Bom Gerber Files Multilayer PCB/PCBA Supplier and Reverse Engineering Services

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

10 Pieces US$1.15 / Piece

Sepcifications

  • Type Rigid Circuit Board
  • Material Complex
  • Application Medical Instruments
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Aluminum
  • Insulation Materials Organic Resin
  • Transport Package Packed with ESD Protection in Carton
  • Specification Flexible base on drawing required
  • Trademark JC/OEM/ODM/CUSTOM
  • Origin China

Product Description

PRODUCT DESCRIPTION PCBA/PCB Assembly/Electronic Assembly/PCB Board/Circuit Board/Printed Circuit Board Layer: 1-40 layer Surface: HASL/OSP/ENIG/ImmersionGold/Flash Gold/Gold finger ect. Copper thickness: 0.25 Oz -12 Oz Material: FR-4,Halogen free,High TG,Cem-3,PTFE,Aluminum BT,Rogers ...

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PCBA Comparison
Transaction Info
Price US $ 1.15/ Piece Negotiable US $ 0.10-20.00/ Piece US $ 0.10-100.00/ Piece US $ 0.10-100.00/ Piece
Min Order 10 Pieces 1 pcs 1 Pieces 10 Pieces 10 Pieces
Trade Terms - - - - -
Payment Terms T/T, Western Union, Paypal, Money Gram L/C, T/T, D/P, Western Union, Paypal T/T, Western Union, Paypal, Money Gram L/C, T/T, D/P L/C, T/T, D/P
Quality Control
Product Certification - - - RoHS, UL, ISO RoHS, UL, ISO
Management System Certification ISO 9001, IATF16949 ISO 9001, ISO 9000, ISO 13485 ISO 9001, ISO 14001, OHSAS/ OHSMS 18001, IATF16949, ISO 13485 - -
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia, Domestic North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Domestic South America, Europe, Southeast Asia/ Mideast, Africa, Domestic South America, Europe, Southeast Asia/ Mideast, Africa, Domestic
Annual Export Revenue - - - - -
Business Model OEM, ODM OEM, ODM, Own Brand - - -
Average Lead Time Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
- - -
Product Attributes
Specification
Type: Rigid Circuit Board;
Material: Complex;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Type: Insulation Sheet;
Material: Fiberglass;
Application: Cellular Base Station Antennas, Power-Amplifier;
Flame Retardant Properties: HB;
Mechanical Rigid: Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Wl;
Classification: Organic Insulating Material;
Color: White|Yellow;
Dielectric Constant: 3.48+-0.05;
Thickness(mm): Customized;
Density(G/ Cm3): 1.9;
Thermal Conductivity(W/M/K): 0.7;
Type: Rigid Circuit Board;
Material: Fr4;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Hl-PCB;
Surface Treatment: Lead Free HASL;
Mini Hole Diameter: 0.3mm;
Borad Thickness: 1.6mm;
Count Layer: 4;
Inner/Outer Copper Thickness: 3oz/3oz;
Min Trace Width/Spacing: 10mil/10mil;
Special: High Tg, Impedance Control, Resin Plug Vias;
Certificated: ISO9001, ISO14001, CQC, IATF16949, UL, RoHS etc.;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Yldz;
Test: 100% E-Test;
Surface Treatment: 100% Tin;
Board Thickness: 0.2-6mm;
One Stop Service: PCB Assembly, Component Sourcing, Box Building;
Solder Mask: Green;
Layers: 1-36 Layers;
Copper Thickness: 0.5-12oz(18-420um);
a Special Process: Carbon Film Printing;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Yldz;
Test: 100% E-Test;
Surface Treatment: 100% Tin;
Board Thickness: 0.2-6mm;
One Stop Service: PCB Assembly, Component Sourcing, Box Building;
Solder Mask: Green;
Layers: 1-36 Layers;
Copper Thickness: 0.5-12oz(18-420um);
a Special Process: Carbon Film Printing;
Supplier Name

Shenzhen Jia Cheng Electric Co., Ltd.

China Supplier - Diamond Member Audited Supplier

New Vision Meditec Co., Limited

China Supplier - Gold Member Audited Supplier

Shenzhen Honglian Circuit Co., Ltd.

China Supplier - Gold Member Audited Supplier

Wenzhou Yongli Electronics Co, . Ltd

China Supplier - Diamond Member Audited Supplier

Wenzhou Yongli Electronics Co, . Ltd

China Supplier - Diamond Member Audited Supplier