Contract Manufacturing Inverter Welding Machine PCB/PCBA/ Circuit Board

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

10 Pieces US$1.15 / Piece

Sepcifications

  • Type Rigid Circuit Board
  • Material Complex
  • Application Medical Instruments
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Aluminum
  • Insulation Materials Organic Resin
  • Transport Package Packed with ESD Protection in Carton
  • Specification Flexible base on drawing required
  • Trademark JC/OEM/ODM/CUSTOM
  • Origin China

Product Description

PRODUCT DESCRIPTION PCBA/PCB Assembly/Electronic Assembly/PCB Board/Circuit Board Layer: 1-40 layer Surface: HASL/OSP/ENIG/ImmersionGold/Flash Gold/Gold finger ect. Copper thickness: 0.25 Oz -12 Oz Material: FR-4,Halogen free,High TG,Cem-3,PTFE,Aluminum BT,Rogers Board thickness 0.1 to ...

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PCBA Comparison
Transaction Info
Price US $ 1.15/ Piece US $ 0.01-0.30/ Piece US $ 0.30-3.00/ Piece US $ 0.55-16.00/ Piece US $ 0.47-14.00/ Piece
Min Order 10 Pieces 1 Pieces 2 Pieces 1 Pieces 1 Pieces
Payment Terms T/T, Western Union, Paypal, Money Gram T/T, Western Union, Paypal, 30 days net T/T, D/P, Western Union T/T, D/P, Western Union T/T, D/P, Western Union
Quality Control
Management System Certification ISO 9001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, IATF16949 ISO 9001, IATF16949 ISO 9001, IATF16949
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe
Annual Export Revenue US$2.5 Million - US$5 Million US$50 Million - US$100 Million US$1 Million - US$2.5 Million US$1 Million - US$2.5 Million US$1 Million - US$2.5 Million
Business Model OEM, ODM OEM OEM, ODM OEM, ODM OEM, ODM
Average Lead Time Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
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Product Attributes
Specification
Type: Rigid Circuit Board;
Material: Complex;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Flex-Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Board Thickness: 0.1mm;
Copper Thickness: 35um;
Surface Finish: Enig;
Solder Mask: Coverlay;
Legend: Without;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Consumer Electronics;
Flame Retardant Properties: V2;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: New Chip;
Layer: 1-32 Layers;
Service: OEM/ODM;
OEM/ODM: Available;
Test: 100%E-Testing;
Layer Count: 1-20 Layers;
Shipping: DHL/UPS/FedEx/Air/Sea;
Surface Treatmen: OSP, Enig, HASL, AG Immersion;
Certificate Gurantee: Yes;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: New Chip;
Layer: 1-32 Layers;
Service: OEM/ODM;
OEM/ODM: Available;
Test: 100%E-Testing;
Layer Count: 1-20 Layers;
Shipping: DHL/UPS/FedEx/Air/Sea;
Surface Treatmen: OSP, Enig, HASL, AG Immersion;
Certificate Gurantee: Yes;
Type: Rigid Circuit Board;
Dielectric: CEM-3;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: New Chip;
Layer: 1-32 Layers;
Service: OEM/ODM;
OEM/ODM: Available;
Test: 100%E-Testing;
Layer Count: 1-20 Layers;
Shipping: DHL/UPS/FedEx/Air/Sea;
Surface Treatmen: OSP, Enig, HASL, AG Immersion;
Certificate Gurantee: Yes;
Supplier Name

Shenzhen Jia Cheng Electric Co., Ltd.

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Shenzhen New Chip international Ltd

Gold Member Audited Supplier

Shenzhen New Chip international Ltd

Gold Member Audited Supplier

Shenzhen New Chip international Ltd

Gold Member Audited Supplier