Specification |
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Aluminum Covered Copper Foil Layer;
Application: Consumer Electronics;
Flame Retardant Properties: V1;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: Jxpcba;
Product Type: Custom HDI PCBA;
Service: One-Stop Turnkey;
Applicational: Electronics Device/Home Appliances;
Testing Service: Aoi X-ray Function Test;
Raw Material: Fr4/Cem-1/Cem-3/Fr1/Aluminum;
Board Thickness: 0.2mm-7.0mm;
Layer: 1-32 Layers;
Solder Mask Color: Blue.Green.Red.Black.White.etc;
Surface Finishing: HASL\OSP\Immersion Gold;
Component Packing: Tary, Tube, Tape;
Maximum Plate Thickness Aperture Ratio: 30:1;
Maximum Board Size: 640mm*1100mm;
PCBA Packaging: Static Packaging, Shockproof Packaging, Anti-Drop;
Product Application: Consumer Electronics/Home Appliances/Medical Equip;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: Chenlu;
HASL/Lf Hal: 2.5um;
Layer Counts: 1L-40L;
Copper Weight: 0.5--6 Oz;
Hole Position Tol: ±0.075mm;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: Chenlu;
HASL/Lf Hal: 2.5um;
Layer Counts: 1L-40L;
Copper Weight: 0.5--6 Oz;
Hole Position Tol: ±0.075mm;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Consumer Electronics;
Flame Retardant Properties: 94V0;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Fr4,High Tg Fr4,Aluminum,Rogers,Cem-3,Cem-1 etc;
Insulation Materials: Organic Resin;
Brand: Unice or OEM;
Layer: 1 to 20;
Insulation Material: Organic Resin;
PCB Type: Rigid PCB Circuit Board;
PCBA-Testing: X-ray, Aoi;
Surface Finishing: OSP, Immersion Gold, Gold Plating, Enig, Enepig;
Solder Mask: Green/Black/White/Red/Blue/Yellow/Purple.etc;
Board Thickness: 0.2mm-8mm;
Copper Thickness: 18um-3500um(0.5- 100oz);
PCB Material: Fr-4, Cem-1, Cem-3, Hight Tg, Fr4 Halogen Free;
PCB Shape: Rectangular, Round, Slots, Cutouts, Complex;
PCBA Packaging: ESD Bag+Bubble Wrapped +Carton;
OEM/ODM: Support;
Warranty: 1 Year;
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Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Aluminum Covered Copper Foil Layer;
Application: Consumer Electronics;
Flame Retardant Properties: V2;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: OEM;
Panel Size: 40inch;
Warranty: 1year;
OSD Language: Multi-Language Support;
Installation: Free Stand;
Screen Type: LCD;
Operating System: Android OS;
Color: Black/White/Customered;
Resolution: 1920X1080(FHD);
Brightness: 480 Nits;
Lead Time: 10-25days;
Customized: Customized;
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