Specification |
Insulation Materials: Epoxy Resin;
Flame Retardant Properties: V0;
Application: Consumer Electronics;
Min. Hole Size: 0.2mm;
Min. Line Width&Spacing: 3mil/4mil;
Certificates: UL, RoHS, SGS, ISO9001 ISO14000;
Shipping: DHL, UPS, TNT, FedEx, etc;
Soldermask: Green, Blue, White, Black, Yellow, Red;
Silkscreen: White, Black;
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Insulation Materials: Organic Resin;
Flame Retardant Properties: V0;
Application: Medical Device;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Conductive Adhesive: Conductive Silver Paste;
Processing Technology: Enig;
Base Material: Fr4+Pi+Nfpp;
Structure: Multilayer PCB+FPC;
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Insulation Materials: Organic Resin;
Flame Retardant Properties: V0;
Application: Medical Instruments;
Blind Vias: 0.1mm;
Buried Vias: 0.1mm;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Conductive Adhesive: Conductive Silver Paste;
Processing Technology: Enig;
Base Material: Fr4+Pi+Nfpp;
Structure: Multilayer PCB+FPC;
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Insulation Materials: Organic Resin;
Flame Retardant Properties: V0;
Application: Steamship;
Blind Vias: 0.1mm;
Buried Vias: 0.1mm;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Conductive Adhesive: Conductive Silver Paste;
Processing Technology: Enig;
Base Material: Fr4+Pi+Nfpp;
Structure: Multilayer PCB+FPC;
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Insulation Materials: Organic Resin;
Flame Retardant Properties: V0;
Application: Test Equipment;
Blind Vias: 0.1mm;
Buried Vias: 0.1mm;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Conductive Adhesive: Conductive Silver Paste;
Processing Technology: Enig;
Base Material: Fr4+Pi+Nfpp;
Structure: Multilayer PCB+FPC;
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