Specification |
Metal Coating: Silver;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Solder Mask Colour: Green, Blue, White, Black, Yellow, Red etc;
Application Field: LED, Medical, Industrial, Control Board;
Assembly Modes: SMT, DIP, Through Hole;
Surface Finish: HASL, Enig, OSP, Gold Finger;
Needed: Gerber File, Bom List, Sample If Better;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Double-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Copper Weight: 18um, 25um, 35um, 70um;
Surface Treatment: OSP/HASL/Lf HASL/Enig/Imm Tin etc;
Soldermask Color: White, Black, Green, Blue etc.;
Finished Thickness: 0.8~1.6mm;
Waveform: Pure Sine Wave;
Input Voltage: 12V/24V/36V/48V;
Output Voltage: 110V/220V;
Frequency: 50Hz/60Hz;
Communication: R485/R232/Can;
LCD Display: Optional;
Dimension: Customizable;
Power: Customizable;
Charging Current: Customizable;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Double-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Copper Weight: 18um, 25um, 35um, 70um;
Surface Treatment: OSP/HASL/Lf HASL/Enig/Imm Tin etc;
Soldermask Color: White, Black, Green, Blue etc.;
Finished Thickness: 0.8~1.6mm;
Waveform: Pure Sine Wave;
Input Voltage: 12V/24V/36V/48V;
Output Voltage: 110V/220V;
Frequency: 50Hz/60Hz;
Communication: R485/R232/Can;
LCD Display: Optional;
Dimension: Customizable;
Power: Customizable;
Charging Current: Customizable;
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Metal Coating: Copper;
Mode of Production: DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Type: Rigid Circuit Board;
Dielectric: Fr-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Insulation Materials: Epoxy Resin;
Processing Technology: Immersion Gold;
Copper Thickness: 3oz -105oz;
Surface Finish: Gold Finger;
Special Technology: Metal Edging;
Special 1: Blind Hole;
Special 2: Buried Vias;
Special 3: Flex-Rigid PCB;
Surface Finish 1: Immersion Gold Immersion Tin Hal Lead Free;
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Metal Coating: Copper;
Mode of Production: DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Type: Rigid Circuit Board;
Dielectric: Fr-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Insulation Materials: Epoxy Resin;
Processing Technology: Immersion Gold;
Copper Thickness: 3oz -105oz;
Surface Finish: Gold Finger;
Special Technology: Metal Edging;
Special 1: Blind Hole;
Special 2: Buried Vias;
Special 3: Flex-Rigid PCB;
Surface Finish 1: Immersion Gold Immersion Tin Hal Lead Free;
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