Specification |
Type: Flexible Circuit Board;
Dielectric: FR-4;
Material: Paper Phenolic Copper Foil Substrate;
Flame Retardant Properties: V0;
Mechanical Rigid: Fexible;
Processing Technology: Surface Mounted Technolgoy;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Model: Jx-PCBA;
Brand: Jxpcba;
PCBA Material: FR4, High TG, Halogen-Free, High Frequency;
Surface Treatment: HASL/Immersion Gold/Immersion Silver/Immersion Tin;
PCB Solder Mask: White, Black, Yellow, Green, Red, Blue;
Component Packing: Tary, Tube, Tape;
Number of Layer: 1-32;
Minimum Line Width/Spacing: 3.0mil;
Maximum Plate Thickness Aperture Ratio: 30:1;
Minimum Mechanical Drilling Aperture: 6mil;
Board Thickness: 0.2mm~6.0mm;
Maximum Board: 640mm*1100mm;
PCBA Testing Service: Aoi, Ict, X-ray, Flying Probe Test;
PCBA Packaging: Static Packaging, Shockproof Packaging, Anti-Drop;
Product Application: Consumer Electronics/Home Appliances/Medical Equip;
PCB Silkscreen Color: Black, White, Yellow;
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Type: Rigid Circuit Board;
Dielectric: RO4350b;
Material: Hydrocarbon/Woven Glass;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Glass Reinforced Hydrocarbon;
Final Foil External: 1.5 Oz;
Board Thickness: 1.6 mm ±10%;
Surface Finish: Immersion Gold;
Solder Mask Color: Green;
Colour of Component Legend: White;
Minimum Trace and Spac: 7 Mil / 7 Mil;
Minimum / Maximum Holes: N/a;
Via: N/a;
Test: 100% Electrical Test Prior Shipment;
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Type: Rigid Circuit Board;
Dielectric: RO4350b;
Material: Hydrocarbon/Woven Glass;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Glass Reinforced Hydrocarbon;
Final Foil External: 1.5 Oz;
Board Thickness: 1.6 mm ±10%;
Surface Finish: Immersion Gold;
Solder Mask Color: Green;
Colour of Component Legend: White;
Minimum Trace and Spac: 15 Mil / 15 Mil;
Minimum / Maximum Holes: N/a;
Via: N/a;
Test: 100% Electrical Test Prior Shipment;
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Type: Rigid Circuit Board;
Dielectric: RO4350b;
Material: Hydrocarbon/Woven Glass;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Glass Reinforced Hydrocarbon;
Final Foil External: 1.5 Oz;
Board Thickness: 1.6 mm ±10%;
Surface Finish: Immersion Gold;
Solder Mask Color: Green;
Colour of Component Legend: White;
Minimum Trace and Spac: 15 Mil / 10 Mil;
Minimum / Maximum Holes: N/a;
Via: N/a;
Test: 100% Electrical Test Prior Shipment;
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Type: Rigid Circuit Board;
Dielectric: RO4350b;
Material: Hydrocarbon/Woven Glass;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Glass Reinforced Hydrocarbon;
Final Foil External: 1.5 Oz;
Board Thickness: 1.6 mm ±10%;
Surface Finish: Immersion Gold;
Solder Mask Color: Green;
Colour of Component Legend: White;
Minimum Trace and Spac: 10 Mil / 10 Mil;
Minimum / Maximum Holes: 0.3mm;
Via: 0.3mm;
Test: 100% Electrical Test Prior Shipment;
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