Module Control Board PCBA Design&Manufacturing&Assembly

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$8.00 / Piece

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Fiberglass Epoxy
  • Application Aerospace
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Aluminum
  • Insulation Materials Organic Resin
  • Origin China

Product Description

PRODUCT DESCRIPTION Layer: 1-40 layer Surface: HASL/OSP/ENIG/ImmersionGold/Flash Gold/Gold finger ect. Copper thickness: 0.25 Oz -12 Oz Material: FR-4,Halogen free,High TG,Cem-3,PTFE,Aluminum BT,Rogers Board thickness 0.1 to 6.0mm(4 to 240mil) Minimum line width/space 0.076/0.076mm ...

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PCBA Comparison
Transaction Info
Price US $ 8/ Piece US $ 0.20-0.60/ Piece US $ 0.0001-0.10/ Piece US $ 0.03-10.00/ Piece US $ 0.0001-0.10/ Piece
Min Order 1 Pieces 1 Pieces 1 Pieces 1 Pieces 1 Pieces
Payment Terms L/C, T/T, D/P, Western Union, Paypal, Money Gram T/T, D/P, Western Union, Paypal L/C, T/T, D/P, Western Union, Paypal, Money Gram T/T, D/P, Western Union, Paypal L/C, T/T, D/P, Western Union, Paypal, Money Gram
Quality Control
Product Certification - - N/a - N/a
Management System Certification ISO 9001, IATF16949 ISO 9001, IATF16949 GMP ISO 9001, IATF16949 GMP
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue US$2.5 Million - US$5 Million US$1 Million - US$2.5 Million US$50 Million - US$100 Million US$1 Million - US$2.5 Million US$50 Million - US$100 Million
Business Model OEM, ODM OEM, ODM OEM OEM, ODM OEM
Average Lead Time Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
- - - -
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Consumer Electronics;
Flame Retardant Properties: V2;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: New Chip;
Capacity: 1000000;
OEM/ODM: Available;
Sample: Available;
Surface Treatment: OSP, Enig, HASL, AG Immersion;
Certificate Gurantee: Yes;
Test: 100%E-Testing;
Min Bonding Pad Diameter: 10mil;
Min Thickness of Soldermask: 10um;
Color of Silk-Screen: White, Yellow, Black;
Data File Format: Gerber File and Drilling File, Protel Series, ...;
Material for PCB: Fr-4, High Tg Fr$, Halogen Free,;
Layer Count: 1-20 Layers;
Shipping: DHL/UPS/FedEx/Air/Sea;
Material: N/a;
Encapsulation Structure: N/a;
Installation: N/a;
Working Frequency: N/a;
Power Level: N/a;
Function: N/a;
Structure: N/a;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Consumer Electronics;
Flame Retardant Properties: V2;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: New Chip;
Capacity: 1000000;
OEM/ODM: Available;
Sample: Available;
Surface Treatment: OSP, Enig, HASL, AG Immersion;
Certificate Gurantee: Yes;
Test: 100%E-Testing;
Min Bonding Pad Diameter: 10mil;
Min Thickness of Soldermask: 10um;
Color of Silk-Screen: White, Yellow, Black;
Data File Format: Gerber File and Drilling File;
Material for PCB: Fr-4, High Tg Fr$, Halogen Free;
Layer Count: 1-20 Layers;
Shipping: DHL/UPS/FedEx/Air/Sea;
Material: N/a;
Encapsulation Structure: N/a;
Installation: N/a;
Working Frequency: N/a;
Power Level: N/a;
Function: N/a;
Structure: N/a;
Supplier Name

Shenzhen Jia Cheng Electric Co., Ltd.

Diamond Member Audited Supplier

Shenzhen New Chip international Ltd

Gold Member Audited Supplier

ShenZhen Nova Semiconductor Co., Ltd.

Diamond Member Audited Supplier

Shenzhen New Chip international Ltd

Gold Member Audited Supplier

ShenZhen Nova Semiconductor Co., Ltd.

Diamond Member Audited Supplier