PCBA
US$0.325-3.655 / Piece
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Customized Multilayer PCB Circuit Boards PCB Board Design Ai Artificial Intelligence Multilayer pictures & photos
Customized Multilayer PCB Circuit Boards PCB Board Design Ai Artificial Intelligence Multilayer pictures & photos
Customized Multilayer PCB Circuit Boards PCB Board Design Ai Artificial Intelligence Multilayer pictures & photos
Customized Multilayer PCB Circuit Boards PCB Board Design Ai Artificial Intelligence Multilayer pictures & photos
Customized Multilayer PCB Circuit Boards PCB Board Design Ai Artificial Intelligence Multilayer pictures & photos
Customized Multilayer PCB Circuit Boards PCB Board Design Ai Artificial Intelligence Multilayer pictures & photos
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What is Customized Multilayer PCB Circuit Boards PCB Board Design Ai Artificial Intelligence Multilayer

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About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

1-99 Pieces US$3.655

100-999 Pieces US$2.654

1,000-9,999 Pieces US$1.355

10,000+ Pieces US$0.325

Sepcifications

  • Metal Coating Copper
  • Mode of Production SMT
  • Layers Double-Layer
  • Base Material FR-4
  • Certification RoHS
  • Customized Customized
  • Condition New
  • Transport Package Carton
  • Specification 20g
  • Trademark jinxin
  • Origin Shenzhen
  • PCB QA E-Test, Aoi, X-ray, Function Test
  • Sample Date 5-7days
  • Shipment Air, Sea, Express(DHL TNT FedEx EMS UPS
  • Surface Treatment Gold Finger/Hard Gold
  • Board Thickness 0.2-6mm
  • Copper Thickness 0.5-12oz(18-420um)
  • Solder Mask Color Green/Black/White/Red/Blue/Yellow
  • Hole Diameter Min0.05mm
  • Min. Line Width 0.10mm(4mil)
  • Min. Line Spacing 0.10mm(4mil)
  • Test 100% E-Test
  • One Stop Service PCB Assembly, Component Sourcing, Box Building
  • Max. Finished Board Side 1020mm*1000mm
  • MOQ No
  • SMT Machine Siemens Siplace D1/D2 / Siemens Siplace S20/F4

Product Description

... Shenzhen Jingxin Electronic Technology Co.,Ltd. ... Built since 2002, is a almost 20 years professional company dedicating to PCB&PCBA industry. Our factory located in Shenzhen, and have dust-free workshop which cover an area of over than 10000m², almost 550 ...

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Transaction Info
Price US $ 0.325-3.655/ Piece US $ 2/ Piece US $ 2/ Piece US $ 2/ Piece US $ 2/ Piece
Min Order 1 Pieces 1 Pieces 1 Pieces 1 Pieces 1 Pieces
Trade Terms - - - - -
Payment Terms L/C, T/T, D/P, Western Union, Paypal, Money Gram, cash L/C, T/T, Western Union L/C, T/T, Western Union L/C, T/T, Western Union L/C, T/T, Western Union
Quality Control
Product Certification RoHS RoHS, ISO RoHS, ISO RoHS, ISO RoHS, ISO
Management System Certification ISO 9001, ISO 14000, IATF16949, GMP ISO 9001 ISO 9001 ISO 9001 ISO 9001
Trade Capacity
Export Markets North America, Eastern Europe, Africa, Mid East, Western Europe South America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe South America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe South America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe South America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model OEM, ODM, Others OEM OEM OEM OEM
Average Lead Time Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)		 Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)		 Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)		 Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)		 Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Product Attributes
Specification
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Double-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
PCB QA: E-Test, Aoi, X-ray, Function Test;
Sample Date: 5-7days;
Shipment: Air, Sea, Express(DHL TNT FedEx EMS UPS;
Surface Treatment: Gold Finger/Hard Gold;
Board Thickness: 0.2-6mm;
Copper Thickness: 0.5-12oz(18-420um);
Solder Mask Color: Green/Black/White/Red/Blue/Yellow;
Hole Diameter: Min0.05mm;
Min. Line Width: 0.10mm(4mil);
Min. Line Spacing: 0.10mm(4mil);
Test: 100% E-Test;
One Stop Service: PCB Assembly, Component Sourcing, Box Building;
Max. Finished Board Side: 1020mm*1000mm;
MOQ: No;
SMT Machine: Siemens Siplace D1/D2 / Siemens Siplace S20/F4;
Metal Coating: Copper;
Mode of Production: DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Type: Rigid Circuit Board;
Dielectric: Fr-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Insulation Materials: Epoxy Resin;
Processing Technology: Immersion Gold;
Copper Thickness: 3oz -105oz;
Surface Finish: Gold Finger;
Special Technology: Metal Edging;
Special 1: Blind Hole;
Special 2: Buried Vias;
Special 3: Flex-Rigid PCB;
Surface Finish 1: Immersion Gold Immersion Tin Hal Lead Free;
Metal Coating: Copper;
Mode of Production: DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Type: Rigid Circuit Board;
Dielectric: Fr-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Insulation Materials: Epoxy Resin;
Processing Technology: Immersion Gold;
Copper Thickness: 3oz -105oz;
Surface Finish: Gold Finger;
Special Technology: Metal Edging;
Special 1: Blind Hole;
Special 2: Buried Vias;
Special 3: Flex-Rigid PCB;
Surface Finish 1: Immersion Gold Immersion Tin Hal Lead Free;
Metal Coating: Copper;
Mode of Production: DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Type: Rigid Circuit Board;
Dielectric: Fr-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Insulation Materials: Epoxy Resin;
Processing Technology: Immersion Gold;
Copper Thickness: 3oz -105oz;
Surface Finish: Gold Finger;
Special Technology: Metal Edging;
Special 1: Blind Hole;
Special 2: Buried Vias;
Special 3: Flex-Rigid PCB;
Surface Finish 1: Immersion Gold Immersion Tin Hal Lead Free;
Metal Coating: Copper;
Mode of Production: DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Type: Rigid Circuit Board;
Dielectric: Fr-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Insulation Materials: Epoxy Resin;
Processing Technology: Immersion Gold;
Copper Thickness: 3oz -105oz;
Surface Finish: Gold Finger;
Special Technology: Metal Edging;
Special 1: Blind Hole;
Special 2: Buried Vias;
Special 3: Flex-Rigid PCB;
Surface Finish 1: Immersion Gold Immersion Tin Hal Lead Free;
Supplier Name

Shenzhen Jingxin Electronic Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen Hemeixin Electronic Co., Limited

China Supplier - Diamond Member Audited Supplier

Shenzhen Hemeixin Electronic Co., Limited

China Supplier - Diamond Member Audited Supplier

Shenzhen Hemeixin Electronic Co., Limited

China Supplier - Diamond Member Audited Supplier

Shenzhen Hemeixin Electronic Co., Limited

China Supplier - Diamond Member Audited Supplier

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