Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Model: FR-4;
Brand: OEM;
Materials: Fr4, Cem1-3, Aluminum/Copper-Based Materials;
PCB Type: Rigid HDI PCB, Flexible PCB, Rigid-Flexilbe PCB;
Max Size: 640*1100mm;
Layer: 1-32 Layers;
Board Thickness: 0.2mm-8.0mm;
Copper: 18um-210um(6oz);
Surface Treatment: HASL/OSP/Enig/ Immersion Gold/Golden Plated;
PCB Test: Ict Testing and Flying Probe Testing;
PCBA Test: Aoi, X-ray, Ate Test, Function Test, Aging Test;
Qualified: Ipc-a-610c;
Certificates: ISO9001/ISO13485/IATF16949/UL;
Service: PCB Production, Material Procurement, SMT Processi;
Software Supporting: Chip Decryption, Scm Development, Disassembly Modi;
PCB Layer: Rigid PCB up to 30 Layers, FPC up to 8 Layers, Rig;
Profiling Punching: Routing, V-Cut, Beveling, Chamfer;
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Type: Flexible Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Model: PCB;
Board Thickness: 0.21mm to 7.0mm;
Layer: 1 to 28 Layers;
Meterial Type: Fr-4, Cem-1, High Tg, Fr4 Halogen Free, Rogers;
Copper Thickness: 0.5oz to 5oz;
Min Hole Size: 0.2mm;
Min Line Width: 0.075mm;
Min Line Spacing: 0.075mm;
Solder Mask Color: Green.White, Blue, Ect;
Shipping: UPS, FedEx, DHL, Ect;
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Type: Rigid Circuit Board;
Dielectric: Pi Membrane;
Material: Synthetic Fiber;
Flame Retardant Properties: V0;
Mechanical Rigid: Fexible;
Base Material: Pi Membrane;
Insulation Materials: Epoxy Resin;
Surface Finishing: Enig;
Copper Thickness: 35um;
Board Thickness: 1.6mm;
Min. Hole Size: 0.2mm;
Min. Line Wigth: 0.1mm;
Min. Line Spacing: 0.1mm;
Color: Green, White, Yellow, Ect;
Package: Vacuum;
Shipping: UPS, FedEx, DHL, Ect;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Model: PCB;
Copper Thickness: 1oz;
Green Solder Mask: Green;
Surface Finish: HASL-Lead Free;
Board Thickness: 1mm;
Min Hole Size: 0.6mm;
Min Line Width: 4mil;
Min Line Spacing: 4mil;
Surface Finishing: Hal, Immersion Gold, Ect;
Package: Vacuum;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Model: PCB;
Silkscreen: White, Black, Red;
Solder Mask: Green, Yellow, Red, White, Black, Blue;
Surface Finishing: HASL, Lf-Hal, Immerion Tin, Immerion Gold, OSP;
Board Thickness: 0.2-4.0mm;
Copper Thickness: 1oz to 5 Oz;
Min Hole Size: 0.2mm;
Min Line Width: 0.15mm;
Min Line Spacing: 0.15mm;
Layer: 1 to 18;
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