Specification |
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxide Woven Glass Fabric Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: HB;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Brand: Jxpcba;
Layer: 1-32 Layers;
Board Thickness: 0.2-8.0mm;
PCB Testing: PCB: Ict Testing and Flying Probe Testing;
PCBA Packaging: Static Packaging, Shockproof Packaging, Anti-Drop;
Qualified: Ipc-a-610cclass 2 Standard;
Thick Copper: 18um-140um(4oz);
Service: OEM/ODM, EMS;
PCB Materials: Fr4;
PCB Soldermask: Green;
PCB Silkscreen: White;
PCB Tg: Tg170;
IC: Qfn;
IC Type: BGA;
SMT: 01005;
PCBA Testing: Function Testing 100%;
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Structure: Single-Sided Rigid PCB;
Dielectric: FR-2;
Material: Phenolic Paper Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Additive Process;
Brand: Hjh;
Sheet Thickness: 0.8~1.6mm;
Copper Thickness: 35um, 70um;
Color: Brown;
Market: Euro, Asia, Central and South America;
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Structure: Single-Sided Rigid PCB;
Dielectric: CEM-1;
Material: Epoxy Fiber Galss Paper;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Additive Process;
Base Material: Epoxy Fiber Galss Paper;
Insulation Materials: Epoxy Resin;
Brand: Hjh;
Sheet Thickness: 0.8-1.6mm;
Copper Thickness: 18um, 25um, 35um, Others;
Color: White, Yellow;
Market: Euro, Asia, Central and South America;
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Structure: Single-Sided Rigid PCB;
Dielectric: Rcc;
Material: Aluminum Base;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Additive Process;
Base Material: Aluminum;
Insulation Materials: Rcc;
Brand: Hjh;
Sheet Thickness: 0.6-2.0mm;
Copper Thickness: 15um, 18um, 25um, 35um, 70um, Others;
Protective Film Color: Green;
Thermal Conductivity: 0.6~2.0W;
Aluminum Base Material: 1060 / 5052;
Tg (DSC): >130 Degree;
Breakdown Voltage: AC>/=5kv;
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Structure: Single-Sided Rigid PCB;
Dielectric: Xpc;
Material: Phenolic Paper Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: HB;
Processing Technology: Electrolytic Foil;
Production Process: Additive Process;
Base Material: Phenolic Paper;
Insulation Materials: Phenolic Resin;
Brand: Hjh;
Sheet Thckness: 0.8-1.6mm;
Copper Thickness: 18um, 25um, 35um, Others;
Color: Brown;
Market: Euro, Asia, Central and South America;
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