Specification |
Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Flame Retardant Properties: V0;
Base Material: Copper, King Field;
Insulation Materials: Organic Resin;
MOQ: 1;
Service: OEM, ODM;
Certificates: UL, RoHS, SGS, ISO9001, ISO14000;
Solder Mask Color: Green/Black/White/Blue/Yellow/Red;
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Structure: Single-Sided FPC;
Material: Polyimide;
Combination Mode: Without Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Anisotropic Conductive Adhesive;
Flame Retardant Properties: V1;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: 1;
PCB Layer: 2- Layer;
Min. Line Width/Space: 0.2mm;
Board Thickness: 1.0mm;
Min. Hole Size: 0.3mm;
Surface Finishing: Tin;
Test: E-Testing; Flying Probe Testing;
Silkscreen: White;
Solder Mask Type: Gold;
External Copper Thickness: 1oz;
Interior Copper Thickness: 1/2oz and 1/3oz;
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Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Xtz;
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Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Xtz;
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Structure: Single-Sided FPC;
Material: Polyimide;
Combination Mode: Without Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace, Aviation and Aerospace,Consumer Electronics;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Polyimide;
Insulation Materials: Epoxy Resin;
Brand: Finestpcb;
TPE: FPC, FPCB, Flexible PCB;
Copper Thickness: 1oz / 1/2 O Z/ 1/3 Oz, 1oz;
Min. Line Width: 0.04mm;
Min. Hole Size: 0.1mm;
Min. Line Spacing: 0.04mm;
Board Size: Ustom;
Product Name: Flexible Printed Circuit Board;
Service: OEM Flex PCB Boards Services;
Solder Mask: Green. Red. Blue. White. Black;
Keyword: 1-4 Layer Flexible Circuit PCB;
Surface Treatment: Immersion Gold/OSP/Immersion Silver/Immersion Tin;
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