Specification |
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: Used;
PCBA-Testing: X-ray, Aoi;
Type: Rigid Circuit Board;
Processing Technology: Electrolytic Foil;
Insulation Materials: Organic Resin;
Flame Retardant Properties: V0;
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Metal Coating: Copper/Tin/Gold/Silver/HASL/OSP/Enig;
Mode of Production: SMT and DIP;
Layers: Multilayer;
Base Material: Fr-4/ High Tg Fr-4/ Aluminum/ Ceramic/ Copper/ Hal;
Customized: Customized;
Condition: New;
Service: PCB+Assembly+Components;
Solder Mask Color: White.Black.Yellow.Green.Red.Blue;
Testing Service: Electrical Testing, Flying Probe Tester,;
Min. Hole Size: 0.15mm;
Min. Line Spacing: 0.075---0.09mm;
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Metal Coating: Copper/Tin/Gold/Silver/HASL/OSP/Enig;
Mode of Production: SMT and DIP;
Layers: Multilayer;
Base Material: Fr-4/ High Tg Fr-4/ Aluminum/ Ceramic/ Copper/ Hal;
Customized: Customized;
Condition: New;
Service: PCB+Assembly+Components;
Solder Mask Color: White.Black.Yellow.Green.Red.Blue;
Testing Service: Electrical Testing,Flying Probe Tester,Functional;
Min. Hole Size: 0.15mm;
Min. Line Spacing: 0.075---0.09mm;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: Fr4 (140tg, 170tg, 180tg), Fr-406, Fr-408, 370hr;
Customized: Customized;
Condition: New;
MOQ: 1 Piece;
Handing Standards: Ipc-a-600h, Ipc-a-610f, J-Std-001f;
Technical Support: Free Dfm/a Check, Bom Analysis;
Assembly Abilities: SMT 5 Milli Points Per Day, DIP 10 Thousands Piec;
Assembly Details: 5 SMT + 2 DIP (Dust and Anti-Static Lines);
5 SMT + 2 DIP (Dust and Anti-Static Lin: PCB Design + PCB Fab + Components Sourcing + PCB;
Value-Added Services: Bom Analysis, Conformal Coating, IC Programming, W;
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Metal Coating: Copper;
Mode of Production: SMT DIP;
Layers: Multilayer;
Base Material: Fr4,High Tg Fr4,Aluminum,Rogers,Cem-3,Cem-1 etc;
Customized: Customized;
Condition: New;
Layer: 1 to 20;
Insulation Material: Organic Resin;
PCB Type: Rigid PCB Circuit Board;
Certificate: ISO/CQC/IATF/UL/RoHS;
PCBA-Testing: X-ray, Aoi;
Surface Finishing: OSP, Immersion Gold, Gold Plating, Enig, Enepig;
Solder Mask: Green/Black/White/Red/Blue/Yellow/Purple.etc;
Board Thickness: 0.2mm-8mm;
Copper Thickness: 18um-3500um(0.5- 100oz);
PCB Material: Fr-4, Cem-1, Cem-3, Hight Tg, Fr4 Halogen Free;
PCB Shape: Rectangular, Round, Slots, Cutouts, Complex;
PCBA Packaging: ESD Bag+Bubble Wrapped +Carton;
OEM/ODM: Support;
Warranty: 1 Year;
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