Fr4 T0.4-3.2mm PCB Board
Negotiable
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What is 2 Layer Fr4 T0.4-3.2mm Immersion Gold PCB Board

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece Negotiable

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Fiberglass Epoxy
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Copper
  • Insulation Materials Epoxy Resin
  • Model PCB
  • Brand Not Specified
  • Transport Package by Vacuum Packing in Cartons
  • Trademark KMC
  • Origin Shengzhen
  • Copper Thickness 1oz-5oz
  • Min. Hole Size 0.2mm
  • Min. Line Spacing 4mil
  • Min. Line Width 3mil
  • Certificates UL, RoHS, SGS, ISO9001 ISO14000
  • Shipping DHL, UPS, TNT, FedEx, etc

Product Description

KEEP MOVING CIRCUITS CO., LTD was founded in August, 2000 a hi-tech enterprise, specializes in manufacture ,supply and export of high precision 1 layer ,2layer and multilayer PCB. Since Jan.2014,the core business are Multilayer(including HDI) middle up to high volume PCB orders ,High Frenquency ...

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Fr4 T0.4-3.2mm PCB Board Comparison
Transaction Info
Price Negotiable US $ 0.10-100.00/ Piece US $ 0.10-100.00/ Piece US $ 0.10-100.00/ Piece US $ 0.10-100.00/ Piece
Min Order 1 Pieces 10 Pieces 10 Pieces 10 Pieces 10 Pieces
Trade Terms - - - - -
Payment Terms L/C, T/T, D/P, Western Union, Paypal, Money Gram L/C, T/T, D/P L/C, T/T, D/P L/C, T/T, D/P L/C, T/T, D/P
Quality Control
Product Certification - RoHS, UL, ISO RoHS, UL, ISO RoHS, UL, ISO RoHS, UL, ISO
Management System Certification ISO 9001, ISO 14001, IATF16949 - - - -
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Oceania, Mid East, Eastern Asia, Western Europe South America, Europe, Southeast Asia/ Mideast, Africa, Domestic South America, Europe, Southeast Asia/ Mideast, Africa, Domestic South America, Europe, Southeast Asia/ Mideast, Africa, Domestic South America, Europe, Southeast Asia/ Mideast, Africa, Domestic
Annual Export Revenue - - - - -
Business Model OEM, Own Brand - - - -
Average Lead Time Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
- - - -
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Model: PCB;
Brand: Not Specified;
Copper Thickness: 1oz-5oz;
Min. Hole Size: 0.2mm;
Min. Line Spacing: 4mil;
Min. Line Width: 3mil;
Certificates: UL, RoHS, SGS, ISO9001 ISO14000;
Shipping: DHL, UPS, TNT, FedEx, etc;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Test: 100% E-Test;
Surface Treatment: 100% Tin;
Board Thickness: 0.2-6mm;
One Stop Service: PCB Assembly, Component Sourcing, Box Building;
Solder Mask: Green;
Layers: 1-36 Layers;
Copper Thickness: 0.5-12oz(18-420um);
a Special Process: Carbon Film Printing;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Test: 100% E-Test;
Surface Treatment: 100% Tin;
Board Thickness: 0.2-6mm;
One Stop Service: PCB Assembly, Component Sourcing, Box Building;
Solder Mask: Green;
Layers: 1-36 Layers;
Copper Thickness: 0.5-12oz(18-420um);
a Special Process: Carbon Film Printing;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Test: 100% E-Test;
Surface Treatment: 100% Tin;
Board Thickness: 0.2-6mm;
One Stop Service: PCB Assembly, Component Sourcing, Box Building;
Solder Mask: Green;
Layers: 1-36 Layers;
Copper Thickness: 0.5-12oz(18-420um);
a Special Process: Carbon Film Printing;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Test: 100% E-Test;
Surface Treatment: 100% Tin;
Board Thickness: 0.2-6mm;
One Stop Service: PCB Assembly, Component Sourcing, Box Building;
Solder Mask: Green;
Layers: 1-36 Layers;
Copper Thickness: 0.5-12oz(18-420um);
a Special Process: Carbon Film Printing;
Supplier Name

Keep Moving Circuits Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Wenzhou Yongli Electronics Co, . Ltd

China Supplier - Diamond Member Audited Supplier

Wenzhou Yongli Electronics Co, . Ltd

China Supplier - Diamond Member Audited Supplier

Wenzhou Yongli Electronics Co, . Ltd

China Supplier - Diamond Member Audited Supplier

Wenzhou Yongli Electronics Co, . Ltd

China Supplier - Diamond Member Audited Supplier