Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: OEM;
Product Name: Turnkey PCB Assembly Services;
Quality Grade: Ipca610;
Surface Finish: Lead/Lead-Free HASL/Immersion Gold;
SMT Capacity: 3 Million~4 Million Soldering Pad/Day;
DIP Capacity: 100 Thousand Pins/Day;
PCB Material: High Quality Fr4, Rogers, and Aluminum Material;
Shipping: by DHL, FedEx, UPS;
Solder Resist Color: Green;Red;Yellow;Black;White;
Solder Mask Color: Yellow;Black;White;;
Delivery Time: Sample Is Available Within 3days;
Testing Service: 100% Aoi Lct Fct Testing;
Design: Original;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Fastline;
Voltage: DC12V;
Impedance Control Tolerance: 10%;
MOQ: 1PCS;
Layer: 1 - 16 Layer;
Thickness Board: 2.0mm;
Solder Mask Colour: Green, Blue, White, Black, Yellow, Red;
Surface Finish: HASL, Enig, OSP, Gold Finger;
Min Space: 0.1mm;
Min Hole Location Tolerance: ±0.075mm;
Surface Finishing: Lead-Free HASL;
Supply: Fast;
Testing: 100%;
Service: One-Stop;
File: PCB Gerber File;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Fastline;
Voltage: DC12V;
Impedance Control Tolerance: 10%;
MOQ: 1PCS;
Layer: 1 - 16 Layer;
Thickness Board: 2.0mm;
Solder Mask Colour: Green, Blue, White, Black, Yellow, Red;
Surface Finish: HASL, Enig, OSP, Gold Finger;
Min Space: 0.1mm;
Min Hole Location Tolerance: ±0.075mm;
Surface Finishing: Lead-Free HASL;
Supply: Fast;
Testing: 100%;
Service: One-Stop;
File: PCB Gerber File;
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Type: Rigid Circuit Board;
Dielectric: Fr4 and Polyimide, FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V2;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Board Material: Fr4 and Polyimide;
Board Layer: 2 Layer Rigide and 2 Layer Flex;
Copper Thickness: 1 Oz;
Min. Line Space: 0.05mm (2mil);
Min Conductor Width: 0.05mm(2mil);
Min.Hole Size: 0.075mm (3mil);
Solder Mask: Any Color;
Silkscreen: Any Color;
Surface Finishing: Enig, Immersion Tin, Immersion Gold. OSP;
Lead Time: 5-6 Working Days;
PCB Design: Customer Provided;
Board Thickness: 0.1mm;
Min Pad: +/-0.1mm (4mil);
Outline Machining Accuracy: +/-0.1mm (4mil);
MOQ: 1 PCS;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Fastline;
Voltage: DC12V;
Impedance Control Tolerance: 10%;
MOQ: 1PCS;
Layer: 1 - 16 Layer;
Thickness Board: 2.0mm;
Solder Mask Colour: Green, Blue, White, Black, Yellow, Red;
Surface Finish: HASL, Enig, OSP, Gold Finger;
Min Space: 0.1mm;
Min Hole Location Tolerance: ±0.075mm;
Surface Finishing: Lead-Free HASL;
Supply: Fast;
Testing: 100%;
Service: One-Stop;
File: PCB Gerber File;
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