10 Layer PCB
US$6.50-7.80 / Piece
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What is Immersion Gold Rigid 10 Layers HDI PCB with Impedance Control

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$6.50-7.80 / Piece

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Fiberglass Epoxy
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Base Material Copper
  • Insulation Materials Organic Resin
  • Transport Package by Vacuum Packing in Cartons
  • Trademark KMC
  • Origin Shenzhen
  • Min. Hole Size 0.2mm
  • Min. Line Width&Spacing 0.1mm/0.1mm
  • Solder Mask Color Green/Black/White/Blue/Yellow/Red
  • Certificates UL, RoHS, SGS, ISO9001 ISO14000
  • Shipping DHL, UPS, TNT, FedEx, etc

Product Description

KEEP MOVING CIRCUITS CO., LTD was founded in August, 2000 a hi-tech enterprise, specializes in manufacture ,supply and export of high precision 1 layer ,2layer and multilayer PCB. Since Jan.2014,the core business are Multilayer(including HDI) middle up to high volume PCB orders ,High Frenquency ...

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10 Layer PCB Comparison
Transaction Info
Price US $ 6.50-7.80/ Piece US $ 4.80-5.00/ Piece US $ 0.15-9.98/ Piece US $ 10.00-18.00/ Piece US $ 0.15-9.98/ Piece
Min Order 1 Pieces 10 Pieces 1 Pieces 1 Pieces 1 Pieces
Trade Terms - - - - -
Payment Terms L/C, T/T, D/P, Western Union, Paypal, Money Gram T/T L/C, T/T, D/P, Western Union, Paypal, Money Gram T/T, Western Union, Paypal, Money Gram, Cash L/C, T/T, D/P, Western Union, Paypal, Money Gram
Quality Control
Product Certification - - - ISO, RoHS, Reach, UL, CQC -
Management System Certification ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 - ISO 9001, ISO 14001, IATF16949 -
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Oceania, Mid East, Eastern Asia, Western Europe - - North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia, Domestic -
Annual Export Revenue - - - - -
Business Model OEM, Own Brand OEM, ODM OEM, ODM OEM, ODM, Own Brand OEM, ODM
Average Lead Time Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
- - Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
-
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Base Material: Copper;
Insulation Materials: Organic Resin;
Min. Hole Size: 0.2mm;
Min. Line Width&Spacing: 0.1mm/0.1mm;
Solder Mask Color: Green/Black/White/Blue/Yellow/Red;
Certificates: UL, RoHS, SGS, ISO9001 ISO14000;
Shipping: DHL, UPS, TNT, FedEx, etc;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Shengyi, Kb, Nanya, Ilm;
Criteria: Aql II 0.65;
Hole Sizes: 0.15mm/0.2mm;
Bevel Edge: Yes;
Impedance: 50/90/100 Ohm;
Trace Width(Min.): 3mil;
Surfaec Treatment: Immersion Gold;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: Chenlu;
Min Annular Ring: 0.05mm/0.05mm;
Layer Counts: 1L-40L;
HASL/Lf Hal: 2.5um;
Copper Weight: 0.5--6 Oz;
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Aluminum Covered Copper Foil Layer;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: Unice;
Copper Thickness: H/H0z-5/50z;
Board Thickness: 0.3mm - 3.2mm;
Surface Finishing: OSP,Immersion Gold,Immersion Tin,Immersion AG;
Maximum Layer: 20;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: Chenlu;
Min Annular Ring: 0.05mm/0.05mm;
Layer Counts: 1L-40L;
HASL/Lf Hal: 2.5um;
Copper Weight: 0.5--6 Oz;
Supplier Name

Keep Moving Circuits Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen Xinmanda Printed Circuit Board Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Dongguan Chenlu Electronics Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Jian Unice Pcb Technique Co., Ltd

China Supplier - Gold Member Audited Supplier

Dongguan Chenlu Electronics Co., Ltd.

China Supplier - Diamond Member Audited Supplier