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US$0.50-6.00 / Piece

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Multi-Layer PCB Fr4 PCB Printed Circuit Board Motherboard PCB Assembly HDI PCB Design PCBA for Electronics pictures & photos

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What is Multi-Layer PCB Fr4 PCB Printed Circuit Board Motherboard PCB Assembly HDI PCB Design PCBA for Electronics

Name: Multi-Layer PCB Fr4 PCB Printed Circuit Board Motherboard PCB Assembly HDI PCB Design PCBA for Electronics
Uploaded: 2023-02-21T19:09:59+08:00
Description: Product Description OEM manufacturer electronic PCBA circuit board for refrigerator Shenzhen factory Our SMT PCB PCBA manufacture: 1. No MOQ for Printed circuit board and SMT DIP pcb assembling. 2

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About this Item

Price

Purchase Qty. Reference FOB Price

1-98 Pieces US$6.00

99-998 Pieces US$4.00

999-9,998 Pieces US$3.00

9,999+ Pieces US$0.50

Sepcifications

Structure Double-Sided Rigid PCB
Dielectric FR-4
Material Polyester Glass Fiber Mat Laminate
Application Consumer Electronics
Flame Retardant Properties V0
Processing Technology Electrolytic Foil
Production Process Semi-Additive Process
Base Material Copper
Insulation Materials Metal Composite Materials
Brand Jingxin
Transport Package Carton Box
Specification 200pcs/CTN
Trademark Customer′ s brand
Origin China

Product Description

Product Description OEM manufacturer electronic PCBA circuit board for refrigerator Shenzhen factory Our SMT PCB PCBA manufacture: 1. No MOQ for Printed circuit board and SMT DIP pcb assembling. 2. One-stop solution for various SMT DIP PCB assembly. 3. Professional PCB Board engineer for ...

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Shenzhen Jingxin Electronic Technology Co., Ltd.

Diamond Member Since 2022

Audited Supplier

Business Type Manufacturer/Factory, Trading Company, Group Corporation
Main Products PCB, PCBA, Print Circuit Board, Flexible Circuit Board, Rigid PCB Assembly, PCB Assembly, Circuit Board, FPC, HDI PCB
Registered Capital 16000000 RMB
Management System Certification ISO 9001, ISO 14000, IATF16949, GMP
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
OEM/ODM Availability Yes

HDI PCB Design Comparison

	Quick View Multi-Layer PCB Fr4 PCB Printed Circuit Board Motherboard PCB Assembly HDI PCB Design PCBA for Electronics Contact Now	3.0mm Aluminum PCB 10oz Copper Tc8w Semiconductor Contact Now	3.0mm Semiconductor Aluminum PCB 12oz Copper Tc4w Contact Now	4L of One Side Aluminum PCB 2W 35um Hal Lf Contact Now	Quick View 16layer 4.8mm Enig Counterbore Hole PCB for Automotive/Driver Information System Contact Now

Transaction Info
	Quick View Multi-Layer PCB Fr4 PCB Printed Circuit Board Motherboard PCB Assembly HDI PCB Design PCBA for Electronics Contact Now	3.0mm Aluminum PCB 10oz Copper Tc8w Semiconductor Contact Now	3.0mm Semiconductor Aluminum PCB 12oz Copper Tc4w Contact Now	4L of One Side Aluminum PCB 2W 35um Hal Lf Contact Now	Quick View 16layer 4.8mm Enig Counterbore Hole PCB for Automotive/Driver Information System Contact Now
Price	US $ 0.50-6.00/ Piece	Negotiable	Negotiable	Negotiable	US $ 2.30-8.90/ Piece
Min Order	1 Pieces	10 Pieces	10 Pieces	10 Pieces	100 Pieces
Trade Terms	-	-	-	-	-
Payment Terms	T/T	L/C, T/T, D/P	L/C, T/T, D/P	L/C, T/T, D/P	T/T, Western Union, Paypal
Quality Control
Management System Certification	ISO 9001, ISO 14000, IATF16949, GMP	ISO 9001	ISO 9001	ISO 9001	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE
Trade Capacity
Export Markets	North America, Eastern Europe, Africa, Mid East, Western Europe	Domestic	Domestic	Domestic	North America, Europe, Southeast Asia/ Mideast
Annual Export Revenue	-	-	-	-	-
Business Model	OEM, ODM, Others	OEM	OEM	OEM	OEM, ODM
Average Lead Time	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)
Product Attributes
Specification	Structure: Double-Sided Rigid PCB; Dielectric: FR-4; Material: Polyester Glass Fiber Mat Laminate; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Semi-Additive Process; Base Material: Copper; Insulation Materials: Metal Composite Materials; Brand: Jingxin;	Structure: Single-Sided Rigid PCB; Base Material: Aluminum; Brand: Dejia;	Structure: Single-Sided Rigid PCB; Base Material: Aluminum; Brand: Dejia;	Structure: Multilayer Rigid PCB; Base Material: Aluminum; Brand: Dejia;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxy Paper Laminate; Application: Communication; Flame Retardant Properties: V0; Processing Technology: Enig; Production Process: Additive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Layer Count: up to 64; Cu Thickness: up to 12oz; Board Thickness: up to 8mm; Min. Hole to Line: 8mil; Surface Finish: Immersiong Gold; Other: Counterbore Hole 8.5mm/Depth 2.35mm;
Supplier Name	Shenzhen Jingxin Electronic Technology Co., Ltd.	Zhejiang Dejia Electronics Technology Co.,Ltd.	Zhejiang Dejia Electronics Technology Co.,Ltd.	Zhejiang Dejia Electronics Technology Co.,Ltd.	Shanghai Gawin Electronic Technology Co., Ltd.
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