SMT Processing PCBA
US$2.18 / Piece
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What is Motherboard Circuit PCB SMT Processing PCBA with DIP Technology Electronics Component PCBA

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

10 Pieces US$2.18 / Piece

Sepcifications

  • Structure Multilayer Rigid PCB
  • Dielectric FR-4
  • Material Epoxy Paper Laminate
  • Application Communication
  • Flame Retardant Properties V0
  • Processing Technology Electrolytic Foil
  • Production Process Additive Process
  • Base Material Copper
  • Insulation Materials Epoxy Resin
  • Brand Jxpcba
  • Transport Package Air Bubble Film, Vacuum Package, ESD Bag+Carton
  • Specification custom
  • Trademark JXpcba
  • Origin China
  • MOQ at Least 1piece
  • Delivery Term Fob Shenzhen
  • Payment Term by T/T in Advance
  • Leadtime 15days After Receipt of Your Full Payment
  • Component Packing Tary, Tube, Tape
  • Number of Floors 1-32
  • Minimum Line Width/Spacing 3.0mil
  • Maximum Plate Thickness Aperture Ratio 30:1
  • Minimum Mechanical Drilling Aperture 6mil
  • Board Thickness 0.2mm~6.0mm
  • Maximum Board Size 640mm*1100mm
  • PCBA Test Static Test, Power-on Function Test, Power-on Agin
  • PCBA Packaging Static Packaging, Shockproof Packaging, Anti-Drop

Product Description

Shenzhen Jingxin Electronic Technology Co.,Ltd. Built since 2002, is a almost 20 years professional company dedicating to PCB&PCBA industry. Our factory located in Shenzhen, and have dust-free workshop which cover an area of over than 10000m², almost 550 employees, more than 30 production ...

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SMT Processing PCBA Comparison
Transaction Info
Price US $ 2.18/ Piece US $ 0.19-1.99/ Piece US $ 2.70-2.90/ Piece US $ 99.00-199.00/ Piece US $ 99.00-199.00/ Piece
Min Order 10 Pieces 1 Pieces 1 Pieces 10 Pieces 10 Pieces
Payment Terms T/T, Paypal L/C, T/T, D/P, Western Union, Paypal L/C, T/T, D/P, Western Union, Paypal T/T, Western Union, Paypal T/T, Western Union, Paypal
Quality Control
Management System Certification ISO 9001, ISO 14000, IATF16949, GMP ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, IATF16949, ISO 13485 ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, IATF16949 ISO 9001 ISO 9001
Trade Capacity
Export Markets North America, Eastern Europe, Africa, Mid East, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue US$10 Million - US$50 Million US$5 Million - US$10 Million Above US$100 Million Above US$100 Million Above US$100 Million
Business Model OEM, ODM, IMS service OEM, ODM, Own Brand(Chounmtech) OEM OEM, ODM, Own Brand(Head Sun) OEM, ODM, Own Brand(Head Sun)
Average Lead Time Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: one month
Product Attributes
Specification
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Paper Laminate;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Additive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Jxpcba;
MOQ: at Least 1piece;
Delivery Term: Fob Shenzhen;
Payment Term: by T/T in Advance;
Leadtime: 15days After Receipt of Your Full Payment;
Component Packing: Tary, Tube, Tape;
Number of Floors: 1-32;
Minimum Line Width/Spacing: 3.0mil;
Maximum Plate Thickness Aperture Ratio: 30:1;
Minimum Mechanical Drilling Aperture: 6mil;
Board Thickness: 0.2mm~6.0mm;
Maximum Board Size: 640mm*1100mm;
PCBA Test: Static Test, Power-on Function Test, Power-on Agin;
PCBA Packaging: Static Packaging, Shockproof Packaging, Anti-Drop;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Layer Account: 1-20layer;
Surface Treatment: OSP, Enig, Lf-HASL, Immersion Gold;
Color: Green, Blue, White, Yellow, Black, Red;
PCBA Service: Support;
Structure: Double-Sided Rigid PCB;
Dielectric: FR-4;
Material: Epoxide Woven Glass Fabric Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Ucreate;
Layer Count: 2;
Overall Board Thickness: 2.0mm;
Surface Finish: Hot Air Leveling Lead Free;
Quantity of Couter Sink Holes: 6;
Soldermask Color: White;
Brand of White Oil: Taiyo Psr 4000-Lew3;
Lead Time: 6-7 Working Days;
PCB Testing: E-Testing, Flying Probe Testing;
Ipc Standards: Ipc Class II;
Structure: Metal Base Rigid PCB;
Dielectric: FR-1;
Material: Epoxy Paper Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V2;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Aluminum;
Insulation Materials: Metal Composite Materials;
Brand: Head Sun;
Machine No. 1: Hds Live 7;
Machine No. 2: Hds Live 9;
Machine No. 3: Hds Live 12;
Machine No. 4: Hds Live 16;
Machine No. 5: Hds PRO 16;
Machine No. 6: Hds-7 Carbon;
Machine No. 7: Hds-9 Carbon;
Machine No. 8: Hds-12 Carbon;
Machine No. 9: Hds-16 Carbon;
Machine No. 10: Hds 9 Gen 2 Touch;
Machine No. 11: Hds 9 Gen 3 Touch;
Machine No. 12: Hds 12 Gen 2 Touch;
Machine No. 13: Hds 12 Gen 3 Touch;
Machine No. 14: Hds 8 Insight USA;
Machine No. 15: Hds-8;
Structure: Metal Base Rigid PCB;
Dielectric: FR-1;
Material: Epoxy Paper Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V2;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Aluminum;
Insulation Materials: Metal Composite Materials;
Brand: Head Sun;
Machine No. 1: Hds Live 7;
Machine No. 2: Hds Live 9;
Machine No. 3: Hds Live 12;
Machine No. 4: Hds Live 16;
Machine No. 5: Hds PRO 16;
Machine No. 6: Hds-7 Carbon;
Machine No. 7: Hds-9 Carbon;
Machine No. 8: Hds-12 Carbon;
Machine No. 9: Hds-16 Carbon;
Machine No. 10: Hds 9 Gen 2 Touch;
Machine No. 11: Hds 9 Gen 3 Touch;
Machine No. 12: Hds 12 Gen 2 Touch;
Machine No. 13: Hds 12 Gen 3 Touch;
Machine No. 14: Hds 8 Insight USA;
Machine No. 15: Hds-8;
Supplier Name

Shenzhen Jingxin Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

Canm Technology Co.,Ltd

Gold Member Audited Supplier

Ucreate PCB Co., Ltd.

Diamond Member Audited Supplier

Head Sun Co., Ltd.

Diamond Member Audited Supplier

Head Sun Co., Ltd.

Diamond Member Audited Supplier