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Battery Electric Vehicle Mini Car Economic New Energy Vehicle PCBA Circuit Board Assembly PCB Prototype pictures & photos

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What is Battery Electric Vehicle Mini Car Economic New Energy Vehicle PCBA Circuit Board Assembly PCB Prototype

Name: Battery Electric Vehicle Mini Car Economic New Energy Vehicle PCBA Circuit Board Assembly PCB Prototype
Uploaded: 2024-05-18T11:23:28+08:00
Description: About Us Shenzhen Jingxin Electronic Technology Co., Ltd. is a professional enterprise dedicated to PCB and PCBA manufacturing for 20 years, providing professional OEM electronic manufacturing

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About this Item

Price

Purchase Qty. Reference FOB Price

1-998 Pieces US$1.90

999-9,998 Pieces US$0.90

9,999+ Pieces US$0.50

Sepcifications

Structure Multilayer Rigid PCB
Dielectric FR-4
Material Polyester Glass Fiber Mat Laminate
Application Consumer Electronics
Flame Retardant Properties V0
Processing Technology Electrolytic Foil
Production Process Semi-Additive Process
Base Material Copper
Insulation Materials Metal Composite Materials
Transport Package Carton Box
Specification 200pcs/CTN
Trademark Customer′ s brand
Origin China
Board Material Fr4, H-Tg, It-180A, Cem, Aluminum
Board Thickness 0.4-5.0mm
Solder Mask Color Green, White, Black, Blue, Yellow, Red, Purple
Silkscreen Color Green, White, Black, Blue, Yellow
Copper Thickness 0.5-10 Oz
Layer 1-60 Layers
Min. SMD Size 01005
Surface Finishing HASL, Lf HASL, Enig, OSP, Carbon Oil
Testing E-Test, Fly Probe Test, Visual Checking,Aoi,X-ray
MOQ 1PCS
Service Turnkey PCB Assembly Service
PCBA Test Aoi, in-Circuit Test (Ict), Functioal Test (Fct)
PCB Max. Board Size 620*1100mm
Certificates UL (E503048),ISO9001/ISO14001/IATF16949/ISO13485

Product Description

About Us Shenzhen Jingxin Electronic Technology Co., Ltd. is a professional enterprise dedicated to PCB and PCBA manufacturing for 20 years, providing professional OEM electronic manufacturing services for customers in various fields around the world. Since its establishment in 2002, the company ...

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Shenzhen Jingxin Electronic Technology Co., Ltd.

Diamond Member Since 2022

Audited Supplier

Business Type Manufacturer/Factory, Trading Company, Group Corporation
Main Products PCB, PCBA, Print Circuit Board, Flexible Circuit Board, Rigid PCB Assembly, PCB Assembly, Circuit Board, FPC, HDI PCB
Registered Capital 16000000 RMB
Management System Certification ISO 9001, ISO 14000, IATF16949, GMP
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
OEM/ODM Availability Yes

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Transaction Info
	Battery Electric Vehicle Mini Car Economic New Energy Vehicle PCBA Circuit Board Assembly PCB Prototype Contact Now	Quick View Professional PCB Manufacturer with PCB Printed Circuit Main Board Assembly Motherboard Service Contact Now	Quick View Em-825 Material Multilayer Enig PCB Board Motherboard for Military Product Contact Now	Quick View Immersion Gold PCB Circuit Board 10layer Motherboard for Military Product Contact Now	Quick View Shengyi Material S1000h Immersion Gold PCB Board for Military Contact Now
Price	US $ 0.50-1.90/ Piece	US $ 0.80-6.80/ Piece	US $ 0.156-0.80/ Piece	US $ 2.25-8.80/ Piece	US $ 2.87-9.30/ Piece
Min Order	1 Pieces	1 Pieces	100 Pieces	100 Pieces	100 Pieces
Payment Terms	T/T	L/C, T/T, D/P, Western Union, Paypal, Money Gram	T/T, Western Union, Paypal	T/T, Western Union, Paypal	T/T, Western Union, Paypal
Quality Control
Management System Certification	ISO 9001, ISO 14000, IATF16949, GMP	ISO 9001, ISO 9000, ISO 14001, IATF16949, ISO 13485, ISO 17025	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE, GMP	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE, GMP	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE, GMP
Trade Capacity
Export Markets	North America, Eastern Europe, Africa, Mid East, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	US$10 Million - US$50 Million	US$50 Million - US$100 Million	US$50 Million - US$100 Million	US$50 Million - US$100 Million	US$50 Million - US$100 Million
Business Model	OEM, ODM, IMS service	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM
Average Lead Time	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: one month Peak Season Lead Time: one month	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays
Product Attributes
Specification	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Polyester Glass Fiber Mat Laminate; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Semi-Additive Process; Base Material: Copper; Insulation Materials: Metal Composite Materials; Board Material: Fr4, H-Tg, It-180A, Cem, Aluminum; Board Thickness: 0.4-5.0mm; Solder Mask Color: Green, White, Black, Blue, Yellow, Red, Purple; Silkscreen Color: Green, White, Black, Blue, Yellow; Copper Thickness: 0.5-10 Oz; Layer: 1-60 Layers; Min. SMD Size: 01005; Surface Finishing: HASL, Lf HASL, Enig, OSP, Carbon Oil; Testing: E-Test, Fly Probe Test, Visual Checking,Aoi,X-ray; MOQ: 1PCS; Service: Turnkey PCB Assembly Service; PCBA Test: Aoi, in-Circuit Test (Ict), Functioal Test (Fct); PCB Max. Board Size: 6201100mm;* Certificates: UL (E503048),ISO9001/ISO14001/IATF16949/ISO13485;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Polyester Glass Fiber Mat Laminate; Application: Medical Instruments; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Semi-Additive Process; Base Material: Copper; Insulation Materials: Organic Resin; Brand: OEM; PCBA-Testing: X-ray, Aoi; Small Order: Acceptable; Type: Main Board;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxy Paper Laminate; Application: Military; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Additive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Layer Count: 6L up to 60L; Board Thickness: 1.4mm up to 8mm; Min Hole Size: 0.2mm; Min. Hole Wall Cu: 20um; Finished Copper: 35um; Min. Trace/Space: 5/4mil;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxy Paper Laminate; Application: Military; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Additive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Layer Count: 10L up to 60L; Board Thickness: 1.2mm up to 8mm; Min Hole Size: 0.2mm; Min. Hole Wall Cu: 25um; Finished Copper: 51um; Min. Trace/Space: 5.5/4mil;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxy Paper Laminate; Application: Military; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Additive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: 1; Layer Count: 12L up to 60L; Board Thickness: 1.6mm up to 8mm; Min Hole Size: 0.2mm; Min. Hole Wall Cu: 25um; Finished Copper: 45um; Min. Trace/Space: 0.154/0.088mm;
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