Specification |
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Semi-Additive Process;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Board Material: Fr4, H-Tg, It-180A, Cem, Aluminum;
Board Thickness: 0.4-5.0mm;
Solder Mask Color: Green, White, Black, Blue, Yellow, Red, Purple;
Silkscreen Color: Green, White, Black, Blue, Yellow;
Copper Thickness: 0.5-10 Oz;
Layer: 1-60 Layers;
Min. SMD Size: 01005;
Surface Finishing: HASL, Lf HASL, Enig, OSP, Carbon Oil;
Testing: E-Test, Fly Probe Test, Visual Checking,Aoi,X-ray;
MOQ: 1PCS;
Service: Turnkey PCB Assembly Service;
PCBA Test: Aoi, in-Circuit Test (Ict), Functioal Test (Fct);
PCB Max. Board Size: 620*1100mm;
Certificates: UL (E503048),ISO9001/ISO14001/IATF16949/ISO13485;
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Structure: Single/Double-Sided Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Fiber Galss Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0, V1;
Processing Technology: Electrolytic Foil;
Production Process: Additive Process;
Base Material: Epoxy Fiber Galss;
Insulation Materials: Epoxy Resin;
Brand: Hjh;
Sheet Thickness: 0.05-3.5mm;
Copper Thickness: 18um, 35um, 105um, Others;
Color: Yellow;
Market: Euro, Asia, Central and South America;
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Structure: Single-Sided Rigid PCB;
Dielectric: Xpc;
Material: Phenolic Paper Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: HB;
Processing Technology: Electrolytic Foil;
Production Process: Additive Process;
Base Material: Phenolic Paper;
Insulation Materials: Phenolic Resin;
Brand: Hjh;
Sheet Thckness: 0.8-1.6mm;
Copper Thickness: 18um, 25um, 35um, Others;
Color: Brown;
Market: Euro, Asia, Central and South America;
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Structure: Single-Sided Rigid PCB;
Dielectric: FR-1;
Material: Phenolic Paper Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: HB;
Processing Technology: Electrolytic Foil;
Production Process: Additive Process;
Base Material: Phenolic Paper;
Insulation Materials: Phenolic Resin;
Brand: Hjh;
Sheet Thickness: 0.8-1.6mm;
Copper Thickness: 18um, 25um, 35um, Others;
Color: Brown;
Market: Euro, Asia, Central and South America;
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Structure: Flush Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Paper Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Additive Process;
Base Material: Copper ,PP;
Insulation Materials: Epoxy Resin;
Brand: Kb,Shenyi,Rogers,Iteq;
Layer: 1-30 Layers;
Raw Material: Fr-4,Cu Base,High Tg Fr-4,PTFE,Rogers,Teflon etc.;
Board Thickness: 0.20mm-8.00mm;
Board Outline Tolerance: +0.10mm;
Minimum Line/Space: 0.075mm;
Impedance Control Tolerance: +/-10%;
Surface Finish/Treatment: HASL,Enig,Chem,Tin,Flash Gold, OSP, Gold Finger;
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