
Metal Coating: Tin;
Mode of Production: SMT;
Layers: 1-22 Layers;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Solder Resist Color: Green;Red;Yellow;Black;White;
Order Qty: No Limited;
Shape: Retangular, Round, Slots, Cutouts, Complex, Irreg;
Surface Finished: HASL, Gold Finger, OSP, Enig, Peelable Mask;
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Shape: DIP;
Conductive Type: Bipolar Integrated Circuit;
Integration: Gsi;
Technics: Semiconductor IC;
D/C: Standard;
Warranty: 2 Years;
Mounting Type: Standard, SMT, DIP;
Cross Reference: Standard;
Memory Type: Standard;
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Board Layer: 8 L;
Surface Finihsing: Immersion Gold;
Lead Time: 6-8 Working Days;
Board Thickness: 0.5mm-7.0mm;
Material: Fr-4, Cem-1/Cem-3, Pi,High Tg,Rogers;
Max Panel Size: 32"×48"(800mm×1200mm);
Min Hole Size: 0.02mm;
Min Line Width: 3mil(0.075mm);
Copper Thickness: 0.2-7.0oz;
Soldermask: Green/Yellow/Black/White/Red/Blue;
Silkscreen: Red/Yellow/Black/White;
Min Pad: 5mil(0.13mm);
Certificate: UL,ISO 9001,ISO14001,IATF16949;
Material Suppilers: Shengyi, Kb, Nanya, Iteq,etc.;
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Board Layer: 4 Layer;
Surface Finihsing: Immersion Gold;
Lead Time: 6-8 Working Days;
Board Thickness: 0.5mm-7.0mm;
Material: Fr-4, Cem-1/Cem-3, Pi,High Tg,Rogers;
Max Panel Size: 32"×48"(800mm×1200mm);
Min Hole Size: 0.02mm;
Min Line Width: 3mil(0.075mm);
Copper Thickness: 0.2-7.0oz;
Soldermask: Green/Yellow/Black/White/Red/Blue;
Silkscreen: Red/Yellow/Black/White;
Min Pad: 5mil(0.13mm);
Certificate: UL,ISO 9001,ISO14001,IATF16949;
Material Suppilers: Shengyi, Kb, Nanya, Iteq,etc.;
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Shape: DIP;
Conductive Type: Bipolar Integrated Circuit;
Integration: Gsi;
Technics: Semiconductor IC;
D/C: Standard;
Warranty: 2 Years;
Mounting Type: Standard, SMT, DIP;
Cross Reference: Standard;
Memory Type: Standard;
Supplier Name

Hangzhou Fonieto Technology Co., Ltd.

Diamond Member Audited Supplier

Mu Star (shenzhen) Industry Co., Ltd.

Diamond Member Audited Supplier

Ucreate PCB Co., Ltd.

Diamond Member Audited Supplier

Ucreate PCB Co., Ltd.

Diamond Member Audited Supplier

Mu Star (shenzhen) Industry Co., Ltd.

Diamond Member Audited Supplier