Fr4 94V0 RoHS PCBA Prototype PCB Assembly OEM Multilayer Board Circuit PCB for Water Heater Control Circuit Board Video

Name: Fr4 94V0 RoHS PCBA Prototype PCB Assembly OEM Multilayer Board Circuit PCB for Water Heater Control Circuit Board
Uploaded: 2023-07-06T18:50:15+08:00
Description: PCB assembly OEM service Electronic components material purchasing Bare PCB fabrication PCB Assembly Service. (SMT, BGA, DIP) FULL Test: AOI, In-Circuit Test (ICT), Functioal Test (FCT) Cable, Wire-h

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About this Item

Price

Purchase Qty. Reference FOB Price

10-499 Pieces US$2.85

500-999 Pieces US$1.80

1,000-4,999 Pieces US$1.50

5,000+ Pieces US$0.50

Sepcifications

Structure Multilayer Rigid PCB
Dielectric FR-4
Material Polyester Glass Fiber Mat Laminate
Application Consumer Electronics
Flame Retardant Properties HB
Processing Technology Electrolytic Foil
Production Process Subtractive Process
Base Material Copper
Insulation Materials Epoxy Resin
Brand Jxpcba
Transport Package ESD Bag+Bubble Wrapped +Carton
Specification customized PCBA
Trademark jxpcba
Origin China
Materials Fr-4, Cem1, Cem3, Aluminum, Copper
Layer 1-32 Layers
Board Thickness 0.2-8.0mm
PCB Shape Rectangular, Round, Slots, Cutouts, Complex, Irre
Qualified Ipc-a-610 Class 2
Thick Copper 18um-210um(6oz)
Surface Treatment HASL, Enig, Gold Fingers, etc.
PCBA Testing PCB: Ict Testing and Flying Probe Testing, PCBA: a
Offer Service PCBA Prototype, PCBA Debugging, PCBA ODM (Project
PCBA Packaging Static Packaging, Shockproof Packaging, Anti-Drop
Service OEM/ODM, EMS
Certificate ISO9001, IATF 16949, ISO 13485
Profiling Punching Routing,V-Cut, Beveling
PCB Type Rigid PCB, Flexible PCB, Rigid-Flexible PCB
OEM/ODM/EMS PCBA, PCBA Aassembly: SMT & Pth & BGA

Product Description

PCB assembly OEM service Electronic components material purchasing Bare PCB fabrication PCB Assembly Service. (SMT, BGA, DIP) FULL Test: AOI, In-Circuit Test (ICT), Functioal Test (FCT) Cable, Wire-harness assembly,sheet metal,Electrical cabinet Assembly service Conformal coating service ...

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Shenzhen Jingxin Electronic Technology Co., Ltd.

Diamond Member Since 2022

Audited Supplier

Business Type Manufacturer/Factory, Trading Company, Group Corporation
Main Products PCB, PCBA, Print Circuit Board, Flexible Circuit Board, Rigid PCB Assembly, PCB Assembly, Circuit Board, FPC, HDI PCB
Registered Capital 16000000 RMB
Management System Certification ISO 9001, ISO 14000, IATF16949, GMP
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
OEM/ODM Availability Yes

PCBA Comparison

	Fr4 94V0 RoHS PCBA Prototype PCB Assembly OEM Multilayer Board Circuit PCB for Water Heater Control Circuit Board Contact Now	Quick View New Original Electronic Components IC Chips Electronics Murata Uls-5/20-D48n-C Sixteenth-Brick Dosa-Compatible, Isolated DC-DC Converters in Stock Contact Now	Quick View Customized PCB Board Manufacturer High Quality Printed Circuit Board Factory for Electronics Contact Now	China PCB Printed Circuit Board for SMT/EMS/OEM/ODM Multilayer HDI PCB Design for Electronics Contact Now	Quick View PCB Manufacturer PCB Factory 2layers Fr4 Circuit Board Fabricator Contact Now

Transaction Info
	Fr4 94V0 RoHS PCBA Prototype PCB Assembly OEM Multilayer Board Circuit PCB for Water Heater Control Circuit Board Contact Now	Quick View New Original Electronic Components IC Chips Electronics Murata Uls-5/20-D48n-C Sixteenth-Brick Dosa-Compatible, Isolated DC-DC Converters in Stock Contact Now	Quick View Customized PCB Board Manufacturer High Quality Printed Circuit Board Factory for Electronics Contact Now	China PCB Printed Circuit Board for SMT/EMS/OEM/ODM Multilayer HDI PCB Design for Electronics Contact Now	Quick View PCB Manufacturer PCB Factory 2layers Fr4 Circuit Board Fabricator Contact Now
Price	US $ 0.50-2.85/ Piece	US $ 48.60-56.20/ Piece	US $ 0.01-100.00/ Piece	US $ 0.01-50.00/ Piece	US $ 0.01-100.00/ Piece
Min Order	10 Pieces	10 Pieces	1 Pieces	1 Pieces	1 Pieces
Payment Terms	T/T, Western Union, Paypal, Money Gram, Alipay, Alibaba Trade Assurance Order	L/C, T/T, D/P, Western Union, Paypal	L/C, T/T, D/P, Western Union, Paypal, Money Gram, 30 days net	L/C, T/T, D/P, Western Union, Paypal, Money Gram, 30 days net	L/C, T/T, D/P, Western Union, Paypal, Money Gram, 30 days net
Quality Control
Product Certification	ISO9001, IATF 16949, ISO 13485	-	-	-	-
Management System Certification	ISO 9001, ISO 14000, IATF16949, GMP	ISO 9001, ISO 14001	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949
Trade Capacity
Export Markets	North America, Eastern Europe, Africa, Mid East, Western Europe	Eastern Europe, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	US$10 Million - US$50 Million	Above US$100 Million	US$50 Million - US$100 Million	US$50 Million - US$100 Million	US$50 Million - US$100 Million
Business Model	OEM, ODM, IMS service	OEM, ODM, Own Brand(TELEFLY)	OEM	OEM	OEM
Average Lead Time	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays
Product Attributes
Specification	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Polyester Glass Fiber Mat Laminate; Application: Consumer Electronics; Flame Retardant Properties: HB; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Jxpcba; Materials: Fr-4, Cem1, Cem3, Aluminum, Copper; Layer: 1-32 Layers; Board Thickness: 0.2-8.0mm; PCB Shape: Rectangular, Round, Slots, Cutouts, Complex, Irre; Qualified: Ipc-a-610 Class 2; Thick Copper: 18um-210um(6oz); Surface Treatment: HASL, Enig, Gold Fingers, etc.; PCBA Testing: PCB: Ict Testing and Flying Probe Testing, PCBA: a; Offer Service: PCBA Prototype, PCBA Debugging, PCBA ODM (Project; PCBA Packaging: Static Packaging, Shockproof Packaging, Anti-Drop; Service: OEM/ODM, EMS; Profiling Punching: Routing,V-Cut, Beveling; PCB Type: Rigid PCB, Flexible PCB, Rigid-Flexible PCB; OEM/ODM/EMS: PCBA, PCBA Aassembly: SMT & Pth & BGA;	Structure: Refer to The Official Documents; Dielectric: Refer to The Official Documents; Material: Refer to The Official Documents; Application: Communication; Flame Retardant Properties: Refer to The Official Documents; Processing Technology: Refer to The Official Documents; Production Process: Refer to The Official Documents; Base Material: Refer to The Official Documents; Insulation Materials: Refer to The Official Documents; Brand: Murata;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Fr4, Cu Base, High Tg Fr4, PTFE, Rogers; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Organic Resin; Brand: Abis; Minimum Line: 0.075mm; Minimum Space: 0.075mm; Drilling Hole(Mechanical): 0.15mm--6.35mm; Finish Hole(Mechanical): 0.10mm-6.30mm;	Structure: Flush Rigid PCB; Dielectric: FR-4; Material: Polyester Glass Fiber Mat Laminate; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Semi-Additive Process; Base Material: Copper; Insulation Materials: Organic Resin; Brand: Abis; Layer: 1-40 Layers; Raw Material: Fr-4,Cu Base,High Tg Fr-4,PTFE,Rogers,Teflon etc.; Board Thickness: 0.20mm-8.00mm; Board Outline Tolerance: +0.10mm; Impedance Control Tolerance: +/-10%; Minimum Line/Space: 0.075mm; Surface Finish/Treatment: HASL,Enig,Chem,Tin,Flash Gold, OSP, Gold Finger;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Polyester Glass Fiber Mat Laminate; Application: Aerospace; Flame Retardant Properties: V2; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Copper; Insulation Materials: Organic Resin; Brand: Abis; Layer Counts: 1-30 Layers; Board Thickness: 0.20mm-8.00mm; Maximum Size: 600mmx1200mm; Insulation Layer Thickness: 0.075mm--5.00mm; Minimum Line: 0.075mm; Minimum Space: 0.075mm; out Layer Copper Thickness: 18um--350um; Inner Layer Copper Thickness: 17um--175um; Diameter Tolerance(Mechanical): 0.05mm;
Supplier Name	Shenzhen Jingxin Electronic Technology Co., Ltd.	Telefly Telecommunications Equipment Co., Ltd.	Abis Circuits Co., Ltd.	Abis Circuits Co., Ltd.	Abis Circuits Co., Ltd.
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