Medical PCBA

US$0.80-5.00 / Piece

Multi-Layer Printed Circuit Board Fr4 PCB Motherboard PCBA for Medical pictures & photos

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What is Multi-Layer Printed Circuit Board Fr4 PCB Motherboard PCBA for Medical

Name: Multi-Layer Printed Circuit Board Fr4 PCB Motherboard PCBA for Medical
Uploaded: 2024-06-13T13:43:02+08:00
Description: It can be a challenge to find the optimal supplier for PCBs - meeting each and all customers' expectations and requirements on price, quality, lead times, value-added services, and delivery. PCB is co

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Price

Purchase Qty. Reference FOB Price

1-98 Pieces US$5.00

99-998 Pieces US$4.00

999-9,998 Pieces US$2.50

9,999+ Pieces US$0.80

Sepcifications

Structure Double-Sided Rigid PCB
Dielectric FR-4
Material Polyester Glass Fiber Mat Laminate
Application Consumer Electronics
Flame Retardant Properties V0
Processing Technology Electrolytic Foil
Production Process Semi-Additive Process
Base Material Copper
Insulation Materials Organic Resin
Transport Package Carton Box
Specification 200pcs/CTN
Trademark Customer′ s brand
Origin China

Product Description

It can be a challenge to find the optimal supplier for PCBs - meeting each and all customers' expectations and requirements on price, quality, lead times, value-added services, and delivery. PCB is confidant that we meet each and every expectations for your each PCB. Material Technology Our ...

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Shenzhen Jingxin Electronic Technology Co., Ltd.

Diamond Member Since 2022

Audited Supplier

Business Type Manufacturer/Factory, Trading Company, Group Corporation
Main Products PCB, PCBA, Print Circuit Board, Flexible Circuit Board, Rigid PCB Assembly, PCB Assembly, Circuit Board, FPC, HDI PCB
Registered Capital 16000000 RMB
Management System Certification ISO 9001, ISO 14000, IATF16949, GMP
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
OEM/ODM Availability Yes

Medical PCBA Comparison

	Multi-Layer Printed Circuit Board Fr4 PCB Motherboard PCBA for Medical Contact Now	Quick View 2.6mm Thickness Differential Impedance Control 12layer PCB Motherboard Circuit Contact Now	Quick View Tg180 16layer Impedance Control Enig PCB for Telecommunication Contact Now	Quick View Tg180 Impedance Control 16layer Enig PCB Circuit Board for Military Contact Now	Quick View Rhasl-Lf Impedance Control PCB Circuit Board Contact Now

Transaction Info
	Multi-Layer Printed Circuit Board Fr4 PCB Motherboard PCBA for Medical Contact Now	Quick View 2.6mm Thickness Differential Impedance Control 12layer PCB Motherboard Circuit Contact Now	Quick View Tg180 16layer Impedance Control Enig PCB for Telecommunication Contact Now	Quick View Tg180 Impedance Control 16layer Enig PCB Circuit Board for Military Contact Now	Quick View Rhasl-Lf Impedance Control PCB Circuit Board Contact Now
Price	US $ 0.80-5.00/ Piece	US $ 0.715-5.40/ Piece	US $ 2.12-8.50/ Piece	US $ 1.27-6.28/ Piece	US $ 0.632-2.86/ Piece
Min Order	1 Pieces	100 Pieces	100 Pieces	100 Pieces	100 Pieces
Payment Terms	T/T	T/T, Western Union, Paypal	T/T, Western Union, Paypal	T/T, Western Union, Paypal	T/T, Western Union, Paypal
Quality Control
Management System Certification	ISO 9001, ISO 14000, IATF16949, GMP	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE, GMP	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE, GMP	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE, GMP	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE, GMP
Trade Capacity
Export Markets	North America, Eastern Europe, Africa, Mid East, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	US$10 Million - US$50 Million	US$50 Million - US$100 Million	US$50 Million - US$100 Million	US$50 Million - US$100 Million	US$50 Million - US$100 Million
Business Model	OEM, ODM, IMS service	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM
Average Lead Time	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays
Product Attributes
Specification	Structure: Double-Sided Rigid PCB; Dielectric: FR-4; Material: Polyester Glass Fiber Mat Laminate; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Semi-Additive Process; Base Material: Copper; Insulation Materials: Organic Resin;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxy Paper Laminate; Application: Medical Instruments; Flame Retardant Properties: V0; Processing Technology: Enig; Production Process: Additive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Layer Count: up to 64; Cu Thickness: up to 12oz; Board Thickness: up to 8mm; Min. Hole to Line: 7.8mil; Surface Finish: Plated Gold 40u; Min. Trace Line&Space: 3/3mil;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxy Paper Laminate; Application: Communication; Flame Retardant Properties: V0; Processing Technology: Enig; Production Process: Additive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: 1; Layer Count: up to 64; Cu Thickness: up to 12oz; Board Thickness: up to 8mm; Min. Hole to Line: 8mil; Surface Finish: Immersiong Gold; Other: Impedance Control 3mil;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxy Paper Laminate; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Enig; Production Process: Additive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: 1; Layer Count: up to 64; Cu Thickness: up to 12oz; Board Thickness: up to 8mm; Min. Hole to Line: 8mil; Surface Finish: Immersiong Gold; Other: Impedance Control 3mil;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxy Paper Laminate; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Enig; Production Process: Additive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: 1; Layer Count: up to 64; Cu Thickness: up to 12oz; Board Thickness: up to 8mm; Min. Pad: 4mil; Surface Finish: Enig; Other: Impedance Control;
Supplier Name	Shenzhen Jingxin Electronic Technology Co., Ltd.	Shanghai Gawin Electronic Technology Co., Ltd.	Shanghai Gawin Electronic Technology Co., Ltd.	Shanghai Gawin Electronic Technology Co., Ltd.	Shanghai Gawin Electronic Technology Co., Ltd.
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