Electronic Components Welding Machine PCB Boards PCB for System Board

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$0.50-0.75 / Piece

Sepcifications

  • Dielectric FR-4
  • Transport Package by Vacuum Packing in Cartons
  • Specification FR-4 200mmx75mm PCB Assembly
  • Material Type Fr4, High Tg, Cem1, Cem3, Aluminiaum Base, Arlon, Roger
  • Layer Counts 1--30
  • Board Thickness 0.2mm--6.0mm
  • Fished Outer Copper 1oz--5oz
  • Minimum Trace Width 0.003′′
  • Surface Treatment Type HASL;HASL+Lead Free;Immersion Gold; Immersion Tin;

Product Description

Company Presentation KEEP MOVING CIRCUITS CO., LTD(KMC) was founded in August, 2000, a hi-tech group enterprise now, Shen Zhen factory is located at Fuyong Town, Bao'an District,mainly produce sample and quick-turn up to middle volume PCB orders. Since 2011, for supporting all customers better ...

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PCB Boards Comparison
Transaction Info
Price US $ 0.50-0.75/ Piece US $ 1.35-2.16/ Piece US $ 0.70-5.00/ Piece US $ 1.28-1.76/ Piece US $ 0.95-1.33/ PCS
Min Order 1 Pieces 1 Pieces 10 Pieces 1 Pieces 1 PCS
Payment Terms L/C, T/T, D/P, Western Union, Paypal L/C, T/T, Paypal T/T, D/P, Paypal, Money Gram L/C, T/T, Western Union, Paypal L/C, T/T, Paypal
Quality Control
Product Certification - - RoHS, CCC, ISO - -
Management System Certification ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, IATF16949 ISO 9001, IATF16949, ISO 13485 ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, IATF16949 ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, IATF16949
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe North America, Eastern Europe, Southeast Asia, Africa, Oceania, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe
Annual Export Revenue US$10 Million - US$50 Million Above US$100 Million US$10 Million - US$50 Million Above US$100 Million Above US$100 Million
Business Model OEM, ODM, Own Brand(KMC) OEM OEM, ODM OEM OEM
Average Lead Time Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: one month
Peak Season Lead Time: 1-3 months
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Product Attributes
Specification
Dielectric: FR-4;
Material Type: Fr4, High Tg, Cem1, Cem3, Aluminiaum Base, Arlon, Roger;
Layer Counts: 1--30;
Board Thickness: 0.2mm--6.0mm;
Fished Outer Copper: 1oz--5oz;
Minimum Trace Width: 0.003'';
Surface Treatment Type: HASL;HASL+Lead Free;Immersion Gold; Immersion Tin;;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Computer;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: UC;
Layer: 8;
Via: 1+6+1;
Copper: 1/3 Oz;
Surface: Enig;
Type: Customized;
Dielectric: FR-4;
Material: Aluminum Covered Copper Foil Layer;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Customized;
Processing Technology: Customized;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: OEM/ODM;
PCBA-Testing: X-ray, Aoi;
Processing: Electrolytic Foil;
SMT Capacity: >2 Million Points/Day;
DIP Capacity: >100K Parts/Day;
Min. Space of BGA: +/- 0.3mm;
Min.Pin Space of IC: 0.3mm;
Max.Precision of IC Assembly: 0.03mm;
Surface Finishing: Lead-Free HASL;
Number of Layers: 4-10 Layer;
Board Thickness: 1.6mm;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: UC;
Board Layer: 6;
Board Thickness: 1.6mm;
Soldermask Color: Green;
Surface Finish: Enig/3u'';
Specialities: BGA;
Base Material Type: Fr4;
Ipc Standards: Ipc Class II;
PCB Testing: E-Testing, Flying Probe Testing;
Lead Time: 8 Working Days;
Fast Turn: 3 Working Days;
Type: Flex-Rigid PCB;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Flex-Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: UC;
Surface Finihsing: Immersion Gold;
Board Thickness: 1.6mm;
Lead Time: 6-8 Working Days;
Supplier Name

Keep Moving Circuits Co., Ltd.

Diamond Member Audited Supplier

Ucreate PCB Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Hongzhou Smart Technology Co., Ltd.

Diamond Member Audited Supplier

Ucreate PCB Co., Ltd.

Diamond Member Audited Supplier

Ucreate PCB Co., Ltd.

Diamond Member Audited Supplier