DIP Assembly

US$2.00-9.00 / Piece

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Factory Custom Supply PCBA Design Services for Android Electronics Smartphone with SMT DIP Assembly pictures & photos

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What is Factory Custom Supply PCBA Design Services for Android Electronics Smartphone with SMT DIP Assembly

Name: Factory Custom Supply PCBA Design Services for Android Electronics Smartphone with SMT DIP Assembly
Uploaded: 2024-06-13T13:58:53+08:00
Description: About Us Shenzhen Jingxin Electronic Technology Co., Ltd. is a professional enterprise dedicated to PCB and PCBA manufacturing for 20 years, providing professional OEM electronic manufacturing s

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About this Item

Price

Purchase Qty. Reference FOB Price

1-998 Pieces US$9.00

999-9,998 Pieces US$6.00

9,999+ Pieces US$2.00

Sepcifications

Type Rigid Circuit Board
Dielectric FR-4
Material Fiberglass Epoxy
Application Communication
Flame Retardant Properties V0
Mechanical Rigid Rigid
Processing Technology Electrolytic Foil
Base Material Copper
Insulation Materials Organic Resin
Brand Jingxin
Transport Package Carton Box
Specification 200pcs/CTN
Trademark Customer′ s brand
Origin China

Product Description

About Us Shenzhen Jingxin Electronic Technology Co., Ltd. is a professional enterprise dedicated to PCB and PCBA manufacturing for 20 years, providing professional OEM electronic manufacturing services for customers in various fields around the world. Since its establishment in 2002, the company ...

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Shenzhen Jingxin Electronic Technology Co., Ltd.

Diamond Member Since 2022

Audited Supplier

Business Type Manufacturer/Factory, Trading Company, Group Corporation
Main Products PCB, PCBA, Print Circuit Board, Flexible Circuit Board, Rigid PCB Assembly, PCB Assembly, Circuit Board, FPC, HDI PCB
Registered Capital 16000000 RMB
Management System Certification ISO 9001, ISO 14000, IATF16949, GMP
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
OEM/ODM Availability Yes

DIP Assembly Comparison

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Transaction Info
	Factory Custom Supply PCBA Design Services for Android Electronics Smartphone with SMT DIP Assembly Contact Now	Quick View Multilayer 2 Panel up PCB Board with Enig Fr-4 High Tg Contact Now	Professional Multilayer (1-40 layers) PCB Printed Circuit Boards with Blind and Buried Via Rigid HDI PCB Contact Now	Quick View 94V0 Circuit Board Schematic Diagram PCB Custom Contact Now	Multilayer HDI PCB Board Circuit with Red Soder Mask Contact Now
Price	US $ 2.00-9.00/ Piece	US $ 0.10-8.00/ Piece	US $ 0.01-50.00/ Piece	US $ 0.10-5.00/ Piece	US $ 0.10-10.00/ Piece
Min Order	1 Pieces	1 Pieces	1 Pieces	1 Pieces	1 Pieces
Payment Terms	T/T	L/C, T/T, D/P, Western Union, Paypal, Money Gram	L/C, T/T, D/P, Western Union, Paypal, Money Gram, 30 days net	L/C, T/T, D/P, Western Union, Paypal, Money Gram	L/C, T/T, D/P, Western Union, Paypal, Money Gram
Quality Control
Product Certification	-	-	-	-	UL,ISO9001&ISO14001,SGS,RoHS,Ts16949
Management System Certification	ISO 9001, ISO 14000, IATF16949, GMP	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949
Trade Capacity
Export Markets	North America, Eastern Europe, Africa, Mid East, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	US$10 Million - US$50 Million	US$50 Million - US$100 Million	US$50 Million - US$100 Million	US$50 Million - US$100 Million	US$50 Million - US$100 Million
Business Model	OEM, ODM, IMS service	OEM	OEM	OEM	OEM
Average Lead Time	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays
Product Attributes
Specification	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Communication; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Organic Resin; Brand: Jingxin;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy Resin + Polyimide Resin; Application: Aerospace; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Delay Pressure Foil; Base Material: Copper; Insulation Materials: Organic Resin; Brand: Abis; Test: Flying Probe and Fixture; Solder Mask: Black; Certificates: UL, RoHS, SGS, ISO9001; Board Thickness: 1.6mm / 2.0mm / Custom; Custom: OEM / ODM; Copper: 1oz / 35um, 2oz / 70um; Surface Finish: HASL / Enig; Layers: 2 Layers; Legend: White;	Type: Combining Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Abis; Insulation Layer Thickness: 0.075mm--5.00mm; Minimum Line: 0.075mm; Minimum Space: 0.075mm; Drilling Hole(Mechanical): 0.15mm--6.35mm; Finish Hole(Mechanical): 0.10mm-6.30mm;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Aerospace; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Abis; Test: Flying Probe and Fixture; Solder Mask: Green / Blue; Certificates: UL, RoHS, SGS, ISO9001; Board Thickness: 0.5mm / 0.8mm / 1.6mm Custom; Custom: OEM / ODM; Copper: 0.5oz / 18um, 2oz / 70um; Layers: 4-8 Layers, Custom; Legend: White;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Aerospace; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Kb; Insulation Materials: Epoxy Resin; Brand: Abis; Holes Specification: Buried/Blind Vias, Via in Pads, Counter Sink Hole; Board Thickness: 0.2-8mm; Copper Thickness: 0.5-8oz;
Supplier Name	Shenzhen Jingxin Electronic Technology Co., Ltd.	Abis Circuits Co., Ltd.	Abis Circuits Co., Ltd.	Abis Circuits Co., Ltd.	Abis Circuits Co., Ltd.
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