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US$0.50-1.90 / Piece
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What is PCB Board Manufacture PCBA SMT DIP Assembly Service Layout PCB Board

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

1-998 Pieces US$1.90

999-9,998 Pieces US$0.90

9,999+ Pieces US$0.50

Sepcifications

  • Structure Multilayer Rigid PCB
  • Dielectric FR-4
  • Material Polyester Glass Fiber Mat Laminate
  • Application Consumer Electronics
  • Flame Retardant Properties V0
  • Processing Technology Electrolytic Foil
  • Production Process Semi-Additive Process
  • Base Material Copper
  • Insulation Materials Metal Composite Materials
  • Transport Package Carton Box
  • Specification 200pcs/CTN
  • Trademark Customer′ s brand
  • Origin China
  • Board Material Fr4, H-Tg, It-180A, Cem, Aluminum
  • Board Thickness 0.4-5.0mm
  • Solder Mask Color Green, White, Black, Blue, Yellow, Red, Purple
  • Silkscreen Color Green, White, Black, Blue, Yellow
  • Copper Thickness 0.5-10 Oz
  • Layer 1-60 Layers
  • Min. SMD Size 01005
  • Surface Finishing HASL, Lf HASL, Enig, OSP, Carbon Oil
  • Testing E-Test, Fly Probe Test, Visual Checking,Aoi,X-ray
  • MOQ 1PCS
  • Service Turnkey PCB Assembly Service
  • PCBA Test Aoi, in-Circuit Test (Ict), Functioal Test (Fct)
  • PCB Max. Board Size 620*1100mm
  • Certificates UL (E503048),ISO9001/ISO14001/IATF16949/ISO13485

Product Description

About Us Shenzhen Jingxin Electronic Technology Co., Ltd. is a professional enterprise dedicated to PCB and PCBA manufacturing for 20 years, providing professional OEM electronic manufacturing services for customers in various fields around the world. Since its establishment in 2002, the company ...

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Semi-Finished Products Comparison
Transaction Info
Price US $ 0.50-1.90/ Piece US $ 0.1/ Piece US $ 0.1/ Piece US $ 0.1/ Piece US $ 0.1/ Piece
Min Order 1 Pieces 1 Pieces 1 Pieces 1 Pieces 1 Pieces
Trade Terms - FOB, CFR, CIF, DAT, FAS, DDP, DAP, CIP, CPT, FCA, EXW FOB, CFR, CIF, DAT, FAS, DDP, DAP, CIP, CPT, FCA, EXW FOB, CFR, CIF, DAT, FAS, DDP, DAP, CIP, CPT, FCA, EXW FOB, CFR, CIF, DAT, FAS, DDP, DAP, CIP, CPT, FCA, EXW
Payment Terms T/T L/C, T/T, D/P, Western Union, Paypal, Money Gram L/C, T/T, D/P, Western Union, Paypal, Money Gram L/C, T/T, D/P, Western Union, Paypal, Money Gram L/C, T/T, D/P, Western Union, Paypal, Money Gram
Quality Control
Product Certification - RoHS, UL, SGS, Ect RoHS, UL, SGS, Ect RoHS, UL, SGS, Ect RoHS, UL, SGS, Ect
Management System Certification ISO 9001, ISO 14000, IATF16949, GMP ISO 9001, ISO 14001 ISO 9001, ISO 14001 ISO 9001, ISO 14001 ISO 9001, ISO 14001
Trade Capacity
Export Markets North America, Eastern Europe, Africa, Mid East, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model OEM, ODM, Others OEM, ODM OEM, ODM OEM, ODM OEM, ODM
Average Lead Time Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Product Attributes
Specification
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Semi-Additive Process;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Board Material: Fr4, H-Tg, It-180A, Cem, Aluminum;
Board Thickness: 0.4-5.0mm;
Solder Mask Color: Green, White, Black, Blue, Yellow, Red, Purple;
Silkscreen Color: Green, White, Black, Blue, Yellow;
Copper Thickness: 0.5-10 Oz;
Layer: 1-60 Layers;
Min. SMD Size: 01005;
Surface Finishing: HASL, Lf HASL, Enig, OSP, Carbon Oil;
Testing: E-Test, Fly Probe Test, Visual Checking,Aoi,X-ray;
MOQ: 1PCS;
Service: Turnkey PCB Assembly Service;
PCBA Test: Aoi, in-Circuit Test (Ict), Functioal Test (Fct);
PCB Max. Board Size: 620*1100mm;
Certificates: UL (E503048),ISO9001/ISO14001/IATF16949/ISO13485;
Structure: Metal Base Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Surface Finishing: Lf-Hal;
Copper Thickness: 1oz;
Board Thickness: 1.6mm;
Min. Hole Size: 0.25mm;
Min. Line Wigth: 0.15mm;
Min. Line Spacing: 0.15mm;
Color: Green;
Size: 35*45mm;
Package: Vacuum;
Structure: Metal Base Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Surface Finishing: Lf-Hal;
Copper Thickness: 1oz;
Board Thickness: 1.6mm;
Min. Hole Size: 0.25mm;
Min. Line Wigth: 0.15mm;
Min. Line Spacing: 0.15mm;
Color: Black;
Size: 35*45mm;
Package: Vacuum;
Structure: Metal Base Rigid PCB;
Dielectric: Al;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Surface Finishing: Lf-Hal;
Copper Thickness: 1oz;
Board Thickness: 1.6mm;
Min. Hole Size: 0.25mm;
Min. Line Wigth: 0.15mm;
Min. Line Spacing: 0.15mm;
Color: White;
Size: 35*45mm;
Package: Vacuum;
Structure: Metal Base Rigid PCB;
Dielectric: Al;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Surface Finishing: Lf-Hal;
Copper Thickness: 1oz;
Board Thickness: 1.6mm;
Min. Hole Size: 0.25mm;
Min. Line Wigth: 0.15mm;
Min. Line Spacing: 0.15mm;
Color: White;
Size: 35*45mm;
Package: Vacuum;
Supplier Name

Shenzhen Jingxin Electronic Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen Xinjiaye Electronics Technology Co., Ltd.

China Supplier - Gold Member Audited Supplier

Shenzhen Xinjiaye Electronics Technology Co., Ltd.

China Supplier - Gold Member Audited Supplier

Shenzhen Xinjiaye Electronics Technology Co., Ltd.

China Supplier - Gold Member Audited Supplier

Shenzhen Xinjiaye Electronics Technology Co., Ltd.

China Supplier - Gold Member Audited Supplier