Specification |
Type: Rigid Circuit Board;
Flame Retardant Properties: V2;
Dielectric: FR-4;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Processing Technology: Surface Mounted Technolgoy and DIY;
Application: Industry Equipment;
Mechanical Rigid: Rigid;
Material: Paper Phenolic Copper Foil Substrate;
Brand: Jxpcba;
PCBA Material: Fr4, High Tg, Halogen-Free, High Frequency;
Surface Treatment: HASL/Immersion Gold/Immersion Silver/Immersion Tin;
PCB Solder Mask: White, Black, Yellow, Green, Red, Blue;
Component Packing: Tary, Tube, Tape;
Number of Floors: 1-32;
Minimum Line Width/Spacing: 3.0mil;
Maximum Plate Thickness Aperture Ratio: 30:1;
Minimum Mechanical Drilling Aperture: 6mil;
Board Thickness: 0.2mm~6.0mm;
Maximum Board Size: 640mm*1100mm;
PCBA Testing Service: Aoi, Ict, X-ray, Flying Probe Test;
PCBA Packaging: Static Packaging, Shockproof Packaging, Anti-Drop;
Product Application: Consumer Electronics/Home Appliances/Medical Equip;
PCB Silkscreen Color: Black, White, Yellow;
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Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Dielectric: Alumina;
Base Material: Al2O3;
Insulation Materials: Metal Composite Materials;
Processing Technology: Electrolytic Foil;
Application: LED Lighting;
Mechanical Rigid: Rigid;
Material: Ceramics;
Brand: FL;
Board Layer: 1 L;
Copper Thickness: 1 Oz;
Board Thickness: 0.8mm;
Solder Mask: White;
Silkscreen: Black;
Surface Finsihed: Enig;
Test: 100%Test;
MOQ: None;
Lead Time: 10-12 Days;
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Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Dielectric: Alumina;
Base Material: Al2O3;
Insulation Materials: Metal Composite Materials;
Processing Technology: Electrolytic Foil;
Application: LED Lighting;
Mechanical Rigid: Rigid;
Material: Ceramics;
Brand: FL;
Board Layer: 1 L;
Copper Thickness: 1 Oz;
Board Thickness: 0.8mm;
Solder Mask: White;
Silkscreen: Black;
Surface Finsihed: Enig;
Test: 100%Test;
MOQ: None;
Lead Time: 10-12 Days;
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Type: Rigid Circuit Board;
Flame Retardant Properties: V2;
Dielectric: FR-4;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Processing Technology: Electrolytic Foil;
Application: Aerospace;
Mechanical Rigid: Rigid;
Material: Fiberglass Epoxy;
Brand: Fastline;
Board Thickness: 1.6mm;
Copper Thickness: 1oz;
Material Type: Fr4;
Surface Treatment: HASL Lead Free;
Solder Mask: Green, Red, Blue, Black;
Silk Screen Color: White;
Board Layer: 1 Layer;
Shipping Type: DHL, UPS, TNT, EMS, FedEx etc;
Packing Type: Carton + Vacuum;
Lead Time: 5-7 Days;
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Type: Rigid Circuit Board;
Flame Retardant Properties: V2;
Dielectric: FR-4;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Processing Technology: Electrolytic Foil;
Application: Aerospace;
Mechanical Rigid: Rigid;
Material: Fiberglass Epoxy;
Brand: Fastline;
Board Thickness: 1.6mm;
Copper Thickness: 1oz;
Material Type: Fr4;
Surface Treatment: HASL Lead Free;
Solder Mask: Green, Red, Blue, Black;
Silk Screen Color: White;
Board Layer: 10 Layer;
Shipping Type: DHL, UPS, TNT, EMS, FedEx etc;
Packing Type: Carton + Vacuum;
Lead Time: 5-7 Days;
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