Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Model: Jx-PCBA;
Brand: OEM;
PCBA Material: FR4, High TG, Halogen-Free, High Frequency;
Surface Treatment: HASL/Immersion Gold/Immersion Silver/Immersion Tin;
PCB Solder Mask: White, Black, Yellow, Green, Red, Blue;
Component Packing: Tary, Tube, Tape;
Number of Layer: 1-32;
Minimum Line Width/Spacing: 3.0mil;
Maximum Plate Thickness Aperture Ratio: 30:1;
Minimum Mechanical Drilling Aperture: 6mil;
Board Thickness: 0.2mm~6.0mm;
Maximum Board Size: 640mm*1100mm;
PCBA Testing Service: Aoi, Ict, X-ray, Flying Probe Test;
PCBA Packaging: Static Packaging, Shockproof Packaging, Anti-Drop;
Product Application: Consumer Electronics/Home Appliances/Medical Equip;
PCB Silkscreen Color: Black, White, Yellow;
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Type: 2 Layer PCB Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Base Material: Copper;
Insulation Materials: Organic Resin;
Min. Hole Size: 0.2mm;
Min. Line Width&Spacing: 0.1mm/0.1mm;
Solder Mask Color: Green/Black/White/Red/Blue/Yellow;
Certificates: UL, RoHS, SGS, ISO9001 ISO14000;
Shipping: DHL, UPS, TNT, FedEx, etc;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: HASL;
Base Material: Copper Clad Laminate;
Insulation Materials: Epoxy Resin;
Model: FR-4;
Brand: Bicheng;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Outer Copper Foil: 1 Oz;
Board Thickness: 1.6mm;
Surface Treament: HASL Lead Free;
Solder Mask: Green;
Legend: White;
Min Line Width (Mil): 11.8mil;
Min Line Spacing (Mil): 5 Mil;
Electrical Test: 100% PCB Passed;
Thermal Shock Test: Pass, No Delamination, No Blistering.;
Solderability Test: Pass, 5 Seconds Wetting Area Least 95%;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Iteq;
Outer Copper Foil: 1 Oz;
Board Thickness: 1.60 mm +/-0.16;
Surface Treament: HASL Lead Free;
Solder Mask: Green;
Legend: White;
Min Line Width (Mil): 7.8 Mil;
Min Line Spacing (Mil): 6 Mil;
Electrical Test: 100% PCB Passed;
Thermal Shock Test: Pass, No Delamination, No Blistering.;
Solderability Test: Pass, 5 Seconds Wetting Area Least 95%;
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