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US$1.50-3.00 / Piece
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What is Professional PCB PCBA Factory Produce Printed Circuit Board Assembly 1-24 Layers HASL PCB Enig PCB PCBA

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

1-49 Pieces US$3.00

50-4,999 Pieces US$2.50

5,000+ Pieces US$1.50

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Paper Phenolic Copper Foil Substrate
  • Flame Retardant Properties V2
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Copper
  • Insulation Materials Organic Resin
  • Model FR-4
  • Brand Jingxin
  • Transport Package Carton Box
  • Specification 200pcs/CTN
  • Trademark Customer′ s brand
  • Origin China
  • Surface Finished Enig
  • Solder Mask Green
  • Silkscreen White
  • Layer Capacities 1-24 Layers
  • PCBA Used for BMS

Product Description

Product Description Specification: PCB layers: 1-24layers PCB materials: CEM1, CEM3, Rogers, FR-4, High Tg FR-4, Aluminum Base, Halogen Free PCB max. board size: 620*1100mm PCB certificate: RoHS Directive-Compliant PCB Thickness: 1.6 ±0.1mm Out Layer Copper Thickness: 0.5-5oz ...

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PCBA Comparison
Transaction Info
Price US $ 1.50-3.00/ Piece US $ 0.10-1.00/ Piece US $ 1.00-100.00/ Piece US $ 0.10-1.00/ Piece US $ 0.10-1.00/ Piece
Min Order 1 Pieces 1 Pieces 1 Pieces 1 Pieces 1 Pieces
Payment Terms T/T L/C, T/T, Western Union T/T L/C, T/T, Western Union L/C, T/T, Western Union
Quality Control
Management System Certification ISO 9001, ISO 14000, IATF16949, GMP ISO 9001, ISO 9000, ISO 14001 ISO 9001, ISO 14001 ISO 9001, ISO 9000, ISO 14001 ISO 9001, ISO 9000, ISO 14001
Trade Capacity
Export Markets North America, Eastern Europe, Africa, Mid East, Western Europe South America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe North America, Eastern Europe, Mid East, Western Europe South America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe South America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe
Annual Export Revenue US$10 Million - US$50 Million US$50 Million - US$100 Million US$2.5 Million - US$5 Million US$50 Million - US$100 Million US$50 Million - US$100 Million
Business Model OEM, ODM, IMS service OEM, ODM OEM, ODM OEM, ODM OEM, ODM
Average Lead Time Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
- Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Paper Phenolic Copper Foil Substrate;
Flame Retardant Properties: V2;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Model: FR-4;
Brand: Jingxin;
Surface Finished: Enig;
Solder Mask: Green;
Silkscreen: White;
Layer Capacities: 1-24 Layers;
PCBA: Used for BMS;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Immersion Gold;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Copper Thickness: 3oz -105oz;
Surface Finish: Gold Finger;
Special Teck: Metal Edging;
Special 1: Blind Hole;
Special 2: Buried Vias;
Special 3: Flex-Rigid PCB;
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Max Layer Counts: 6 Layer;
Max Copper Thickness: 2oz;
Mininum Line Width: 3mil;
Minimum Line Space: 3mil;
UL Certificate: Yes;
Sample Building: Yes;
Quickturn Service: Yes;
Country of Origin: China;
Packing: Vacuum Packing;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Immersion Gold;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Copper Thickness: 3oz -105oz;
Surface Finish: Gold Finger;
Special Teck: Metal Edging;
Special 1: Blind Hole;
Special 2: Buried Vias;
Special 3: Flex-Rigid PCB;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Immersion Gold;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Copper Thickness: 3oz -105oz;
Surface Finish: Gold Finger;
Special Teck: Metal Edging;
Special 1: Blind Hole;
Special 2: Buried Vias;
Special 3: Flex-Rigid PCB;
Supplier Name

Shenzhen Jingxin Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Hemeixin Electronic Co., Limited

Gold Member Audited Supplier

Shenzhen Greenstone Technology Limited

Diamond Member Audited Supplier

Shenzhen Hemeixin Electronic Co., Limited

Gold Member Audited Supplier

Shenzhen Hemeixin Electronic Co., Limited

Gold Member Audited Supplier