Professional PCB Assembly/PCBA/PCB and Components Supplier, PCB Assembly Prototype PCBA

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

10 Pieces US$1.15 / Piece

Sepcifications

  • Type Rigid Circuit Board
  • Material Complex
  • Application Medical Instruments
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Aluminum
  • Insulation Materials Organic Resin
  • Transport Package Packed with ESD Protection in Carton
  • Specification Flexible base on drawing required
  • Trademark JC/OEM/ODM/CUSTOM
  • Origin China

Product Description

PRODUCT DESCRIPTION PCBA/PCB Assembly/Electronic Assembly/PCB Board/Circuit Board/Printed Circuit Board Layer: 1-40 layer Surface: HASL/OSP/ENIG/ImmersionGold/Flash Gold/Gold finger ect. Copper thickness: 0.25 Oz -12 Oz Material: FR-4,Halogen free,High TG,Cem-3,PTFE,Aluminum BT,Rogers ...

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PCBA Comparison
Transaction Info
Price US $ 1.15/ Piece US $ 0.01-0.02/ Piece US $ 0.01-0.02/ Piece US $ 0.01-0.02/ Piece US $ 0.01-0.02/ Piece
Min Order 10 Pieces 100 Pieces 100 Pieces 100 Pieces 100 Pieces
Trade Terms - - - - -
Payment Terms T/T, Western Union, Paypal, Money Gram T/T T/T T/T T/T
Quality Control
Management System Certification ISO 9001, IATF16949 ISO 9001 ISO 9001 ISO 9001 ISO 9001
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model OEM, ODM OEM, ODM OEM, ODM OEM, ODM OEM, ODM
Average Lead Time Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
- - - -
Product Attributes
Specification
Type: Rigid Circuit Board;
Material: Complex;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V1;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
PCB Layers: 2-18layers;
OEM Assembly: Supply;
DIP Assembly: Flowflow Welding+Hand Welding;
SMT Assembly: 0603-Qfp64;
Test: QC,Aoi,Fct,X-ray;
The Fastest Delivery Time: Sample(3-5/Day);
Electronic Components: Keep a Large Stock of Goods;
IC Program Burning: Supply;
Design: Supply;
Resistor-Capacitor: 01005-1206;
Electrostatic: Comprehensive Protection;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V1;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
PCB Layers: 2-20layers;
OEM Assembly: Supply;
DIP Assembly: Flowflow Welding+Hand Welding;
SMT Assembly: 01005-Qfp64,BGA;
Test: QC,Aoi,Fct,X-ray;
The Fastest Delivery Time: Sample(3-5/Day);
Electronic Components: Keep a Large Stock of Goods;
IC Program Burning: Supply;
Design: Supply;
Resistor-Capacitor: 01005-1206;
Electrostatic: Comprehensive Protection;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V1;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
PCB Layers: 2-20layers;
OEM Assembly: Supply;
DIP Assembly: Flowflow Welding+Hand Welding;
SMT Assembly: 01005-Qfp64,BGA;
Test: QC,Aoi,Fct,X-ray;
The Fastest Delivery Time: Sample(3-5/Day);
Electronic Components: Keep a Large Stock of Goods;
IC Program Burning: Supply;
Design: Supply;
Resistor-Capacitor: 01005-1206;
Electrostatic: Comprehensive Protection;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V1;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
PCB Layers: 2-20layers;
OEM Assembly: Supply;
DIP Assembly: Flowflow Welding+Hand Welding;
SMT Assembly: 01005-Qfp64,BGA;
Test: QC,Aoi,Fct,X-ray;
The Fastest Delivery Time: Sample(3-5/Day);
Electronic Components: Keep a Large Stock of Goods;
IC Program Burning: Supply;
Design: Supply;
Resistor-Capacitor: 01005-1206;
Electrostatic: Comprehensive Protection;
Supplier Name

Shenzhen Jia Cheng Electric Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen Haodley Technology Co., Ltd.

China Supplier - Gold Member Audited Supplier

Shenzhen Haodley Technology Co., Ltd.

China Supplier - Gold Member Audited Supplier

Shenzhen Haodley Technology Co., Ltd.

China Supplier - Gold Member Audited Supplier

Shenzhen Haodley Technology Co., Ltd.

China Supplier - Gold Member Audited Supplier