Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Model: FR-4;
Brand: OEM;
Product Type: Custom HDI PCBA;
Custom HDI PCBA: One-Stop Turnkey;
Application: Electronics Device/Home Appliances;
Testing Service: Aoi X-ray Function Test;
Board Thickness: 0.2mm-7.0mm;
Layer: 1-58layers;
Solder Mask Color: Blue.Green.Red.Black.White.etc;
Surface Finishing: HASL\OSP\Immersion Gold;
MOQ: 1PCS;
Capacity: 1000000PCS Each Month;
Supplier Type: PCB, PCBA, FPC, HDI, Rfpc;
Package: Vacuum Bag+Carton;
Delivery Time: Sample Is Available Within 3days;
Keyword: OEM Contract Manufacturing PCB;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Paper Phenolic Copper Foil Substrate;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Copper Thickness: 1oz;
Surface Finishing: OSP;
Solder Mask Type: Green;
Silkscreen: White;
Board Thickness: 1.6mm;
Min. Hole Size: 0.1mm;
Min. Line Width: 0.075mm;
Min. Line Spacing: 0.075mm;
Certificates: UL, RoHS, SGS, ISO9001;
Shipping: DHL, UPS, TNT, FedEx, etc;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Paper Phenolic Copper Foil Substrate;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Copper Thickness: 1oz;
Surface Finishing: OSP;
Solder Mask Type: Green;
Silkscreen: White;
Board Thickness: 1.6mm;
Min. Hole Size: 0.1mm;
Min. Line Width: 0.075mm;
Min. Line Spacing: 0.075mm;
Certificates: UL, RoHS, SGS, ISO9001;
Shipping: DHL, UPS, TNT, FedEx, etc;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Paper Phenolic Copper Foil Substrate;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Copper Thickness: 1oz;
Surface Finishing: OSP;
Solder Mask Type: Green;
Silkscreen: White;
Board Thickness: 1.6mm;
Min. Hole Size: 0.1mm;
Min. Line Width: 0.075mm;
Min. Line Spacing: 0.075mm;
Certificates: UL, RoHS, SGS, ISO9001;
Shipping: DHL, UPS, TNT, FedEx, etc;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Paper Phenolic Copper Foil Substrate;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Insulation Materials: Epoxy Resin;
Copper Thickness: 1oz;
Surface Finishing: OSP;
Solder Mask Type: Green;
Silkscreen: White;
Board Thickness: 1.6mm;
Min. Hole Size: 0.1mm;
Min. Line Width: 0.075mm;
Min. Line Spacing: 0.075mm;
Certificates: UL, RoHS, SGS, ISO9001;
Shipping: DHL, UPS, TNT, FedEx, etc;
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