Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Jingxin;
Product Type: Custom HDI PCBA;
Service: One-Stop SMT, DIP Assembly;
Raw Material: Fr4/Cem-1/Cem-3/Fr1/Aluminum;
Board Thickness: 0.2mm-7mm;
Layer: 1-32 Layers;
Copper Thickness: 18um-210um(6oz);
Solder Mask Color: Blue, Green, Red, Black, White., etc;
Surface Finishing: HASL/ Enig/ Lf-Hal/ Immersion Tin/ Immersion Sin/;
Max PCB Size: 640mm*1100mm;
PCBA Testing Service: Aoi, Ict, X-ray, Flying Probe Test;
PCBA Packaging: ESD Bag, Shockproof Bag, Anti-Drop Bag;
Product Application: Consumer Electronics/Home Appliances/Medical Equip;
PCB Type: Rigid PCB, Flexible PCB, HDI PCB, Copper PCB;
Lead Time: 1-2 Layers: 5 to 7working Days 4-8 Layers: 10 Work;
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Type: Flexible Circuit Board;
Dielectric: Polyimide;
Material: Polyimide (Pi);
Application: Industrial Control Intercoms;
Flame Retardant Properties: V0;
Mechanical Rigid: Fexible;
Processing Technology: Enig;
Base Material: Polyimide (Pi);
Insulation Materials: Polyimide;
Brand: Iteq;
Board Types: Flexible PCB;
Test: 100% Electrical Test Prior Shipment;
Type of Artwork to Be Supplied: Email File, Gerber RS-274-X, Pcbdoc etc;
Service Area: Worldwide, Globally;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Auto;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Layer: 1-20 Layers;
Raw Material: Fr-4,Cu Base,High Tg Fr-4,PTFE,Rogers,Teflon etc.;
Board Thickness: 0.20mm-8.00mm;
Minimum Line/ Space: 0.075mm;
Impedance Control Tolerance: +/-10%;
Surface Finish/Treatment: HASL,Enig,Chem,Tin,Flash Gold, OSP, Gold Finger;
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Type: Rigid-Flexible PCB;
Dielectric: Panasonic R-F777 Polyimide;
Material: S1000-2m Fr-4;
Application: Industrial Automation;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid-Flexible PCB;
Processing Technology: Enig;
Base Material: Rigid: Fr-4 (2.0 mm) Flexible: Polyimide (0.21 mm);
Insulation Materials: Polyimide (Pi);
Brand: Shengyi;
Board Types: Flexible PCB;
Test: 100% Electrical Test Prior Shipment;
Type of Artwork to Be Supplied: Email File, Gerber RS-274-X, Pcbdoc etc;
Service Area: Worldwide, Globally;
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Type: Flexible Circuit Board;
Dielectric: Polyimide;
Material: Polyimide (Pi);
Application: Capacitive Touch Screens/Panels;
Flame Retardant Properties: V0;
Mechanical Rigid: Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Polyimide (Pi);
Insulation Materials: Polyimide;
Brand: Shengyi;
Board Types: Flexible PCB;
Test: 100% Electrical Test Prior Shipment;
Type of Artwork to Be Supplied: Email File, Gerber RS-274-X, Pcbdoc etc;
Service Area: Worldwide, Globally;
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