High Quality Customizable Multilayer FPC OEM/ODM Shenzhen Flexible Assembly Board Flex PCB

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

1-999 Pieces US$3.80

1,000+ Pieces US$0.60

Sepcifications

  • Structure Multilayer FPC
  • Material Polyimide
  • Combination Mode Adhesive Flexible Plate
  • Application Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace
  • Flame Retardant Properties V0
  • Base Material Copper
  • Insulation Materials King Field
  • Transport Package Strong and Secure/Plastic Bag/Foam Bag/Vacuum Pack
  • Specification Customizable
  • Trademark OEM/ODM
  • Origin Shenzhen
  • MOQ 1
  • Service OEM, ODM
  • Certificates UL, RoHS, SGS, ISO9001, ISO14000
  • Solder Mask Color Green/Black/White/Blue/Yellow/Red

Product Description

Technical capability Items Flex Rigid Rigid-flex Material Flex Lead-free,Halogen-free,H-Tg,Low loss FR-4,FPC High-frequency Layers 1-6L 1-40L 1-40L Max cut lamination size 500*400mm Min3*3mm-Max1200mm 500*420mm Final board thickness (2L)0.07mm-0.2mm 0.18-5.0mm 0.20-6.0mm Min ...

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Circuit Board Comparison
Transaction Info
Price US $ 0.60-3.80/ Piece US $ 0.50-5.50/ Piece US $ 0.04/ Piece US $ 0.04/ Piece US $ 0.45-0.65/ Piece
Min Order 1 Pieces 1 Pieces 100 Pieces 100 Pieces 1 Pieces
Trade Terms - - - - -
Payment Terms L/C, T/T, D/P, Western Union, Paypal, WeChat/Alipay L/C, T/T, D/P, Western Union, Paypal T/T, Western Union T/T, Western Union L/C, T/T, D/P, Western Union, Paypal, Money Gram
Quality Control
Management System Certification ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, ISO 14064 ISO 9001, ISO 14001, ISO 14064 ISO 9001, ISO 14001, IATF16949
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model OEM, ODM OEM, Own Brand OEM, ODM OEM, ODM OEM, Own Brand
Average Lead Time Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: 1 Month(s)
Off-season: within 15 Day(s)
Peak-season: 1 Month(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Product Attributes
Specification
Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Flame Retardant Properties: V0;
Base Material: Copper;
Insulation Materials: King Field;
MOQ: 1;
Service: OEM, ODM;
Certificates: UL, RoHS, SGS, ISO9001, ISO14000;
Solder Mask Color: Green/Black/White/Blue/Yellow/Red;
Structure: Double-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V2;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Type: Flexible Printed Circuits Board;
Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Xtz;
Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Xtz;
Structure: Double-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Brand: Not Specified;
Min. Hole Size: 0.2mm;
Min. Line Width&Spacing: 3mil/4mil;
Certificates: UL, RoHS, SGS, ISO9001 ISO14000;
Shipping: DHL, UPS, TNT, FedEx, etc;
Supplier Name

King Field Electronic Co., Ltd. (Shenzhen)

China Supplier - Diamond Member Audited Supplier

Keep Moving Circuits Co., Ltd.

China Supplier - Diamond Member Audited Supplier

SHENZHEN XIANGTIANZHONG TECHNOLOGY CO., LTD.

China Supplier - Gold Member Audited Supplier

SHENZHEN XIANGTIANZHONG TECHNOLOGY CO., LTD.

China Supplier - Gold Member Audited Supplier

Keep Moving Circuits Co., Ltd.

China Supplier - Diamond Member Audited Supplier