Ht66f018 Nsop16 Flash Type MCU Electronic Components

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

10 Pieces US$0.26-0.30 / Piece

Sepcifications

  • shape Flat
  • Conductive Type Unipolar Integrated Circuit
  • Integration SSI
  • Technics Thick Film IC
  • Transport Package Roll
  • Specification Plastic and copper
  • Trademark CHN
  • Origin Chn
  • Package / Case 8-Soic (0.154 ", 3.90mm Wide)
  • Installation Type Surface Mount
  • Interface Parallel
  • Output Configuration Half Bridge (2)
  • Function Driver-Fully Integrated, Control and Pow
  • Supply Voltage Voltage
  • Voltage-Load 6.6 V ~ 7.4 V

Product Description

Product Paramenters HT66F018 Company Profile Product packaging FAQ 1.Who are you? We are Manufacturer of High Quality China's Own Chips Included IC,Transistor,Resistor,Capacitors, Memory,IGBT, Mosfet,Traic/SCR,Optoelectronics.Almost all components of ...

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Electronic Components Comparison
Transaction Info
Price US $ 0.26-0.30/ Piece US $ 0.10-0.50/ Piece US $ 0.10-0.50/ Piece US $ 0.10-0.50/ Piece US $ 2/ Piece
Min Order 10 Pieces 1 Pieces 1 Pieces 1 Pieces 10 Pieces
Trade Terms FOB, CIF, EXW - - - -
Payment Terms L/C, T/T, Western Union, Paypal T/T, Western Union, Paypal T/T, Western Union, Paypal T/T, Western Union, Paypal T/T, Western Union, Paypal
Quality Control
Management System Certification - ISO 9001, ISO 14001, IATF16949, ISO 13485 ISO 9001, ISO 14001, IATF16949, ISO 13485 ISO 9001, ISO 14001, IATF16949, ISO 13485 GMP
Trade Capacity
Export Markets South America, Europe, Southeast Asia/ Mideast, Others North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea) North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea) North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea) North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model - OEM, ODM OEM, ODM OEM, ODM OEM
Average Lead Time Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
- - - -
Product Attributes
Specification
shape: Flat;
Conductive Type: Unipolar Integrated Circuit;
Integration: SSI;
Technics: Thick Film IC;
Package / Case: 8-Soic (0.154 ", 3.90mm Wide);
Installation Type: Surface Mount;
Interface: Parallel;
Output Configuration: Half Bridge (2);
Function: Driver-Fully Integrated, Control and Pow;
Supply Voltage: Voltage;
Voltage-Load: 6.6 V ~ 7.4 V;
shape: DIP;
Conductive Type: Bipolar Integrated Circuit;
Integration: VLSI;
Technics: Thin Film IC;
shape: DIP;
Conductive Type: Bipolar Integrated Circuit;
Integration: VLSI;
Technics: Thin Film IC;
shape: DIP;
Conductive Type: Bipolar Integrated Circuit;
Integration: VLSI;
Technics: Thin Film IC;
shape: SMD;
Technics: Semiconductor IC;
Core Size: 8-Bit;
Speed: 20MHz;
Connectivity: Linbus, Sci;
Peripherals: LVD, Por, PWM;
Number of I/O: 24;
Program Memory Size: 8kb (8K X 8);
Program Memory Type: Flash;
Eeprom Size: -;
RAM Size: 512 X 8;
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V;
Data Converters: a/D 10X10b;
Oscillator Type: Internal;
Supplier Name

Shenzhen Jin Da Peng Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Mu Star (shenzhen) Industry Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Mu Star (shenzhen) Industry Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Mu Star (shenzhen) Industry Co., Ltd.

China Supplier - Diamond Member Audited Supplier

ShenZhen Nova Semiconductor Co., Ltd.

China Supplier - Diamond Member Audited Supplier