Electronics Circuit Board
US$0.50-6.00 / Piece
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What is Electronics Circuit Board Multi-Size Receiver Board Remote Control Car Circuit Board PCB

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

1-98 Pieces US$6.00

99-998 Pieces US$4.00

999-9,998 Pieces US$3.00

9,999+ Pieces US$0.50

Sepcifications

  • Structure Multilayer Rigid PCB
  • Dielectric FR-4
  • Material Polyester Glass Fiber Mat Laminate
  • Application Computer
  • Flame Retardant Properties V0
  • Processing Technology Electrolytic Foil
  • Production Process Semi-Additive Process
  • Base Material Copper
  • Insulation Materials Metal Composite Materials
  • Brand Jingxin
  • Transport Package Carton Box
  • Specification 200pcs/CTN
  • Trademark Customer′ s brand
  • Origin China

Product Description

Product Description OEM manufacturer electronic PCBA circuit board for refrigerator Shenzhen factory Our SMT PCB PCBA manufacture: 1. No MOQ for Printed circuit board and SMT DIP pcb assembling. 2. One-stop solution for various SMT DIP PCB assembly. 3. Professional PCB Board engineer for ...

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Electronics Circuit Board Comparison
Transaction Info
Price US $ 0.50-6.00/ Piece US $ 1.73-4.21/ Piece US $ 2.73-4.86/ Piece US $ 2.39-4.75/ Piece US $ 1.85-2.00/ Piece
Min Order 1 Pieces 100 Pieces 100 Pieces 100 Pieces 5 Pieces
Payment Terms T/T T/T, Western Union, Paypal T/T, Western Union, Paypal T/T, Western Union, Paypal T/T
Quality Control
Management System Certification ISO 9001, ISO 14000, IATF16949, GMP ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE, GMP ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE, GMP ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE, GMP ISO 9001
Trade Capacity
Export Markets North America, Eastern Europe, Africa, Mid East, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Western Europe
Annual Export Revenue US$10 Million - US$50 Million US$50 Million - US$100 Million US$50 Million - US$100 Million US$50 Million - US$100 Million -
Business Model OEM, ODM, IMS service OEM, ODM OEM, ODM OEM, ODM OEM
Average Lead Time Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Product Attributes
Specification
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Computer;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Semi-Additive Process;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: Jingxin;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Paper Laminate;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: HASL;
Production Process: Additive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: 1;
Layer Count: 10L;
Min. Hole to Line: 7mil;
Min. Pad: 4mil;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Paper Laminate;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Enig;
Production Process: Additive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: 1;
Layer Count: 10L;
Min. Hole to Line: 7mil;
BGA to Line: 3mil;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Paper Laminate;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Enig;
Production Process: Additive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: 1;
Layer Count: 10L;
Min. Hole to Line: 7mil;
BGA to Line: 3mil;
Structure: Double-Sided Rigid PCB;
Dielectric: FR-4;
Material: Epoxide Woven Glass Fabric Laminate;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Additive Process;
Base Material: Fr-4;
Brand: Zapon;
Supplier Name

Shenzhen Jingxin Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

Shanghai Gawin Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

Shanghai Gawin Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

Shanghai Gawin Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

Zhejiang Dejia Electronics Technology Co.,Ltd.

Gold Member Audited Supplier