1-24 Layers Customized HDI PCB Board Assembly and SMT/DIP Manufacture Process Service PCBA pictures & photos

1-24 Layers Customized HDI PCB Board Assembly and SMT/DIP Manufacture Process Service PCBA

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Price

Purchase Qty. Reference FOB Price

10-99 Pieces US$2.34

100-999 Pieces US$1.85

1,000-1,999 Pieces US$1.25

2,000+ Pieces US$0.98

Sepcifications

Type Combining Rigid Circuit Board
Dielectric FR-4
Material Aluminum Covered Copper Foil Layer
Application Consumer Electronics
Flame Retardant Properties V1
Mechanical Rigid Rigid
Processing Technology Electrolytic Foil
Base Material Copper
Insulation Materials Metal Composite Materials
Brand Jxpcba
Transport Package Customized, ESD Bag/Vacuum Packaging+Bubble Bag,
Specification Custom HDI PCBA
Trademark JXpcba
Origin China
Product Type Custom HDI PCBA
Service One-Stop Turnkey
Applicational Electronics Device/Home Appliances
Testing Service Aoi X-ray Function Test
Raw Material Fr4/Cem-1/Cem-3/Fr1/Aluminum
Board Thickness 0.2mm-7.0mm
Layer 1-32 Layers
Solder Mask Color Blue.Green.Red.Black.White.etc
Surface Finishing HASL\OSP\Immersion Gold
Certificate ISO9001/ISO14001/CE/RoHS
Component Packing Tary, Tube, Tape
Number of Floors 1-32
Minimum Line Width/Spacing 3.0mil
Maximum Plate Thickness Aperture Ratio 30:1
Minimum Mechanical Drilling Aperture 6mil

Product Description

Product Description Specification: PCB layers: 1-24layers PCB materials: CEM1, CEM3, Teflon, Rogers, FR-4, High Tg FR-4, Aluminum Base, Halogen Free PCB max. board size: 620*1100mm PCB certificate: RoHS Directive-Compliant PCB Thickness: 1.6 ±0.1mm Out Layer Copper Thickness: ...

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Shenzhen Jingxin Electronic Technology Co., Ltd.

Diamond Member Since 2022

Audited Supplier

Business Type Manufacturer/Factory, Trading Company, Group Corporation
Main Products PCB, PCBA, Print Circuit Board, Flexible Circuit Board, Rigid PCB Assembly, PCB Assembly, Circuit Board, FPC, HDI PCB
Registered Capital 16000000 RMB
Management System Certification ISO 9001, ISO 14000, IATF16949, GMP
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
OEM/ODM Availability Yes

PCBA Assembly Factory Comparison

	1-24 Layers Customized HDI PCB Board Assembly and SMT/DIP Manufacture Process Service PCBA Contact Now	Printed Circuit Board PCB Assembly Manufacturing Design Service PCBA Contact Now	Quick View OEM Multilayer Pcbs: Factory for HDI Contact Now	Quick View Custom Multilayer PCB Design and Manufacturing with PCBA Assembly Contact Now	Quick View OEM/ODM Service Multi-Layer OEM GPS PCB Layout PCB Board Contact Now

Transaction Info
	1-24 Layers Customized HDI PCB Board Assembly and SMT/DIP Manufacture Process Service PCBA Contact Now	Printed Circuit Board PCB Assembly Manufacturing Design Service PCBA Contact Now	Quick View OEM Multilayer Pcbs: Factory for HDI Contact Now	Quick View Custom Multilayer PCB Design and Manufacturing with PCBA Assembly Contact Now	Quick View OEM/ODM Service Multi-Layer OEM GPS PCB Layout PCB Board Contact Now
Price	US $ 0.98-2.34/ Piece	US $ 2.00-8.00/ Piece	US $ 4.75-5.00/ Piece	US $ 4.75-5.00/ Piece	US $ 20.00-35.00/ pcs
Min Order	10 Pieces	2 Pieces	10 Pieces	10 Pieces	1 pcs
Trade Terms	-	-	-	-	-
Payment Terms	L/C, T/T, D/P, Western Union, Paypal, Money Gram, Alipay	T/T, D/P, Western Union	T/T	T/T	T/T, Western Union, Paypal, Money Gram
Quality Control
Product Certification	ISO9001/ISO14001/CE/RoHS	-	-	-	-
Management System Certification	ISO 9001, ISO 14000, IATF16949, GMP	ISO 9001, IATF16949	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, ISO 14000, IATF16949, QC 080000, ISO 13485
Trade Capacity
Export Markets	North America, Eastern Europe, Africa, Mid East, Western Europe	North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia	-	-	South America
Annual Export Revenue	-	-	-	-	-
Business Model	OEM, ODM, Others	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM
Average Lead Time	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	-	-	-	Off-season: within 15 Day(s) Peak-season: 1 Month(s)
Product Attributes
Specification	Type: Combining Rigid Circuit Board; Dielectric: FR-4; Material: Aluminum Covered Copper Foil Layer; Application: Consumer Electronics; Flame Retardant Properties: V1; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Metal Composite Materials; Brand: Jxpcba; Product Type: Custom HDI PCBA; Service: One-Stop Turnkey; Applicational: Electronics Device/Home Appliances; Testing Service: Aoi X-ray Function Test; Raw Material: Fr4/Cem-1/Cem-3/Fr1/Aluminum; Board Thickness: 0.2mm-7.0mm; Layer: 1-32 Layers; Solder Mask Color: Blue.Green.Red.Black.White.etc; Surface Finishing: HASL\OSP\Immersion Gold; Component Packing: Tary, Tube, Tape; Number of Floors: 1-32; Minimum Line Width/Spacing: 3.0mil; Maximum Plate Thickness Aperture Ratio: 30:1; Minimum Mechanical Drilling Aperture: 6mil;	Type: Rigid Circuit Board; Dielectric: CEM-3; Material: Fiberglass Epoxy Resin + Polyimide Resin; Application: Medical Instruments; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Metal Composite Materials; Brand: New Chip; Soldermask Color: Green, Yellow, Blue, Black, White...; Sample: Available; OEM/ODM: Available; Certificate Gurantee: Yes; Test: 100%E-Testing; Color of Silk Screen: Green, Purple, Black; Service: OEM / Dfm;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Shengyi, Kb, Nanya, Ilm; Criteria: Aql II 0.65; Hole Sizes: 0.15mm/0.2mm; Bevel Edge: Yes; Impedance: 50/90/100 Ohm; Trace Width(Min.): 3mil; Surfaec Treatment: Immersion Gold;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Shengyi, Kb, Nanya, Ilm; Criteria: Aql II 0.65; Hole Sizes: 0.15mm/0.2mm; Bevel Edge: Yes; Impedance: 50/90/100 Ohm; Trace Width(Min.): 3mil; Surfaec Treatment: Immersion Gold;	Type: Combining Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy Resin + Polyimide Resin; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Fexible; Processing Technology: Electrolytic Foil; Base Material: Aluminum; Insulation Materials: Organic Resin; Layer: 1-18; Surface Finishing: HASL, Enig, OSP, Immersion Au, AG, Sn; Min.Hole Size: 0.1mm; Min.Line Spacing: 3 Mil; PCBA QC: X-ray, Aoi Test, Function Test(100% Test); Specialised: LED, Medical, Industrial, Control Board; Delivery: PCB, 7-10 Days;PCBA, 2-3weeks; Service: Aging Function Test;
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