SMT/DIP PCBA Assembly
US$0.20-2.34 / Piece
View
  • Recommend for you
  • What is Customised Multilayer Printed Circuit Board PCB Manufacturer for Solar and Light System
  • What is Custom PCBA Electronic Assembly PCB&PCBA SMT Circuit Board Manufacturer PCBA
  • What is China OEM Manufacture for Fingerprint Smart Lock Circuit Board Manufacturing and Assembly PCBA

What is OEM Electronics PCBA Manufacturer One Stop PCBA Service SMT DIP

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

10-99 Pieces US$2.34

100-9,999 Pieces US$1.58

10,000+ Pieces US$0.20

Sepcifications

  • Type Combining Rigid Circuit Board
  • Dielectric FR-4
  • Material Aluminum Covered Copper Foil Layer
  • Application Consumer Electronics
  • Flame Retardant Properties V1
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Copper
  • Insulation Materials Metal Composite Materials
  • Brand Jxpcba
  • Transport Package Customized, ESD Bag/Vacuum Packaging+Bubble Bag,
  • Specification Custom HDI PCBA
  • Trademark JXpcba
  • Origin China
  • Product Type Custom HDI PCBA
  • Service One-Stop Turnkey
  • Applicational Electronics Device/Home Appliances
  • Testing Service Aoi X-ray Function Test
  • Raw Material Fr4/Cem-1/Cem-3/Fr1/Aluminum
  • Board Thickness 0.2mm-7.0mm
  • Layer 1-36layers
  • Solder Mask Color Blue.Green.Red.Black.White.etc
  • Surface Finishing HASL\OSP\Immersion Gold
  • Certificate ISO9001/ISO14001/CE/RoHS
  • Surface Treatment Gold Finger/Hard Gold
  • Copper Thickness 0.5-12oz(18-420um)
  • Hole Diameter Min0.05mm
  • Min.Line Width 0.10mm(4mil)
  • Min.Line Spaceing 0.10mm(4mil)

Product Description

... Shenzhen Jingxin Electronic Technology Co.,Ltd. ... Built since 2002, is a almost 20 years professional company dedicating to PCB&PCBA industry. Our factory located in Shenzhen, and have dust-free workshop which cover an area of over than 10000m², almost 550 ...

Learn More

SMT/DIP PCBA Assembly Comparison
Transaction Info
Price US $ 0.20-2.34/ Piece US $ 0.10-80.00/ Piece US $ 0.10-80.00/ Piece US $ 0.10-80.00/ Piece US $ 0.10-10.00/ Piece
Min Order 10 Pieces 1 Pieces 1 Pieces 1 Pieces 1 Pieces
Trade Terms - - - - -
Payment Terms L/C, T/T, D/P, Western Union, Paypal, Money Gram, Alipay T/T, Western Union, Paypal T/T, Western Union, Paypal T/T, Western Union, Paypal L/C, T/T, D/P, Western Union, Paypal, Money Gram
Quality Control
Product Certification ISO9001/ISO14001/CE/RoHS UL,ISO9001&ISO14001,SGS,RoHS Report UL,ISO9001&ISO14001,SGS,RoHS Report UL, ISO9001&ISO14001, SGS, RoHS Report UL,ISO9001&ISO14001,SGS,RoHS Report
Management System Certification ISO 9001, ISO 14000, IATF16949, GMP ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949
Trade Capacity
Export Markets North America, Eastern Europe, Africa, Mid East, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model OEM, ODM, Others OEM OEM OEM OEM
Average Lead Time Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Product Attributes
Specification
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Aluminum Covered Copper Foil Layer;
Application: Consumer Electronics;
Flame Retardant Properties: V1;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: Jxpcba;
Product Type: Custom HDI PCBA;
Service: One-Stop Turnkey;
Applicational: Electronics Device/Home Appliances;
Testing Service: Aoi X-ray Function Test;
Raw Material: Fr4/Cem-1/Cem-3/Fr1/Aluminum;
Board Thickness: 0.2mm-7.0mm;
Layer: 1-36layers;
Solder Mask Color: Blue.Green.Red.Black.White.etc;
Surface Finishing: HASL\OSP\Immersion Gold;
Surface Treatment: Gold Finger/Hard Gold;
Copper Thickness: 0.5-12oz(18-420um);
Hole Diameter: Min0.05mm;
Min.Line Width: 0.10mm(4mil);
Min.Line Spaceing: 0.10mm(4mil);
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Kb;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Holes Specification: Buried/Blind Vias, Via in Pads, Counter Sink Hole;
Board Thickness: 0.2-6mm;
Copper Thickness: 0.5-8oz;
Layers: 1-20layers;
Enig Thickness: 1-3u'';
Hard Gold Thickness: 5-50u'';
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Kb;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Hard Gold Thickness: 5-50u'';
Holes Specification: Buried/Blind Vias, Via in Pads, Counter Sink Hole;
Board Thickness: 0.2-6mm;
Copper Thickness: 0.5-8oz;
Enig Thickness: 1-3u'';
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Kb;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Holes Specification: Buried/Blind Vias, Via in Pads, Counter Sink Hole;
Board Thickness: 0.2-8mm;
Copper Thickness: 0.5-10oz;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Kb;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Enig Thickness: 1-3u'';
Hard Gold Thickness: 5-50u'';
Holes Specification: Buried/Blind Vias, Via in Pads, Counter Sink Hole;
Board Thickness: 0.25-6mm;
Copper Thickness: 0.5-8oz;
Layers: 1-20 Layers;
Supplier Name

Shenzhen Jingxin Electronic Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

China Supplier - Diamond Member Audited Supplier