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PCB Printed Circuit Board Assembly Fire Alarm Mother Board PCBA PCB pictures & photos

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What is PCB Printed Circuit Board Assembly Fire Alarm Mother Board PCBA PCB

Name: PCB Printed Circuit Board Assembly Fire Alarm Mother Board PCBA PCB
Uploaded: 2024-01-09T09:55:19+08:00
Description: Product Description Specification: PCB layers: 1-24layers PCB materials: CEM1, CEM3, Rogers, FR-4, High Tg FR-4, Aluminum Base, Halogen Free PCB max. board size: 620*1100mm PCB certificate: RoHS Direc

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Price

Purchase Qty. Reference FOB Price

1-99 Pieces US$1.00

100-999 Pieces US$0.60

1,000-9,999 Pieces US$0.20

10,000+ Pieces US$0.10

Sepcifications

Type Rigid Circuit Board
Dielectric FR-4
Material Fiberglass Epoxy
Flame Retardant Properties V2
Mechanical Rigid Rigid
Processing Technology Electrolytic Foil
Base Material Copper
Insulation Materials Organic Resin
Model FR-4
Brand OEM
Transport Package Carton Box
Specification 500 PCS/CTN
Trademark Customer′s brand
Origin China
PCB Thickness 1.0mm
PCB Mask Green
PCB Silkscreen White
PCB Materials Fr4
PCB High Tg 170tg
PCB Surface Enig
PCB Type Rigid PCB
PCB Manufacturer Jx China
PCBA PCB Assembly
Mini Size Components 01005
IC Type BGA
IC Qfn
SMT High Speed Module
DIP Automatic
Test Function Testing 100%

Product Description

Product Description Specification: PCB layers: 1-24layers PCB materials: CEM1, CEM3, Rogers, FR-4, High Tg FR-4, Aluminum Base, Halogen Free PCB max. board size: 620*1100mm PCB certificate: RoHS Directive-Compliant PCB Thickness: 1.6 ±0.1mm Out Layer Copper Thickness: 0.5-5oz ...

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Shenzhen Jingxin Electronic Technology Co., Ltd.

Diamond Member Since 2022

Audited Supplier

Business Type Manufacturer/Factory, Trading Company, Group Corporation
Main Products PCB, PCBA, Print Circuit Board, Flexible Circuit Board, Rigid PCB Assembly, PCB Assembly, Circuit Board, FPC, HDI PCB
Registered Capital 16000000 RMB
Management System Certification ISO 9001, ISO 14000, IATF16949, GMP
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
OEM/ODM Availability Yes

PCB Comparison

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Transaction Info
	Quick View PCB Printed Circuit Board Assembly Fire Alarm Mother Board PCBA PCB Contact Now	Quick View Professional PCBA & PCB Circuit Board for Hot Swap Keyboard RGB with UL Contact Now	Quick View High Quality PCBA & PCB Circuit Board for Gold Plating PCB with ISO16949 Contact Now	Quick View High Quality PCBA & PCB Circuit Board for Hot Swap Keyboard RGB with ISO16949 Contact Now	Quick View Customized PCBA & PCB Circuit Board for Hot Swap Keyboard RGB with ISO16949 Contact Now
Price	US $ 0.10-1.00/ Piece	US $ 0.10-100.00/ Piece	US $ 0.10-100.00/ Piece	US $ 0.10-100.00/ Piece	US $ 0.10-100.00/ Piece
Min Order	1 Pieces	10 Pieces	10 Pieces	10 Pieces	10 Pieces
Trade Terms	-	-	-	-	-
Payment Terms	L/C, T/T, D/P, Western Union, Paypal, Money Gram, Cash	L/C, T/T, D/P	L/C, T/T, D/P	L/C, T/T, D/P	L/C, T/T, D/P
Quality Control
Product Certification	-	RoHS, UL, ISO	RoHS, UL, ISO	RoHS, UL, ISO	RoHS, UL, ISO
Management System Certification	ISO 9001, ISO 14000, IATF16949, GMP	-	-	-	-
Trade Capacity
Export Markets	North America, Eastern Europe, Africa, Mid East, Western Europe	South America, Europe, Southeast Asia/ Mideast, Africa, Domestic	South America, Europe, Southeast Asia/ Mideast, Africa, Domestic	South America, Europe, Southeast Asia/ Mideast, Africa, Domestic	South America, Europe, Southeast Asia/ Mideast, Africa, Domestic
Annual Export Revenue	-	-	-	-	-
Business Model	OEM, ODM, Others	-	-	-	-
Average Lead Time	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	-	-	-	-
Product Attributes
Specification	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Flame Retardant Properties: V2; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Organic Resin; Model: FR-4; Brand: OEM; PCB Thickness: 1.0mm; PCB Mask: Green; PCB Silkscreen: White; PCB Materials: Fr4; PCB High Tg: 170tg; PCB Surface: Enig; PCB Type: Rigid PCB; PCB Manufacturer: Jx China; PCBA: PCB Assembly; Mini Size Components: 01005; IC Type: BGA; IC: Qfn; SMT: High Speed Module; DIP: Automatic; Test: Function Testing 100%;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Test: 100% E-Test; Surface Treatment: 100% Tin; Board Thickness: 0.2-6mm; One Stop Service: PCB Assembly, Component Sourcing, Box Building; Solder Mask: Green; Layers: 1-36 Layers; Copper Thickness: 0.5-12oz(18-420um); a Special Process: Carbon Film Printing;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Test: 100% E-Test; Surface Treatment: 100% Tin; Board Thickness: 0.2-6mm; One Stop Service: PCB Assembly, Component Sourcing, Box Building; Solder Mask: Green; Layers: 1-36 Layers; Copper Thickness: 0.5-12oz(18-420um); a Special Process: Carbon Film Printing;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Test: 100% E-Test; Surface Treatment: 100% Tin; Board Thickness: 0.2-6mm; One Stop Service: PCB Assembly, Component Sourcing, Box Building; Solder Mask: Green; Layers: 1-36 Layers; Copper Thickness: 0.5-12oz(18-420um); a Special Process: Carbon Film Printing;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Test: 100% E-Test; Surface Treatment: 100% Tin; Board Thickness: 0.2-6mm; One Stop Service: PCB Assembly, Component Sourcing, Box Building; Solder Mask: Green; Layers: 1-36 Layers; Copper Thickness: 0.5-12oz(18-420um); a Special Process: Carbon Film Printing;
Supplier Name	Shenzhen Jingxin Electronic Technology Co., Ltd.	Wenzhou Yongli Electronics Co, . Ltd	Wenzhou Yongli Electronics Co, . Ltd	Wenzhou Yongli Electronics Co, . Ltd	Wenzhou Yongli Electronics Co, . Ltd
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