Customized PCB Layout
US$0.01 / Piece
  • Recommend for you
  • What is OEM Multilayer PCB Manufacturer PCBA with Unique Solder Resist Color Options
  • What is Customized PCBA Solutions for Irregular and Complex Shapes
  • What is Smart PCB Layout Solutions for Customized Electronics Assembly Services

What is Professional Electronics Assembly with Customized PCB Layout Options

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$0.01 / Piece

Sepcifications

  • Metal Coating Tin
  • Mode of Production SMT
  • Layers 1-22 Layers
  • Base Material FR-4
  • Certification RoHS, CCC, ISO
  • Customized Customized
  • Condition New
  • Transport Package Inner Vacuum Packing Outer Carton Box
  • Specification FR 4, 0.8mm, 1 Layer, 1OZ Copper Thickness
  • Trademark OEM, ODM
  • Origin China
  • Solder Resist Color Green;Red;Yellow;Black;White
  • Order Qty No Limited
  • Shape Retangular, Round, Slots, Cutouts, Complex, Irreg
  • Surface Finished HASL, Gold Finger, OSP, Enig, Peelable Mask

Product Description

PCBA Production Capacity: Discover the future of technology with our unparalleled Printed Circuit Board Assembly (PCBA) production capabilities, where innovation meets craftsmanship. At Hangzhou Fonieto Technology Co., Ltd., our cutting-edge, state-of-the-art facilities are designed to meet the ...

Learn More

Customized PCB Layout Comparison
Transaction Info
Price US $ 0.01/ Piece US $ 20.00-30.00/ Piece US $ 0.87-5.00/ Piece US $ 20.00-30.00/ Piece US $ 20.00-30.00/ Piece
Min Order 1 Pieces 1 Pieces 10 Pieces 1 Pieces 1 Pieces
Payment Terms T/T, Paypal L/C, T/T, D/P, Western Union, Paypal, Money Gram T/T, D/P, Paypal, Money Gram L/C, T/T, D/P, Western Union, Paypal, Money Gram L/C, T/T, D/P, Western Union, Paypal, Money Gram
Quality Control
Product Certification RoHS, CCC, ISO RoHS, ISO RoHS, ISO RoHS, ISO RoHS, ISO
Management System Certification ISO 9001 ISO 9001, IATF16949, ISO 13485 ISO 9001, IATF16949, ISO 13485 ISO 9001, IATF16949, ISO 13485 ISO 9001, IATF16949, ISO 13485
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, Eastern Europe, Southeast Asia, Africa, Oceania, Eastern Asia, Western Europe North America, Eastern Europe, Southeast Asia, Africa, Oceania, Eastern Asia, Western Europe North America, Eastern Europe, Southeast Asia, Africa, Oceania, Eastern Asia, Western Europe North America, Eastern Europe, Southeast Asia, Africa, Oceania, Eastern Asia, Western Europe
Annual Export Revenue US$5 Million - US$10 Million US$10 Million - US$50 Million US$10 Million - US$50 Million US$10 Million - US$50 Million US$10 Million - US$50 Million
Business Model OEM, ODM OEM, ODM OEM, ODM OEM, ODM OEM, ODM
Average Lead Time Off Season Lead Time: within 15 workdays
Peak Season Lead Time: one month
Off Season Lead Time: one month
Peak Season Lead Time: 1-3 months
Off Season Lead Time: one month
Peak Season Lead Time: 1-3 months
Off Season Lead Time: one month
Peak Season Lead Time: 1-3 months
Off Season Lead Time: one month
Peak Season Lead Time: 1-3 months
Product Attributes
Specification
Metal Coating: Tin;
Mode of Production: SMT;
Layers: 1-22 Layers;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Solder Resist Color: Green;Red;Yellow;Black;White;
Order Qty: No Limited;
Shape: Retangular, Round, Slots, Cutouts, Complex, Irreg;
Surface Finished: HASL, Gold Finger, OSP, Enig, Peelable Mask;
Metal Coating: Tin;
Mode of Production: SMT+DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Testing: Spi,Aoi,Ict,Fct,X-ray,RoHS and Aging.;
Min. Component: 01005;
Max. PCB Mulitylayer: up to 64 Layers;
Max PCB Dimension: 740*400mm;
MOQ: Orders of Small or Medium Quantity Is Welcomed;
Metal Coating: Copper;
Mode of Production: DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
PCBA-Testing: X-ray, Aoi;
Processing: Electrolytic Foil;
SMT Capacity: >2 Million Points/Day;
DIP Capacity: >100K Parts/Day;
Min. Space of BGA: +/- 0.3mm;
Min.Pin Space of IC: 0.3mm;
Max.Precision of IC Assembly: 0.03mm;
Surface Finishing: Lead-Free HASL;
Number of Layers: 4-10 Layer;
Board Thickness: 1.6mm;
Metal Coating: Tin;
Mode of Production: SMT+DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Testing: Spi,Aoi,Ict,Fct,X-ray,RoHS and Aging.;
Min. Component: 01005;
Max. PCB Mulitylayer: up to 64 Layers;
Max PCB Dimension: 740*400mm;
MOQ: Orders of Small or Medium Quantity Is Welcomed;
Metal Coating: Tin;
Mode of Production: SMT+DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Testing: Spi,Aoi,Ict,Fct,X-ray,RoHS and Aging.;
Min. Component: 01005;
Max. PCB Mulitylayer: up to 64 Layers;
Max PCB Dimension: 740*400mm;
MOQ: Orders of Small or Medium Quantity Is Welcomed;
Supplier Name

Hangzhou Fonieto Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Hongzhou Smart Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Hongzhou Smart Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Hongzhou Smart Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Hongzhou Smart Technology Co., Ltd.

Diamond Member Audited Supplier